Last Updated： Aggregation Period:Jan 21, 2026～Feb 17, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Jan 21, 2026～Feb 17, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Jan 21, 2026～Feb 17, 2026
This ranking is based on the number of page views on our site.
1～30 item / All 69 items
SMARC module VDX3-SMARC x86 legacy support, long-term stable supply
The VDX3-SMARC (1GHz) is a SMARC System On Module equipped with DM&P's Vortex86DX3 SoC, featuring 1GB or 2GB of RAM, 4 serial ports, 2 USB ports, SATA, LCD, LVDS, LAN, GPIO, SD, SPI, I2C, and PCIe. It supports DOS, various embedded Windows versions, Linux, and RTOS.
System-on-Module VEX-SOM IoT/M2M Long-term Stable Supply
VEX-SOM is a system-on-module equipped with a 32-bit x86 microcontroller-like SoC. It is compact and low power, supporting a rich set of I/O. It is ideal for data communication applications such as IoT and M2M (smart meters, gateways, data loggers, etc.). Long-term stable supply is possible.
Compact and powerful computer on module equipped with 7th generation Intel Core / Celeron.
【Main Features of the Product】 ◆ 7th Generation Intel Core i7 / i5 / i3 / Celeron integrated PCH-LP ◆ Up to 8 lanes of flexible PCI Express ◆ Integrated GFx-supported HEVC, VP8, VP9 HW Transcode ◆ 2x DDR4 2133 SODIMM support (up to 32GB) ◆ Compatible with iManager, WISE-PaaS / RMM, and embedded software API
![Computer-on-Module (COM) [ROM-5420B1]](https://image.mono.ipros.com/public/product/image/f63/2000393228/IPROS81832615143901375846.jpeg?w=280&h=280)
NXP ARM Cortex-A9 i.MX6 SMARC v1.1 module
NXP ARM Cortex-A9 i.MX6 SMARC v1.1 Module ● Freescale ARM Cortex-A9 i.MX6 Quad 800 MHz high-performance processor ● Onboard DDR3 memory 2 GB ● Parallel RGB, HDMI, 24bit LVDS ● 4GB eMMC flash, 1 SD/MMC, 1 SATA support ● 2 CAN, 4 UART, 5 I2C, 12 GPIO, 1 PCIe, 1 camera input, 1 Gigabit LAN ● OpenGL ES 2.0 and OpenVG 1.1 hardware accelerator support ● Full HD hardware encode/decode engine support ● Optional thermal solution
![Computer-on-Module (COM) [ROM-3310]](https://image.mono.ipros.com/public/product/image/ea4/2000393229/IPROS60084805783500641231.jpeg?w=280&h=280)
TI AM3352 Cortex A8 1GHz RTX 2.0 module
TI AM3352 Cortex A8 1GHz RTX 2.0 Module ● Equipped with TI Sitara Cortex A8 AM3352 1GHz ● Onboard DDR3 512MB memory / 4GB EMMC ● Supports a wide range of power input from 5V to 24V ● Supports 1 GbE, 1 USB 2.0, 1 USB 2.0 OTG, 2 CAN buses, 10 GPIO, 4 UART, 1 I2C, 1 I2S, 1 SPI, 1 SDIO ● Operating temperature 0 to 60℃ / -40 to 85℃ ● Low power consumption, fanless design ● Compatible with Linux BSP
![Computer-on-Module (COM) [ROM-7720]](https://image.mono.ipros.com/public/product/image/d18/2000394578/IPROS08843905452057712324.jpeg?w=280&h=280)
NXP i.MX8 QuadMax Qseven 2.1 Computer-on-Module
