Insert molding technology using low-pressure forming polyester resin.
High adhesion properties address peeling prevention and waterproofing/dustproofing needs. Capable of mass production with a dedicated molding machine.
Our company offers insert molding technology using hot melt resin (low-pressure molding polyester resin). We have a lineup of resin grades that exhibit high adhesion to materials such as PI, PBT, glass epoxy substrates, and metals, making them suitable for applications requiring waterproof and dustproof properties, such as cable connectors. This technology also allows for detailed filling, contributing to the miniaturization, thinning, and lightweighting of components. With dedicated machines developed in collaboration with molding machine manufacturers, we can also meet the needs for mass production. 【Features of this technology】 ■ Exhibits high adhesion to various substrates, preventing water ingress ■ Enables molding with reduced stress on electronic components through low-pressure molding ■ Short curing time contributes to reduced molding time ■ Allows for precise management of injection volume, pressure, and speed, enabling stable quality for mass production *For more details, please refer to the materials. Feel free to contact us with any inquiries.
- Company:三陽工業
- Price:Other