MOSFET SupIR SMD-2
Reduce the risk of package cracking due to thermal expansion and contraction caused by temperature application after substrate mounting.
We offer a diverse range of discrete products in various package types for defense, aerospace, and space applications. Features of SupIR SMD-2 ■ Compact and lightweight ■ Temperature resistance reduced by 0.25℃ / W (compared to carrier SMD-2) *Please refer to the image ■ Reduced package resistance ■ Reduced parasitic inductance ■ Higher current rating for ID *For more details, please refer to the catalog or feel free to contact us.
- Company:日本パナトロニック
- Price:Other