Last Updated： Aggregation Period:Feb 11, 2026～Mar 10, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Feb 11, 2026～Mar 10, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Feb 11, 2026～Mar 10, 2026
This ranking is based on the number of page views on our site.
211～240 item / All 2837 items
MVP Series for Embedded Systems, equipped with 9th generation Core i7/i5/i3.
Features ■ Width 210 × Height 86 × Depth 240 mm, 4.33 liters ■ Fanless Core i7-9700E/i7-9700TE/i5-9500TE/i3-9100TE/Celeron G4900T CPU ■ Memory DDR4 SO-DIMM (up to 32GB) ■ Dual display 2 DP++ 1.2, VGA, DVI ■ Abundant I/O 3 GbE, 3 USB3.1, 4 USB2.0, 4 COM ■ Robust, vibration-resistant, cableless structure ■ Wide DC input 12V to 24V ■ DIO 8 DI + 8 DO
For embedded systems, equipped with 9th generation Core i7/i5/i3, NVIDIA Quadro Embedded GPU can be installed.
Features ■ Width 125 × Height 210 × Depth 240 mm, 6.3 liters ■ Core i7-9700E/i7-9700TE/i5-9500TE/i3-9100TE/Celeron G4900T CPU ■ NVIDIA Quadro Embedded P1000/P2000/P3000/P5000 GPU ■ Memory DDR4 SO-DIMM (up to 32GB) ■ Dual display 2 DP++, 1 VGA/DVI, Extra 4 DP1.4 / 3 DP1.4 ■ Abundant I/O 3 GbE, 3 USB3.1, 4 USB2.0, 3 COM ■ Robust, vibration-resistant, cableless structure ■ Wide DC input 12V to 24V
MVP Series for Embedded Systems, equipped with 9th generation Xeon/Core i7/i5/i3.
Features ■ Width 165 × Height 210 × Depth 240 mm, 8.31 liters ■ Xeon E-2278GE/Core i7-9700E/i7-9700TE/i5-9500TE/i3-9100TE/Celeron G4900T CPU ■ Memory DDR4 SO-DIMM (up to 32GB) ■ Dual display 2 DP++ 1.2, 1 VGA, 1 DVI ■ Abundant I/O 3 GbE, 3 USB3.1, 4 USB2.0, 4 COM ■ Expansion slots 1 PCIe[x16] + PCI ■ Robust, vibration-resistant, cableless structure ■ Wide DC input 12V to 24V ■ DIO 8 DI + 8 DO
MVP Series for Embedded Systems, equipped with 9th generation Xeon/Core i7/i5/i3.
Features ■ Width 206 × Height 210 × Depth 240 mm, 10.38 liters ■ Xeon E-2278GE/Core i7-9700E/i7-9700TE/i5-9500TE/i3-9100TE/Celeron G4900T CPU ■ Memory DDR4 SO-DIMM (up to 32GB) ■ Dual display 2 DP++1.2, 1 VGA, 1 DVI ■ Abundant I/O 3 GbE, 3 USB3.1, 4 USB2.0, 4 COM ■ Expansion slots 1 PCIe[x16] + 2 PCIe[x4] + PCI ■ Rugged, vibration-resistant, cableless structure ■ Wide DC input 12V to 24V ■ DIO 8 DI + 8 DO
For embedded systems, equipped with 9th generation Xeon/Core i7/i5/i3, NVIDIA Quadro Embedded GPU can be installed.