RROM-7720 is a standard Qseven 2.1 computer-on-module equipped with the next-generation ARM processor NXP i.MX8 QuadMax. The ROM-7720 has become the most powerful and reliable ARM module solution ever, featuring 8 processor cores, a frequency of up to 1.6 GHz, an independent MCU processing unit, and two highly integrated graphic processing units. Specifications and Features: - NXP i.MX8 QuadMax 8-core processor with 2 Cortex-A72, 4 Cortex-A53, and 2 Cortex-M4F - Multi-OS support for Ubuntu / Debian / Yocto Linux, Android - 64-bit LPDDR4 2GB / 4GB - 4K H.265 decoder, HD H.264 encoder - Onboard QSPI flash 256MB, eMMC flash 8GB, boot selection from SPI / eMMC / SD or S-ATA - 3 USB 3.0 with OTG, dual-lane MIPI camera
NXP Arm Cortex-A53 i.MX 8M SMARC 2.0 module
- NXP i.MX 8M processor with dual or quad ARM Cortex A53 cores - 1× ARM Cortex-M4 core - Onboard 2GB LPDDR4 memory and 16GB eMMC - 1 x HDMI 2.0 with a resolution of 4096 x 2160, 1 x 4-lane MIPI DSI - 2 x USB3.0, 4 x USB2.0, 4 x U2C, 4 x I2C, 12 x GPIO, 1 x PCIe2.0, 1 x 4-lane MIPI CSI camera input, 1 x 2-lane MIPI CSI camera input, 2× Gigabit LAN - Supports OpenGL ES 3.1 / 3.0 / 2.0 / 1.1 and Open CL 1.2, Vulkan hardware accelerator - Supports 4K hardware decode engine - Compatible with Linux and Android BSP
"NXP i.MX8M Plus equipped" SMARC 2.0 computer-on-module
【Main Features of the Product】 ◆ Equipped with up to 4 Arm Cortex A53 cores NXP i.MX 8M Mini processor ◆ Onboard 2GB LPDDR4 memory and eMMC 8GB ◆ 1 x dual-channel LVDS; 1 x 4-lane MIPI-CSI ◆ 4 x USB2.0, 1 x USB 2.0 OTG, 4 x UART, 4 x I2C, 12 x GPIO, 1 x PCIe2.0, 1 x Gigabit LAN ◆ Support for OpenGL ES 2.0 / 1.1 via hardware accelerator ◆ Low power consumption design
"NXP i.MX8M Plus equipped" SMARC 2.1 computer-on-module
**Features** - NXP i.MX 8X processor with 2-4 x Arm Cortex-A35 cores - Onboard 2GB LPDDR4 memory and 16GB eMMC - 2 x single-channel LVDS or 2 x 4-lane MIPI DSI - 1 x USB 3.0, 2 x USB 2.0, 2 x CAN, 3 x UART, 4 x I2C, 12 x GPIO, 1 x PCIe 3.0, 1 x 4-lane MIPI CSI camera input, and 2 x Gigabit LAN - Supports OpenGL 3.0 / 2.1. OpenGL ES 3.1 / 3.0 / 2.0 / 1.1 and OpenCL 2.0 hardware accelerator compatible - 4K hardware decode engine support - Low power consumption design - Compatible with Linux and Android BSP
![[RTX] Embedded CPU Board, ROM-3620](https://image.mono.ipros.com/public/product/image/aac/2000665696/IPROS12054169837963615191.jpeg?w=280&h=280)
"NXP i.MX8X equipped" RTX v2.1 computer-on-module
【Main Features of the Product】 ◆ NXPi.MX8X processor equipped with 2 to 4 Arm Cortex-A35 cores ◆ Onboard LPDDR4 memory and 16GB eMMC ◆ Supports a wide power input range of 5V to 24V ◆ Supports Vivante GC7000n Lite hardware accelerator ◆ Supports Ultra HD 4K / Full HD 1080p video decoding and HD 1080p video encoding hardware engine ◆ Supports 1x PCIe, 1x USB 3.0, 1x USB 2.0, 1x USB OTG 2.0, 5x I2C, 1x I2S, 1x camera input, 2x CANbus, and 10x GPIO ◆ Low power consumption, fanless design ◆ Supports Linux and Android BSP
Latest COM-HPC Client Size C computer-on-module equipped with 12th generation Intel Alder Lake.
