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Inspection Equipment Product List and Ranking from 959 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated: Aggregation Period:Aug 19, 2026~Sep 15, 2026
This ranking is based on the number of page views on our site.

Inspection Equipment Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Aug 19, 2026~Sep 15, 2026
This ranking is based on the number of page views on our site.

  1. null/null
  2. 日本レーザー Tokyo//Electronic Components and Semiconductors
  3. タイムワールド Tokyo//others
  4. 4 ニデックアドバンステクノロジー 本社、東京営業所、名古屋営業所 Kyoto//Industrial Machinery
  5. 5 UHTテクノロジー Aichi//Other manufacturing

Inspection Equipment Product ranking

Last Updated: Aggregation Period:Aug 19, 2026~Sep 15, 2026
This ranking is based on the number of page views on our site.

  1. Pellet and Powder Foreign Matter Inspection Device - High-Speed Evaluation of Particle Size, Color, and Shape 日本レーザー
  2. 気密検査装置(リークテスト装置) UHTテクノロジー
  3. Pressure-type seal inspection machine アイテックスズヨ
  4. 4 DORNIER RepRap Loom
  5. 5 Ultrasound scanning device エヌ・ケイ・システム

Inspection Equipment Product List

1651~1680 item / All 2914 items

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Wireless Laser Distance Meter Center Indicator 'LM-30 Series'

Wireless laser center indicator with rangefinder for easy center alignment at high or distant locations.

The "LM-30 Series" is a wireless laser center indicator equipped with a distance measuring device that instantly measures and displays the distance to the inspection target, such as a wall, using a built-in ultrasonic distance meter. It reliably indicates the center of the irradiation field with a clear cross marker from a high-brightness line laser. Since it does not obstruct the irradiation port of the X-ray generator, there is no need to fold the indicator rod. Additionally, it makes centering at high places or distant locations easy. During work around the X-ray generator, direct operation can be performed with the main unit switch. 【Features】 - Reliably indicates the center of the irradiation field - Does not obstruct the irradiation port of the X-ray generator - No need to fold the indicator rod - Wireless, eliminating cumbersome tasks - Easy centering at high places or distant locations *For more details, please refer to the PDF document or feel free to contact us.

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Non-contact laser ultrasonic visualization inspection device "LUVI-LLS"

It is a laser ultrasonic visualization inspection device that can perform inspections completely non-contact while visualizing ultrasonic waves.

The Laser Ultrasonic Visualization Inspection Device LUVI-LLS enables completely non-contact and non-destructive testing through the combination of a laser vibrometer. It allows for reproducible measurements that are not affected by the adhesive state of the sensors, without directly touching the object being measured. Additionally, it can measure regardless of surface conditions or size, from complex shapes and high-temperature surfaces to large structures such as bridges and airplanes. 【Features】 - On-site defect detection while visualizing ultrasound - Visualization possible even for ultrasound propagating through complex-shaped objects - Wide-area and rapid visualization inspection available - High-speed scanning by combining laser and galvanometer scanner - No troublesome optical adjustments required 【Main Applications】 Defect inspection of welds in narrow spaces, online inspection during 3D printing, elucidation of wave propagation mechanisms, performance evaluation of ultrasonic transducers, material evaluation, etc.

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Laser Ultrasonic Visualization Inspection Device "LUVI-LC1"

Easy to operate! A laser ultrasonic visualization inspection device that makes it easy for one person to move on-site!

The "LUVI-LC1" is an optimal laser ultrasonic visualization inspection device for detecting cracks, corrosion, and voids in metals, ceramics, resins, and composite materials. Its excellent operability allows for field inspections to be conducted by a single person. Being a compact device, it can also perform tabletop inspections when the rack is removed. 【Features】Ultrasound can be viewed in video format, compact, high-speed scanning 【Main Applications】 Inspection of cracks, corrosion, pores, interlayer delamination, and damage in complex shapes, curved surfaces, uneven areas, and narrow spaces in metals, ceramics, resins, and composite materials. *For more details, please refer to the catalog or feel free to contact us.