Features ■ Width 165 × Height 210 × Depth 240 mm, 8.31 liters ■ Xeon E-2278GE/Core i7-9700E/i7-9700TE/i5-9500TE/i3-9100TE CPU ■ NVIDIA Quadro Embedded P1000/P2000/P3000/P5000 GPU ■ Memory DDR4 SO-DIMM (up to 32GB) ■ Dual display 2 DP++1.2, 1 VGA/DVI ■ Abundant I/O 3 GbE, 3 USB3.1, 4 USB2.0, 4 COM ■ Expansion slot 1 PCIe[x4](MVP-6120-MXM) ■ Expansion slot 2 PCIe[x4] + PCI(MVP-6140-MXM) ■ Robust, vibration-resistant, cableless structure ■ Wide DC input 12V to 24V
6th generation Core i7/i5/i3/Celeron, On-board 4GB/8GB + 1xDDR4-2133 maximum 16GB
Features ■ Equipped with 6th generation Core i7/i5/i3/Celeron ULT processors ■ DDR4 DO-DIMM socket ■ Supports triple display (VGA/iDP + HDMI + LVDS) ■ mSATA/SIM compatible PCIe mini slots × 2 slots ■ Gigabit LAN port supporting AMT 11.0 ■ Includes IEI One Key Recovery Solution (OS backup software)
OMNI Series 15" Fanless Panel PC
Features ■ 15" XGA TFT LCD ■ Fanless cooling system ■ Atom x5-Z8350 1.44GHz ■ IP65 front waterproof/dustproof bezel ■ Supports projected capacitive/5-wire resistive touch panel ■ I/O expansion via OMNI I/O module
12" Military-grade touchscreen PC, Core i7/i5/i3 CPU, GTX950M GPU, full IP65, high brightness 1000NIT
Features ■ 12" XGA TFT LCD ■ Fanless cooling system ■ CPU Core i7-7600U/i5-7300U/i3-7100U ■ GPU NVIDIA GeForce GTX950M ■ MIL-STD-810G certified (temperature, shock, vibration, humidity, EMI, EMC) ■ Durable full IP65 aluminum chassis with MIL-DTL-38999 connector ■ 5-wire resistive (Glass-Film-Glass protection) touch panel ■ IP65 fully waterproof/dustproof ■ 6 programmable function keys ■ Extended operating temperature -30 to 60℃ ■ Wide DC input 9 to 36V
Railway and in-vehicle use, equipped with Intel 8th generation Core i7-8665UE/i3-8145UE CPU, supports extended temperature range.
Features ■ Width 224 × Height 32.6 × Depth 149 mm, 1.09 liters ■ 8th Generation Intel Core i7-8665UE/i3-8145UE CPU (Whiskey Lake) ■ Two DDR4 2400MHz memory slots, expandable up to 64GB ■ Two DP ports supporting high-definition 4K video output ■ Four USB 3.1 ports, capable of data transfer up to 10Gbps ■ Four independent GigE LAN ports, supporting IEEE 802.3at PoE+ (2 ports) ■ 5G/WiFi/4G/3G/LTE/GPRS/UMTS support via SIM socket ■ Four COM ports (RS-232/422/485), equipped with 16 isolated DIO ■ Wide DC power input range of 9V to 50V ■ Extended operating temperature range of -40℃ to 85℃, with a clean cable-free design ■ Ignition control capable (16 modes), supports TPM 2.0 ■ Rich expansion features (M.2 Key B, M, E and Mini PCIe)
Equipped with 9th/8th generation CPU, Edge AI GPU computing, and extended temperature support.
Features ■ Width 250 × Height 137 × Depth 260 mm, 8.9 liters ■ 9th/8th generation Core i7/i5/i3 CPU, fanless operation ■ DDR4-2666/2400MHz (up to 32GB) ■ 4K resolution support, 3 display outputs (1 DP, 1 HDMI, 1 DVI-I) ■ 1 PCIe[x16] (option: 2 PCIe[x16] ([x8] signal)) ■ 2 2.5" HDD, 1 M.2 (M key 2280/2242) ■ 6 GbE (option: 4 PoE), 4 USB3.0, 4 COM, 2 GPIO ■ Extended temperature support -40 to 70°C ■ Wide DC input 9 to 48V, controlled by ignition key ■ Internal battery UPS can be installed (optional)
Railway and vehicle-mounted, compatible with 10th generation CPUs, capable of mounting PEG graphics cards, supports extended temperature range.
Features ■ Width 260 × Height 79 × Depth 240 mm, 4.93 liters ■ 10th Generation Xeon/Core i9/i7/i5/i3 CPU (Comet Lake-S) ■ DDR4-2933MHz (up to 64GB) ■ Can supply power to graphics cards up to 250W ■ 1 VGA, 1 DVI-D, 2 DP (supports 4K resolution), 4 independent display outputs ■ Expansion features: 1 PCIe [x16], 1 M.2 KeyB, 1 M.2 KeyE, 2 Mini PCIe ■ 2.5" HDD front access for 2 drives ■ 6 USB3.2, 1 USB2.0, 4 COM, 3 SIM Card slots ■ 2GbE / 2GbE + 4 PoE ■ Extended temperature support -20 to 45°C ■ Wide DC input 12 to 50V ■ Control via ignition key through software ■ Railway standard EN50155 certified
DLAP series for edge AI, equipped with 9th/8th generation Core i7/i5/i3, optional MXM graphics module.