COM-HPC Client Size C Module with Intel's Next-Generation Socket-Type CPU for Desktops 【Main Features of This Product】 ◆ COM-HPC Client Size C Module ◆ Intel's Next-Generation Socket-Type CPU for Desktops ◆ Up to 16 cores, 24 threads, TDP: 65W ◆ Up to 128GB of dual-channel DDR5 SODIMM (ECC/non-ECC) ◆ 16x PCIe Gen5 + 16x PCIe Gen4 + 10x PCIe Gen3 ◆ Supports iManager, Embedded Software API, and WISE-DeviceOn
Computer-on-module equipped with 14th generation Intel Core Ultra processor *Mass production samples now available.
The "SOM-5885" is a computer-on-module that conforms to the COM Express Basic standard. It is equipped with the 14th generation Intel Core Ultra processor (Code Name: Meteor Lake-U/H), which offers a 24% improvement in CPU processing performance compared to the 13th generation, and a 90% increase in image processing performance thanks to the latest Xe LPG graphics. Additionally, it features Intel's first AI engine, the NPU (Neural Processing Unit), which not only enhances AI computation speed but also achieves power efficiency and energy savings, reducing reliance on external graphics cards. Furthermore, it supports high-speed I/O such as PCI Express Gen4, 2.5G LAN, and USB 4.0. By delivering this top-tier computer-on-module, we aim to contribute to reducing the TCO of our customers' product development.
Industrial i.MX 8M Nano Quad-Core SOM
It is a system-on-module (SOM) platform based on the i.MX 8M Nano application processor. It is designed for a wide range of applications in industries such as IoT, HMI, equipment monitoring, voice, edge computing, and machine learning (such as anomaly detection) in fields like industrial, medical, agriculture, and transportation. It features up to four power-efficient Arm Cortex-A53 cores and one Cortex-M7 core, allowing for high-level performance while minimizing power consumption.
An embedded wireless SoM based on the NXP i.MX 93 processor, achieving long life and scalability for industrial IoT applications.
The Digi ConnectCore 93, based on the NXP i.MX 93 application processor, is a system-on-module (SOM) platform equipped with Wi-Fi 6 and Bluetooth 5.3 wireless connectivity. The Digi ConnectCore 93 features up to two power-efficient Arm Cortex-A55 cores, along with a Cortex-M33 core, an AI/ML Arm Ethos U65 NPU, and an NXP PMIC, maximizing power efficiency. This SOM is designed with the reliability of embedded devices in industrial applications and a product lifecycle of over 10 years in mind. The Digi SMTplus surface mount form factor offers simplified design integration, efficiency, and reliability. Digi ConnectCore SOM solutions provide embedded security through Digi TrustFence, an integrated device security framework that simplifies the process of protecting connected devices.
![COM module "Qseven" [Q7-BT]](https://image.mono.ipros.com/public/product/image/7c5/2000220277/IPROS6185916274632149016.jpg?w=280&h=280)
Intel Atom processor equipped standard size Qseven module
The concept of Qseven is an off-the-shelf, multi-vendor computer-on-module that integrates all core components of a typical PC and is implemented on application-oriented carrier boards. Qseven modules come in standard form factors of 70 mm x 70 mm or 40 mm x 70 mm, featuring specific pinouts compatible with high-speed MXM connectors, allowing use with products from any vendor. Qseven modules provide features such as graphics, audio, large-capacity storage, networking, and multiple USB ports for embedded applications. A robust 230-pin MXM connector provides a carrier board interface that can transmit and receive all I/O signals with the Qseven module. This MXM connector is a well-known, proven high-speed signal interface connector widely used in laptop PCI Express graphics cards.
