We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Laminating Equipment.
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Laminating Equipment Product List and Ranking from 25 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

Laminating Equipment Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. CLIMB PRODUCTS CO.,LTD Osaka//Manufacturing and processing contract
  2. Ito Corporation Tokyo//Electronic Components and Semiconductors
  3. 常陽工学 Kanagawa//Industrial Machinery
  4. 4 サンテック Hyogo//Industrial Machinery
  5. 5 オリジン Saitama//equipment
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Laminating Equipment Product ranking

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. Freedom with acrylic stands - double-sided, three-dimensional, and transparent. オリジン
  2. Roll to sheet fully automatic sheet laminating machine 'R-ASE540aa' CLIMB PRODUCTS CO.,LTD
  3. Fully automatic peeling and bonding device サンテック
  4. 4 Manual Sheet Laminating Machine 'SE650n' CLIMB PRODUCTS CO.,LTD
  5. 5 Large panel lamination device [for lamination processes of films, glass, etc.] Ito Corporation

Laminating Equipment Product List

46～60 item / All 94 items

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Large panel lamination device [for lamination processes of films, glass, etc.]

Large panel lamination device [for lamination processes of films, glass, etc.]

We will bond OCA and film sensors onto large panels. We can accommodate panels up to a maximum size of 850mm x 850mm!

The large laminating machine is designed for processes involving film/film, film/film/glass, and film/film/plastic sheet. It automatically aligns and laminates OCA or glass and sensors using precision image processing and a unique atmospheric roller mechanism. ● Functional Configuration Upper Stage: Size 600–850mm × 530–850mm / Material Aluminum (MIC6) / Inversion Section operates 180 degrees via a rotating cylinder Lower Stage: Size 500–850mm × 500–850mm / Material Aluminum (MIC6) / Flatness ±0.05mm / Temperature Setting Range 40℃–70℃ (±5℃) Roller Section: Size φ30–40mm × 530–860mm / Conductivity 10^9 Alignment Section: Drive Method Mitsubishi Servo Motor / Alignment Movement Range ±15mm *For more details, please refer to the PDF document or feel free to contact us.

  • Other FPD related
  • LCD display
  • Touch Panel

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Vacuum Laminating Machine [Touch Panel and LCD Module Laminating Device]

Vacuum Laminating Machine [Touch Panel and LCD Module Laminating Device]

We will bond the panels under vacuum. For the assembly of LCD panels such as tablets and smartphones!

The vacuum laminating machine is a device that performs lamination of touch panels and LCD modules ranging from 2.8 inches to 15 inches. The LCM is placed on the lower layer of the jig, and after the operator removes the OCM protective film, the touch panel is placed back on the upper layer of the jig. When the equipment reaches a vacuum, the touch panel and LCM are laminated together. ● Machine Configuration (DH-12GVP15M-A) Lower Stage: Two units (one on the left and one on the right) Movement Method: Moves left and right using cylinders Stage Size: 540mm x 540mm Positioning: Position is determined by the jig *For more details, please refer to the PDF document or feel free to contact us.

  • LCD display
  • Touch Panel
  • Other FPD related

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Vacuum / Large / Curved Surface Bonding Device

Vacuum / Large / Curved Surface Bonding Device

A lineup including vacuum types that prevent air bubbles and models equipped with image processing systems.

We offer a variety of "lamination devices" that are active in the manufacturing processes of touch panels and LCD panels. 【Product Lineup】 < Vacuum Lamination Device > ■ For laminating touch panels and LCD panel modules ■ 2-stage specification ■ Positioning with jigs ■ Lamination accuracy: ±0.1mm (excluding material accuracy) < Large Lamination Device > ■ For the manufacturing process of touch panels ■ Automatic alignment lamination possible with precision image processing ■ Equipped with a unique atmospheric roller mechanism ■ Lamination accuracy: ±0.05mm (excluding material accuracy) < Curved Lamination Device > ■ For laminating films and glass of touch panel products ■ Equipped with a high-performance image system and two 5-megapixel CCD cameras ■ Supports both curved and flat lamination with jig changes ■ Lamination accuracy: ±0.1mm (excluding material accuracy) *For more details, please refer to the materials. Feel free to contact us with any inquiries.