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Tabletop small X-ray inspection device (TXR-C1R120PS-01)

This is a compact X-ray inspection device developed by applying the technology of AA battery-operated small X-ray systems in combination with a high-sensitivity, high-resolution flat panel detector.

This compact X-ray inspection device consists of an X-ray generation unit and an inspection housing. The housing size is 270X270X180mm, and it weighs 20kg, making it portable for one person. It can inspect various objects, expanding the range of items that can be examined. In fact, the housing is designed to accommodate objects up to 260mm in width, 80mm in depth, and 170mm in height. It is equipped with a flat panel detector inside the housing, and a PC is used for operating the device and displaying images. The X-ray generation unit allows for adjustments to the shooting conditions such as tube voltage, pulse width, and number of pulses via the control panel on the front. When the X-ray generation unit and the housing for the objects are integrated, the entire system is shielded with lead, limiting X-ray leakage to below 0.6μSv/h. This enables X-ray inspections to be conducted without the need for an X-ray work supervisor qualification, making it a safe and compact general-purpose X-ray inspection device suitable for use in universities, laboratories, and companies. Features: Easy operation, compact size, low radiation dose, immediate shooting capability, immediate test result display, no X-ray work supervisor qualification required.

  • X-ray inspection equipment
  • Inspection Equipment

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X-ray computed tomography device 'TXR-C3R150PS-01'

Compact and lightweight with easy operation! Equipped with a three-tube X-ray source, suitable for industrial tomography inspection.

The "TXR-C3R150PS-01" is an industrial tomography inspection device that uses a cold cathode three-tube X-ray source, a dedicated PC, and a high-precision detector. It can take immediate images without preheating, is compact and lightweight for easy mobility. With three-tube imaging, it allows viewing of composite images of faults at different depths. 【Features】 ■ Immediate imaging without preheating ■ Compact and lightweight for easy mobility ■ High mobility ■ Easy operation ■ Safe and energy-efficient *For more details, please refer to the PDF document or feel free to contact us.

  • Other inspection equipment and devices
  • X-ray inspection equipment
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Wireless Small X-ray Inspection Device 'TXR-C1R150P-07W'

Achieving high mobility! A wireless compact X-ray inspection device that significantly reduces inspection costs.

The "TXR-C1R150P-07W" is a wireless-controlled X-ray inspection device equipped with a cold cathode X-ray tube. It requires no preheating, is energy-efficient, and achieves compactness and lightweight for high mobility. It allows for efficient energy savings and significant reductions in inspection costs, making it suitable for regular inspections of high-voltage cable ends. 【Features】 ■ No preheating required and energy-efficient ■ Compact and lightweight for high mobility ■ Enables aerial inspections using drones ■ Suitable for regular inspections of high-voltage cable ends ■ Allows for efficient energy savings and significant reductions in inspection costs *For more details, please refer to the PDF document or feel free to contact us.

  • Other inspection equipment and devices
  • X-ray inspection equipment
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Laser Ultrasonic Visualization Inspection Device "LUVI-SC1"

Real-time ultrasound inspection for defect detection. High-speed scanning with complete non-contact capability allows for detailed inspection.

The "LUVI-SC1" is a microscope-type non-destructive testing device that non-destructively inspects fine latent defects in electronic components and precision machine parts. It emits a laser downward from a laser oscillator to scan the surface of the test object. The ultrasonic propagation signal waveforms excited at each scanning point are detected by a receiving sensor and recorded. The recorded data is reconstructed to display and analyze ultrasonic video images, allowing for the detection and evaluation of fine defects. 【Features】 ■ You can view the propagation of ultrasonic waves in video format. ■ Easily discover inherent defects and anomalies in the test object. ■ The inspection unit features a touch panel. ■ Laser output, focus adjustment, and internal temperature monitoring status are displayed as icons. ■ Easy to operate. *For more details, please refer to the PDF materials or feel free to contact us.