Features ■ Width 235 × Height 75 × Depth 182 mm, 3.21 liters ■ CPU 9th/8th generation Core i7/i5/i3/Celeron ■ ADLINK MXM graphics module compatible (Type A/B, maximum 120W) ■ Memory DDR4 SO-DIMM (maximum 64GB) ■ Display 6 DisplayPort (2 CPU + 4 MXM) ■ I/O connectors 4 GbE (1 x i219-LM, 3 x i210-AT), 2 COM
DLAP series for edge AI, equipped with NVIDIA Jetson Nano NX.
Features ■ Width 210 × Height 55 × Depth 170 mm, 1.96 liters ■ NVIDIA Jetson Nano CPU Fanless (DLAP-301-Nano) ■ I/O Connectors: 8 PoE (for IP cameras), 1 HDMI, 1 GbE, 3 USB 3.0, 2 COM
DLAP series for edge AI, equipped with NVIDIA Jetson TX2 NX.
Features ■ Width 148 × Height 50 × Depth 105 mm, 0.78 liters ■ NVIDIA Jetson TX2 CPU, fanless ■ I/O connectors: 1 HDMI, 2 GbE, 4/3 USB 3.0, 1 COM
For digital signage, AMD Ryzen Embedded V1605B 2.0GHz/3.6GHz
Features ■215.8mm(W) x 164mm(H) x 45mm(D) / ■AMD Ryzen Embedded V1605B 2.0GHz/3.6GHz ■Supports 2x DDR4-2400 memory up to 32GB ■4x HDMI 2.0 (with EDID emulator) ■Rich expansion slots ■Mini PCIe (Full-size): for communication such as Wi-Fi, Bluetooth, 4G LTE ■M.2 E-Key (2230): for communication such as Wi-Fi, Bluetooth ■1x SIM card slot
For digital signage, 8th generation Intel Core mobile processor (TDP <= 25W)
Features ■ 175mm(W) x 116mm(H) x 30mm(D) ■ Ample expansion slots ■ M.2 E-Key (2230) for card capture ■ M.2 M-Key (2280) for memory ■ 1x M.2 B-Key (3042) for 4G LTE ■ Intel Core i7-8665UE processor ■ 2x DDR4 2400 SO-DIMM (up to 32GB)
Railway/vehicle use, Intel Atom x7-E3950 processor, 64G MLC SSD, 9V~32VDC input.
Features ■340 (W) x 183.4 (D) x 67.6 (H) mm ■Intel Atom x7-E3950 processor ■Abundant expansion slots ■1x miniPCI-E full/Half-size, supports mSATA ■1x miniPCI-E full/Half-size, supports second SIM card ■shared with M.2 slot ■1x M.2 B-key 30x42 with USB 2.0 and USB 3.0 signal only ■4x Gigabit LAN ■512k SRAM on board ■2.5-inch drive bay
For embedded systems, AMD Embedded Ryzen Series SoC V1605B/V1202B/R1606G/1505G
Features ■240mm (W) x 162mm (D) x 42mm (H) 1.63 liters ■Ryzen Series SoC V1605B/V1202B/R1606G/1505G ■Internal expansion: 2x M.2 (E-Key / M-Key) ■Fanless operation temperature ■I/O connectors (front) ■1x Power LED/ 1x HDD LED/ 1x RST button/ ■1x USB 3.0/2.0 by V1605B/ V1202B/ R1606G/ R1505G ■3x DB9 for COM#2~4 (RS232) etc. ■I/O connectors (rear) ■4 x USB 3.1, 2x HDMI (2.0a), 1x DB9 for COM#1 (RS232/422/485) ■2x LAN, 1x Digital I/O (4-in/4-out) ■1x 3-pin DC-in terminal block for 12V(-10%) ~ 24V(+10%) ■2x Antenna holes etc.
Equipped with 8th generation Core i mobile CPU for embedded systems.