  • LCD display
  • Touch Panel
  • Other FPD related

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Curved surface and S-shaped cover glass bonding device

Curved surface and S-shaped cover glass bonding device

A wide range of products suitable for laminating "large cover glass + AG/AR film" is available.

Our company offers a variety of "lamination devices" that are utilized in the manufacturing processes of touch panels and LCD panels. We can accommodate complex shapes, such as curved surfaces and S-shaped cover glass, through the optical bonding process for automotive instrument panels and other curved applications. Additionally, we also handle AOI inspection devices and rework devices. *For more details, please download the PDF or contact us. 【Example of Product Lineup】 < Vacuum Lamination Device > ■ For lamination of touch panels and LCD panel modules ■ Lamination accuracy: ±0.1mm (excluding material accuracy) < Large Lamination Device > ■ For the manufacturing process of touch panels ■ Lamination accuracy: ±0.05mm (excluding material accuracy) < Curved Lamination Device > ■ For lamination of films and glass in touch panel products ■ Lamination accuracy: ±0.1mm (excluding material accuracy)

  • LCD display
  • Touch Panel
  • Other FPD related

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[Comprehensive Catalog] Bonding Device VJ Series

[Comprehensive Catalog] Bonding Device VJ Series

It is possible to bond substrates and resin substrates coated with adhesive in a voidless manner for lamination in a vacuum.

The bonding device is a machine that joins wafers together using adhesives such as UV resin. It consists of a weighting and bonding chamber, an alignment mechanism, a bonding area inspection mechanism, and an angle deviation inspection mechanism. Additionally, it can be connected to a glove box for pre-treating substrates in an inert atmosphere. Depending on customer needs, it is possible to select the necessary functions from these mechanisms to configure the device. For more details, please download the catalog or contact us.

  • Vacuum Equipment
  • Wafer processing/polishing equipment

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Semi-automatic bonding device for touch panels

Semi-automatic bonding device for touch panels

This device is designed for manually bonding glass substrates and film substrates.

This is a semi-automatic type that positions and bonds two substrates, such as glass substrates and film substrates. By operating the levers on both sides and monitoring the markers with a CCD camera, high-precision alignment can be easily achieved.

  • others

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Bonding device

Bonding device

Equipped with auto-alignment feature!

This product is a device designed for the precise positioning and bonding of two flat panels, such as LCD panels and touch panels.

  • Other processing machines

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Adopting an alignment method to handle even those that are difficult to mass-produce all at once.

Adopting an alignment method to handle even those that are difficult to mass-produce all at once.

We accept mass production operations tailored to customer requests and specifications, such as high-quality products!

Currently, mass production of precision electronic devices is progressing overseas, but our company handles everything from development to mass production for products that are difficult to mass-produce overseas, such as "high-quality production requirements," "small lot production of various types," and "high-precision production requiring new technologies." We possess our own equipment, such as ACF devices and vacuum lamination devices, and we accept mass production tasks tailored to our customers' requests and specifications. Please feel free to contact us when you need assistance. 【Features】 ■ Comprehensive support from development to mass production for products that are difficult to mass-produce overseas ■ Ownership of our own equipment, such as ACF devices and vacuum lamination devices ■ Acceptance of mass production tasks according to customer requests and specifications *For more details, please refer to the PDF materials or feel free to contact us.

  • Other contract services
  • Bonding Equipment
  • Soldering Equipment

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Touch panel laminating device

Touch panel laminating device

Touch panel laminating device

This is an assembly device that uses OCA for panel bonding. It attaches OCA sheets and performs bubble-free lamination using a unique lamination unit. During the attachment process, image processing alignment is conducted for positioning.

  • Touch Panel

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Film Lamination Device 'APF-07S-SP'

Film Lamination Device 'APF-07S-SP'

Attach the film to the curved surface work without bubbles!