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Laser Ultrasonic Visualization Inspection Device "LUVI-ST4"

We conduct non-destructive testing for inherent defects in automobiles, aircraft, industrial plants, shipbuilding, steel, electronic components, and more.

The "LUVI-ST4" is a laser ultrasonic visualization inspection device that can visualize ultrasound using lasers. Just like a spring bubbling up from the surface of water, ripples are generated from areas with defects, allowing for the detection of damages such as scratches and cracks through imaging. With non-contact laser scanning, it can visualize ultrasound in any complex-shaped object and detect defects. Additionally, there is no need to adjust the laser's irradiation angle or focal length, making measurements easy. 【Features】 ■ Immediate observation and defect detection on-site ■ Visualization of ultrasound transmitted through any complex-shaped object ■ Wide area ■ Rapid ■ Easy to measure *For more details, please refer to the PDF materials or feel free to contact us.

  • Other inspection equipment and devices
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Wireless Mini X-ray Source 'TXR-C1R130P-04W'

Achieving the imaging of high-voltage power lines and wire ends, allowing for real-time observation of inspection results.

The "TXR-C1R130P-04W" is a wireless-controlled X-ray inspection device equipped with a cold cathode X-ray tube. Safety is enhanced through interlocks. Vibration resistance is strengthened by reinforcing the corners. Additionally, it enables remote-controlled imaging in combination with drones, allowing real-time observation of inspection results. 【Features】 ■ Realization of imaging for high-voltage wires and wire ends ■ External synchronization ■ Wireless control ■ Compact and lightweight ■ High mobility *For more details, please refer to the PDF document or feel free to contact us.

  • X-ray inspection equipment
  • Inspection Equipment

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XY stage usage examples: 15 cases, case presentation.

This is an example of a positioning stage using a manual XY stage, as well as measuring devices and inspection jigs.

We will introduce examples of solving "problems!" related to positioning stages using mainly manual XY stages, as well as measuring devices and inspection jigs. [Contents] - Flatness inspection jig - Height inspection jig - Surface runout measurement jig - Appearance shape inspection device - Substrate measurement device *For more details, please download the PDF or feel free to contact us.

  • Inspection fixture
  • Inspection Equipment

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Inspection device "Wafer Edge Appearance Inspection Machine"

Inspection of defects such as scratches, foreign objects, and cracks. Achieving detailed image inspection of edges.

The inspection device "Wafer Edge Appearance Inspection Machine" simultaneously inspects defects such as scratches, foreign objects, and cracks on the edge and three surfaces (top and bottom) of the wafer through high-speed optical image inspection. (The inspection time for an 8” wafer is 6 seconds, making it very fast.) The wafer is adhered to the back side, and its shape is recognized by the camera to detect outer diameter eccentricity and the position/amount of the orifice, which controls the inspection machine. The newly developed triple optical system and integrated lighting have enabled detailed image inspection of the edge. External PIO control is also possible, allowing it to be integrated into automated systems. It can accommodate wafer sizes from 4 inches to 8 inches. For more details, please download the catalog.

  • Visual Inspection Equipment
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Inspection device "cp-30 (microscope-type image measurement system)"

Easy operation, precise measurement, automatic measurement possible. Excellent operability in a GUI environment.

The inspection device "cp-30 (microscope-type image measurement system)" is a system that analyzes images captured by a CCD camera attached to a microscope to automatically measure line widths. It precisely measures line widths from the brightness waveform of horizontal or vertical windows set within the screen. It is linked with an XY stage through a dedicated interface, allowing it to automatically move to specified positions for width measurement. The Z-axis autofocus function enables flexible handling of workpieces with varying thicknesses. Additionally, a wafer loader and unloader can also be installed. For more details, please download the catalog.

