Printed Circuit Board - 20 Layer Interposer 【DSCF5313】
Minimum order quantity starts from 1 piece! Total solution for semiconductor IC test sockets: "20-layer interposer."
The "20-layer interposer" developed by FINPO ELECTRONIC is a total solution for semiconductor IC test sockets, achieving a minimum hole size of 0.3mm, a minimum line width of 2.17mil, and a minimum line spacing of 1.88mil. The minimum order quantity is available from just one piece. For more details, please download the catalog or contact us.
- Company：FINPO ELECTRONIC CO., LTD 台湾本社
- Price：Other