COM Express Type 6 compatible computer-on-module (COM) VCOM-1600
The "VCOM-1600," a computer-on-module (COM) equipped with the Intel Atom x6000E processor (Elkhart Lake) and compliant with COM Express Type 6, features a compact form factor (95mm x 95mm) and supports real-time data synchronization with Intel TSN/TCC standards. It enables 4K display output through various interfaces such as DDI, VGA, and LVDS. The "VCOM-1600" is the optimal COM Express solution for all embedded applications. *Please download the datasheet or check our website for the main specifications. *You may also consider the carrier board "VCOM-BASE," which complies with the COM Express Carrier Design Guide specifications.
Small, low power consumption, Apollo Lake
The PQ7-M108 is a Qseven module equipped with Intel Atom/Pentium/Celeron processors (Apollo Lake). It features higher graphics performance and a wider memory bandwidth than before. The PQ7-M108 is suitable for various applications and can withstand harsh environments by supporting a wide operating temperature range. For more details, please refer to the PDF document or feel free to contact Fuji Soft. https://www.fsi-embedded.jp/product_detail/7895/
Compact, low power consumption, SMARC, Apollo Lake
The SM-B69 is a 2.0 compliant SMARC module equipped with Intel Atom X series, Intel Celeron J/N series, and Intel Pentium N series (Apollo Lake) processors. This high-performance, low-power, and feature-rich solution can run up to three independent displays with 4K hardware encoding for HEVC (H.265), H.264, VP8, SVC, and MVC. It features up to 8GB of quad-channel soldered-down LPDDR4-2400 memory, up to 2 x Gigabit Ethernet interfaces, and 2 x MIPI CSI interfaces. For more details, please refer to the PDF document or feel free to contact Fuji Soft. https://www.fsi-embedded.jp/product_detail/8201/
Small, low power consumption, Xilinx, Ultra Scale
The SM-B71 is a 2.0 compliant SMARC module that uses the Xilinx Zynq Ultrascale+ MPSoC. This solution provides flexible ARM + FPGA heterogeneous processing in a standard form factor, offering a wide range of scalability and excellent flexibility, from cost-effective dual-core to high-performance quad-core ARM Cortex-A53 MPSoCs with GPU/VCU (up to 256k FPGA logic cells). It also features a dedicated real-time ARM Cortex-R5 processor, LVDS and DP video interfaces with up to 4K resolution, and high-speed interfaces. For more details, please refer to the PDF materials or feel free to contact Fuji Soft. https://www.fsi-embedded.jp/product_detail/8195/
Compact, low power consumption, SMARC, imx8m
The SMARC-iMX8M provides high-performance processing for low-power system-on-modules. It is ideal for a variety of embedded products, the growing market of connected devices and portable devices, as well as various devices that require connected streaming audio/video, scanning/imaging devices, and high-performance, low-power applications. This product is based on the NXP i.MX8M dual/quad-lite/quad family of versatile processors, featuring up to 1.5GHz ARM CortexTM-A53 and an additional 266MHz ARM Cortex-M4 core. For more details, please refer to the PDF document or feel free to contact Fuji Soft. https://www.fsi-embedded.jp/product_detail/9052/
Compact, low power consumption, TI, SMARC
The SMARC-T4378 with the Sitara AM4378 processor supports the ARM Cortex-A9 core and extends performance by up to 40% compared to the Sitara AM335X processor line at up to 1GHz. As a successor to the popular SMARC-T335X platform, these high-performance features integrate additional capabilities to support a variety of markets, from human-machine interfaces (HMI) to IoT gateways and industrial automation. Embedian continues to optimize and expand its portfolio of SMARC solutions for the embedded market. For more details, please refer to the PDF document or feel free to contact Fuji Soft. https://www.fsi-embedded.jp/product_detail/9054/
Over 10 years of product lifespan program! SOM compatible with SMARC v2.1.
