Observation of substrate deformation using a 3D shape measuring machine (VR-6200)
Measure the change state with a 3D shape measuring device! Visually confirm the indented shape and amount due to pressure.
We would like to introduce the "Substrate Deformation Observation" using a 3D shape measurement machine. By applying pressure to a PCB substrate, referencing the bending tests of plastics and PCB substrates, we measure the changes using a 3D shape measurement machine (VR-6200). Since the measurement results can be confirmed with a color palette and line profile, it is possible to visually verify the shape and amount of deformation caused by the applied pressure. 【Features】 ■ Measurement results can be confirmed with a color palette and line profile ■ It is possible to visually verify the shape and amount of deformation caused by the applied pressure *For more details, please download the PDF or feel free to contact us.
- Company:アイテス
- Price:Other