The "APF-07S-SP" is a product that can attach film without bubbles to both convex and concave surfaces of curved workpieces. Film supply can be discussed in either sheets or rolls. There are also options for automatic panel supply and automatic discharge. 【Features】 ■ Ideal for film application on small panels! ■ Can be applied to curved panels, both convex and concave ■ Options available such as loaders and unloaders ■ Film supply can be discussed in either sheets or rolls *For more details, please refer to the PDF document or feel free to contact us.

  • Other polymer materials

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Fully automatic peeling and bonding device

Fully automatic peeling and bonding device

Consultation available for power supply units and clean classes! We can suggest suitable methods for the stripping process.

We would like to introduce our "Fully Automatic Peeling and Bonding Device." This device automatically peels off protective films (separators) and bonds them with high precision for main and sub-works flowing in from upstream. It is capable of simultaneous peeling and bonding on both sides. For heavier peeling forces, please feel free to consult us. 【Reference Specifications (Partial)】 ■ Bonding Position Accuracy: ±0.10mm in X1, Y1 directions ■ Cycle Time: Depends on material, adhesive type, and work size ■ Work Supply: Inline ■ Device Dimensions: L3000mm × W1500mm × H1900mm (including HEPA) ■ Compatible Work Size: Max L300 × 200mm (Maximum size achieved by peeling device: 1550 × 1300mm) * For more details, please refer to the related links or feel free to contact us. ■ Flexible substrates are also supported. ■ Sale of peeling units only is also possible.

  • Other processing machines

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Bonding device

Bonding device

A bonding device equipped with position correction and peeling functions through image inspection.

We will listen to your needs and design and manufacture custom solutions. We will assist you in solving the current requirements in your factory, such as labor-saving, cycle time improvement, automatic inspection, inventory management, modifications to equipment and electrical systems (design and equipment work), data collection, verification, and experimentation. We provide the latest and most optimal information and technology. Please contact us for more details.

  • Other process controls
  • Other measurement, recording and measuring instruments
  • Other conveying machines

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Vacuum bonding device

Vacuum bonding device

We will solve your problems with bonding and sealing! We can accommodate prototypes and demonstrations.

This product is a bonding device that proposes a new bonding process combining vacuum and atmosphere. In the bonding of flexible substrates, it resolves issues such as bubble entrapment in decorative panels with steps and slits. Additionally, flat bonding eliminates pressure unevenness and positional misalignment in thin substrates like films. 【Features】 ■ Line contact bonding (atmosphere/vacuum) Enables bonding under vacuum conditions, producing good quality products regardless of bonding conditions. ■ 3D/2.5D bonding (vacuum) Allows for bonding that conforms to curved surfaces by applying high pressure after contact in a vacuum. ■ Flat bonding (vacuum) Performs vacuum bonding with higher flatness accuracy and high-precision alignment than conventional methods. *For more details, please refer to the PDF document or feel free to contact us.

  • LCD display

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"Airbag-type vacuum laminator" Vacuum lamination device

"Airbag-type vacuum laminator" Vacuum lamination device

Flat and curved surface correspondence! The sticking operation is automatically controlled by PLC!

This product uses a adhesive mesh mechanism to hold the film substrate in a vacuum (patent pending) and attaches it to curved or flat cover glass or resin without bubbles. The attachment operation is automatically controlled by PLC. Optionally, a heater can be built into the lower stage (Max 150°C). 【Features】 ■ Holds the film substrate in a vacuum using an adhesive mesh mechanism (patent pending) ■ Can attach to curved or flat cover glass or resin without bubbles ■ Heater can be built into the lower stage (Max 150°C) - Optional *For more details, please refer to the PDF document or feel free to contact us.

  • Vacuum Equipment

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Tabletop Vacuum Laminator (A1 Type) Vacuum Bonding Device

Tabletop Vacuum Laminator (A1 Type) Vacuum Bonding Device

Ideal for research and development (key technologies)! / Desktop vacuum laminator

Chamber lid opening and closing: Split type Pressure: 4 kgf Load cell: None Z-axis: Manual Vacuum gauge: Bourdon Heater: None - The glass substrate is held in a vacuum using a micro-adhesive pad and is attached to the lower substrate without bubbles. - The upper stage uses a quartz stage, allowing for observation of the bonding state and UV irradiation in a vacuum.

  • Vacuum Equipment

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