Vacuum bonding device
We will solve your problems with bonding and sealing! We can accommodate prototypes and demonstrations.
This product is a bonding device that proposes a new bonding process combining vacuum and atmosphere. In the bonding of flexible substrates, it resolves issues such as bubble entrapment in decorative panels with steps and slits. Additionally, flat bonding eliminates pressure unevenness and positional misalignment in thin substrates like films. 【Features】 ■ Line contact bonding (atmosphere/vacuum) Enables bonding under vacuum conditions, producing good quality products regardless of bonding conditions. ■ 3D/2.5D bonding (vacuum) Allows for bonding that conforms to curved surfaces by applying high pressure after contact in a vacuum. ■ Flat bonding (vacuum) Performs vacuum bonding with higher flatness accuracy and high-precision alignment than conventional methods. *For more details, please refer to the PDF document or feel free to contact us.
- Company:常陽工学
- Price:Other