Microfocus X-ray fluoroscopy inspection device 'TXV-CH4090FD'
Ideal for solder inspection of the implementation board. Observation from an oblique direction is also possible.
<Specifications> - X-ray device: 90kV, focal point: 5μm - Table size: 400×350mm - Tilt angle: 0 to 60 degrees - Magnification: 10 to 160 times <Features> - Equipped with a maintenance-free sealed tube type micro-focus. - Features a flat panel sensor with high image representation capability, providing clear images without distortion. - Allows observation from an angled direction through tilted imaging. Additionally, it is equipped with a tracking function that ensures no observation points are missed during tilted imaging. - Includes BGA void measurement software. - Comfortable user interface that allows all operations on a PC screen. - Compact design that does not require a specific installation location.
- Company:東芝ユニファイドテクノロジーズ 東京事業所 検査システム営業部
- Price:Other