  • Other measurement, recording and measuring instruments
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Inspection device "Foreign Object Inspection Device"

Easy operation, fast analysis. Flexible assembly of inline device configurations is possible.

The inspection device "Foreign Object Inspection Device" processes images captured by a camera using inspection software (Ip-20), allowing for various analyses to be conducted at high speed. The high degree of freedom in selecting camera models as input sources is a significant feature of this system. It is compatible with most commercially available NTSC and digital output cameras, enabling flexible inline device configurations ranging from high-end, high-functionality devices to low-cost, widely-used models. For more details, please download the catalog.

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Inspection device "Glass Substrate Outline Inspection Device (PSI-50)"

Easy operation. High-precision measurement of the outer shape inspection of small glass substrates and panels.

The inspection device "Glass Substrate Outline Inspection Device (PSI-50)" is capable of measuring outer dimensions (maximum width), detecting burrs, detecting chips, inspecting cutting misalignment, and measuring the dimensions of the glass pouring section. It also features a measurement MAP display function and image storage, among others. Additionally, with the automatic angle correction function for the panel, there is no need to precisely align the angle when placing the workpiece on the inspection stage. Once installed, it automatically corrects the angle. If the placed angle is too large, it will affect measurement accuracy, and an alarm will be displayed. For more details, please download the catalog.

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Super Macro SM75

Inspection possible in 1 shot per second with 300mm wafers. Adopted for fully automated inspection lines.

The Super Macro SM75 can inspect 300mm wafers in one shot in just one second, making it suitable for fully automated inspection lines due to its short inspection time. It is available with a lineup of optical systems for small fields of view, and by using infrared as an optional light source, it can also be applied to internal void inspections. For more details, please contact us or download the catalog.

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Inspection device "ITO Film Appearance Inspection Device"

It is ideal for measuring the line width of transparent films and for appearance inspection!

The "ITO Film Appearance Inspection Device" is a device that measures the line width of transparent films on film or glass substrates and conducts appearance inspections. By using a special optical system, it can clearly capture the presence or absence of transparent patterns, such as ITO films on touch panels, and detect splashes for appearance measurement. It is capable of inspecting the entire film at high speed and allows for detailed review observation of defect areas using high-magnification optics. Additionally, as an option, it can quickly measure the size and distribution of foreign substances on the substrate. Customization of inspection range and measurement accuracy is also possible upon request, so please feel free to consult us. 【Features】 ■ High-speed inspection possible ■ Review observation available ■ Customizable *For more details, please refer to the catalog or feel free to contact us.

  • Defect Inspection Equipment
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Inspection device "Wire Bonding Inspection Device"

Easy operation! Results such as wire trajectories are displayed visually!

The "Wire Bonding Inspection Device" is an optimal inspection device for specifying inspection positions and conducting test measurements with set parameters. It displays images of ideal samples taken, allowing for easy specification of inspection positions and test measurements through simple mouse operations. Results such as wire trajectories are visually displayed, making verification easy. Additionally, variety information is recorded on the HDD, allowing for the registration of multiple varieties. [Features] - Optimal for test measurements of parameters - Simple mouse operation - Results such as wire trajectories can be visually displayed *For more details, please refer to the catalog or feel free to contact us.

  • Bonding Equipment
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Ultra-high-speed wire bond 3D appearance inspection device

It is a short-time inspection, 3D measurement, high-precision, customizable appearance inspection device.

This device is an image processing system that performs visual inspection of wires and bonding on a substrate at ultra-high speed (1 field per second). It consists of two stations: a three-dimensional image processing unit that measures the height of the wires and a high-resolution two-dimensional image processing unit that measures wire bending and ball placement. The two-dimensional and three-dimensional image processing units operate alternately, and there are two image processing PCs. All cameras are fixed, and the mechanical device moves the substrate. ■ Example of Device Configuration (Two-Dimensional Image Processing Unit) - 5-megapixel CCD camera - Lens with magnification of 1.5x - Blue LED dome coaxial illumination - LED power supply 3HC (Three-Dimensional Processing Unit) - 1.3-megapixel CCD camera - CCTV lens f=50mm - Red LED dome illumination - Image processing PC and camera capture board

  • Visual Inspection Equipment
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Wire Saw Main Roller Groove Shape Inspection Device Model: MRI-1500

Main roller groove shape inspection machine for wire cutting machines. The inspection device is mounted on the roller, allowing for measurement of the groove shape profile monitor and shape images.