We would like to introduce the "iW-RainboW-G33M," which we handle. This product features a 64-bit ARMv8 architecture with an i.MX 8M Q/QL/D CPU and 4GB of LPDDR4 memory. It also includes IEEE 802.11a/b/g/n/ac/ax Wi-Fi and Bluetooth 5.0. 【Features】 ■ i.MX 8M Q/QL/D CPU ■ 4GB LPDDR4 memory ■ Over 10 years of product lifespan program ■ IEEE 802.11a/b/g/n/ac/ax Wi-Fi ■ Bluetooth 5.0 *For more details, please refer to the PDF document or feel free to contact us.
Introducing the "Zynq 7000 SODIMM SOM" that we handle!
Fujisoft is a domestic retailer of the 'iW-RainboW-G28M'. It is a product equipped with a 200-pin SODIMM edge connector, 512MB DDR3, and 8GB eMMC. With Fujisoft's extensive experience in embedded development, we provide a reliable support system that ensures peace of mind both before and after your purchase. 【Overview and Features】 ■ Xilinx’s Zynq 7000 SoC with CLG400 Package ■ 512MB DDR3 & 8GB eMMC ■ 200-pin SODIMM Edge Connector ■ Up to 120 FPGA IOs ■ Wi-Fi & BT Support *For more details, please refer to the related links or feel free to contact us.
Equipped with 16GB of LPDDR5 memory, 16MB of QSPI flash, and 16GB of eMMC flash!
The "i.MX 95 SMARC System on Module iW-RainboW-G61M SoM" is equipped with six Cortex-A55 cores (up to 2GHz), an M33 core (333MHz), and an M7 core (800MHz). It provides up to 2.0 TOPS of AI/ML processing capability through the eIQ Neutron NPU, along with 16GB of LPDDR5 memory, 16MB of QSPI flash, and 16GB of eMMC flash. Additionally, it offers connectivity options such as Wi-Fi 6 and Bluetooth 5.3, as well as high-speed connection options like 10GbE, USB 3.0, and PCIe Gen 3, making it suitable for vertical markets such as industrial, medical, automotive, and avionics. 【Features (partial)】 ■ i.MX 95 CPU with Six Cortex-A55 cores operating up to 1.8GHz ■ NPU with up to 2.0 TOP/s Neural Network performance *For more details, please download the PDF or feel free to contact us.
Boardcon Technology in China has developed a system-on-module (SoM) suitable for embedding in ARM-based industrial and commercial equipment.
We handle standardized System on Modules (SoM) and Computer on Modules (CoM) for industrial equipment, primarily featuring cost-effective SoCs from China's Rockchip, as well as SoCs from Allwinner, NXP, and SAMSUNG. We provide support in Japanese for both software and hardware aspects. In addition to selling standardized modules, we also offer simple customizations and full custom solutions based on these standardized modules. Please feel free to contact us.
![[Solution Case] Development of products equipped with Snapdragon](https://image.mono.ipros.com/public/product/image/755/2000768083/IPROS92958881021433776286.png?w=280&h=280)
Miniaturization, high functionality, and cost reduction! Introducing development using Snapdragon 820-SOM.
We would like to introduce a case where a System on Module (SoM) featuring the well-known Snapdragon (Qualcomm) SoC for mobile devices has been incorporated into a product. In response to the request for high-definition image processing in a compact size, we proposed a SoM that includes peripheral circuits. Additionally, we achieved miniaturization, high functionality, and cost reduction by customizing the memory size. [Development Overview] - The SoM was selected as the product's processor due to its high compatibility with communication and image/video processing, as well as its low power consumption and low cost. - The product design was based on the Android OS, which has a proven track record in smartphones and tablets. - It is equipped with Bluetooth and USB (Type-C), and we supported obtaining Bluetooth SIG certification. - Measures against radio wave leakage have also been implemented internally. *For more details, please refer to the PDF document or feel free to contact us.