This is a main roller groove shape inspection machine for wire cutting machines. The inspection device can be placed on the roller at the site to measure the groove shape profile and capture images of the shape. ■ Features 1. Regular maintenance of the main roller allows for checking wear and shape abnormalities. 2. It can estimate the timing for roller replacement and monitor the wire position. 3. It can manage the acceptance inspection of new rollers and optimal processing conditions. ■ Inspection Details 1. Main roller groove shape mode, ear mode, and manual mode. 2. It can perform groove inspections for solar panels and semiconductor grooves.

  • Semiconductor inspection/test equipment
  • Inspection Equipment

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X-ray fluoroscopy and CT examination device 'Observation case of inductive coil'

[Comparison images available] Internal shape abnormalities can also be observed non-destructively! We compared X-ray CT and cross-sectional SEM.

We will introduce a case of observing an inductor coil (orthogonal CT observation + cross-sectional observation). The inside of an inductor coil that experienced operational failure was observed using X-ray CT. It was confirmed that abnormal shapes occurred in various places of the spirally formed wiring. With X-ray CT observation, it is possible to observe in three dimensions, allowing for a clear understanding of the condition of the abnormal areas. Additionally, cross-sections including the abnormal areas were created through mechanical polishing, and observations were conducted using SEM. *For more details, please refer to the PDF document or feel free to contact us.

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  • X-ray inspection equipment
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X-ray fluoroscopy and CT examination device: Observation case of a microphone

[Video Available] X-ray fluoroscopy observation & orthogonal CT observation! We will introduce observation cases of microphones.

We would like to introduce a case study of observing microphone components using X-ray fluoroscopy and orthogonal X-ray CT. MEMS chips and Si chips are transparent, making them only faintly observable. However, in the X-ray fluoroscopic images, the wire bonding and the wiring patterns of the mounting substrate can be observed. In the orthogonal CT images, MEMS chips and Si chips can be observed more clearly compared to the fluoroscopic images. Additionally, while the fluoroscopic images show the observation of overlapping layers, the CT images allow for observation of each layer individually. [Observation Case of Microphones] ■ X-ray Fluoroscopic Images - Wire bonding and wiring patterns of the mounting substrate can be observed. ■ Orthogonal CT Images - MEMS chips and Si chips can be observed more clearly compared to the fluoroscopic images. *For more details, please refer to the PDF document or feel free to contact us.

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  • X-ray inspection equipment
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X-ray fluoroscopy and CT examination equipment: Examples of combined use of transmission observation and image processing technology.

Detecting differences between normal product images and defective product images through image processing! Introducing a case study of the combined use of transmitted observation and image processing technology.

We will introduce a case study of the combined use of X-ray transmission observation and CT scanning equipment with image processing technology. In the transmission X-ray images of normal substrates and defective substrates, the wiring was intricately arranged, and abnormalities were not apparent at first glance. However, image processing allowed us to detect the differences between the images of normal and defective products. Identifying defective areas from a wide field of view is challenging, especially in cases of pattern abnormalities in substrate wiring. However, by using image processing software in conjunction, it becomes possible to discover abnormal areas. [Case Study of Combined Use of Transmission Observation and Image Processing Technology] ■ Detection of differences between images of normal and defective products through image processing - Upon examining the white spots in the X-ray transmission image of the defective product, a shape resembling a broken wire was confirmed. *For more details, please refer to the PDF document or feel free to contact us.

  • X-ray inspection equipment
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X-ray fluoroscopy and CT scanner: Device appearance and main specifications

Introduction of YXLON's multi-focus Cheetah EVO! It can be used for various applications, including electronic components.

X-ray observation is a method of non-destructive testing and is the first inspection conducted for analysis and evaluation. It is effective for initial observation of various components and materials, including implemented circuit boards and electronic parts. Additionally, CT inspection allows for three-dimensional structural capture, enabling visual judgment. The "Cheetah EVO" is equipped with a reflow simulator, allowing real-time observation of phenomena such as void behavior during soldering, which can be utilized for setting reflow conditions and selecting solder. 【Device Specifications】 ■ YXLON Cheetah EVO - X-ray generator: Multi-focus transmission type - Tube voltage: 25-160kV - Tube current: 0.01-1.0mA - Tube power: 64W - Additional features: Orthogonal CT, oblique CT, reflow simulator *For more details, please refer to the PDF document or feel free to contact us.

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[Case Study] X-ray Fluoroscopy and CT Examination Equipment

Numerous examples of "BGA solder crack analysis," "surface mount LEDs," and "chip resistor observation" using X-ray fluoroscopy and angled CT observation are included!

In this document, we introduce various analysis cases conducted by our company using X-ray fluoroscopy and CT inspection equipment. It includes examples such as "BGA solder crack analysis case" from X-ray fluoroscopic observation and oblique CT observation, as well as cases of "surface mount LEDs" and "chip resistors." 【Contents (excerpt)】 ■ BGA solder crack analysis case (X-ray fluoroscopic observation) ■ Surface mount LEDs ■ Chip resistor observation case ■ Reflow simulator ■ Microphone observation case (X-ray fluoroscopic observation & orthogonal CT observation)... ★ Currently offering the 【X-ray fluoroscopy and CT inspection equipment case collection】 for free! You can view it immediately from the "PDF download." *For more details, please refer to the PDF document or feel free to contact us.

  • X-ray inspection equipment
  • Contract Inspection
  • Contract Analysis
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MLCC crack X-ray observation

Cracks that couldn't be detected visually might be found with X-rays!

When stress such as warping, bending, or twisting is applied to the printed circuit board, cracks may occur inside the MLCC (Multi-Layer Ceramic Chip Capacitor). Additionally, cracks that occur internally are often hidden by the electrodes, making it difficult to detect them from the exterior. In such cases, how about checking with X-rays? [Observation Details] ■ Oblique CT Observation It is possible to perform CT without destroying the printed circuit board, in its original state. ■ Orthogonal CT Observation It is possible to observe the shape of the components in their original state. *For more details, please refer to the PDF document or feel free to contact us.

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  • X-ray inspection equipment
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Observation of aluminum welding joints

Introducing examples of aluminum welding observation. Internal observation through X-ray fluoroscopy and CT inspection allows for clearer observation after cross-section preparation!

Here are some examples of observations of aluminum spot welds. In internal observations using X-ray radiography, voids were observed inside the weld, and in internal observations using X-ray CT, it was confirmed that the voids are located near the center of the weld (between the two aluminum plates). Additionally, by creating a cross-section of the same sample and combining mechanical polishing with chemical etching treatment, we were able to observe the condition of the weld more clearly. 【Overview】 ■ Internal observation using X-ray radiography - Non-destructive testing and X-ray radiographic observation were conducted - Voids were observed inside the weld ■ Internal observation using X-ray CT - Non-destructive testing and X-ray CT observation were conducted - It was confirmed that the voids are located near the center of the weld ■ Cross-sectional observation using optical microscopy and tabletop SEM - Mechanical polishing and chemical etching A cross-section suitable for the sample allows for clearer observation. *For more details, please refer to the PDF document or feel free to contact us.

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  • Other contract services
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Image recognition-based light inspection device

10m luminous intensity measurement method

Device for adjusting and inspecting the light axis of automobile headlights.

  • Other process controls
  • Inspection Equipment

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