Features ■ 180mm(W) x 150mm(D) x 66mm(H) 1.78 liters ■ 8th generation Core i7-8665UE / i5-8365UE / i3-8145UE CPU ■ Internal expansion slots 2x M.2 (E-Key, M-Key) ■ I/O connectors (front) ■ 4x USB 3.1, 2x DP, 1x DB9 for COM#1 (RS232/422/485), 2x Gigabit LAN ■ I/O connectors (rear) ■ 1x Power button, 1x Digital I/O (4-in/4-out), 2x Antenna holes, 1x HDD LED, 1x 3-pin DC-in terminal block for 12V(-10%) ~ 24V(+10%)
Railway and automotive applications, 11th generation CPU compatible, extended temperature range support.
Features ■ Width 150.4 × Height 59.9 × Depth 106.2 mm, 0.96 liters ■ 11th generation Intel Core i7/i5/i3 CPU (Tiger Lake UP3) ■ Fanless operation (up to 15W TDP CPU) ■ DDR4-3200MHz (up to 32GB) ■ 4K resolution support, 2 DisplayPort outputs ■ 1 GbE, 1 2.5GbE, 2 USB3.1, 4 USB2.0, 2 COM, 1 Nano SIM Card ■ Extended temperature range -40 to 75℃ (with 15W TDP CPU) ■ Wide DC input 9 to 55V ■ Control via ignition key (16 modes) ■ Railway standard EN50155 certified ■ Operating temperature -40 to 70℃ ■ Compatible with Win 10 and Linux ■ DC 9 to 55V input (3-pin terminal block: On, Off, IGN)
Railway, vehicle-mounted, 11th generation CPU compatible, extended temperature range support.
Features ■ Width 150.4 × Height 44.2 × Depth 106.2 mm, 0.91 liters ■ 11th generation Intel Core i7/i5/i3 CPU (Tiger Lake UP3) ■ Fanless operation (up to 15W TDP CPU) ■ DDR4-3200MHz (up to 32GB) ■ 4K resolution support, 2 DisplayPort outputs ■ 1 GbE, 1 2.5GbE, 2 USB3.1, 4 USB2.0, 2 COM, 1 Nano SIM Card ■ Extended temperature support -40 to 75℃ (when equipped with 15W TDP CPU) ■ Wide DC input 9 to 55V (3-pin terminal block: On, Off, IGN) ■ Control via ignition key (16 modes) ■ Railway standard EN50155 certified ■ Operating temperature: 12W TDP CPU: -40 to 65℃
For small embedded systems, equipped with NVIDIA Jetson Xavier NX CPU, supporting extended temperature range.
Features ■ Width 150 × Height 62 × Depth 106.2 mm (EAC-2100) 0.99 liters ■ Width 150 × Height 50 × Depth 106.2 mm (EAC-2000) 0.8 liters ■ CPU NVIDIA Jetson Xavier NX, GPU NVIDIA Volta fanless operation ■ 8GB LPDDR4 ■ 1 M.2 Key M (2280), 1 M.2 Key B (3042/3052), 1 M.2 Key E (2230) ■ 4 GbE (2 PoE), 4 USB 3.1, 2 COM ■ 1 CAN, supports 4 GMSL cameras (EAC-2100) ■ Extended temperature range -25 to 70°C ■ Wide DC input 9 to 50V
Arestech panel PC, equipped with Pentium N4200 CPU, projected capacitive touch panel, stainless steel housing IP66/IP69K.
Features ■ 21.5" Full HD TFT LCD ■ Fanless cooling system ■ Low power consumption CPU Pentium N4200 1.1GHz ■ Memory DDR4-2133 up to 32GB / DDR3L-1866 up to 8GB ■ M.2 SSD support ■ AT/ATX power supply selectable ■ IP66/IP69K fully waterproof/dustproof bezel ■ Projected capacitive/5-wire resistive touch panel ■ Wide DC input power 9–36V ■ VESA 75/100/200x100mm or 100/200mm / Yoke/Wall mount support
Compatible with 9th/8th generation Core i CPUs, capable of mounting GPU cards, modular PC, for edge computing.
Features ■ Width 168 × Height 241.5 × Depth 356 mm, 14.44 liters ■ 9th/8th generation Core i7/i5/i3 Desktop (TDP 35W/65W) LGA1151 CPU ■ 2 DDR4 2400/2666, maximum 64GB ■ Modular PC, can be converted to a panel PC using an LCD module. ■ Expansion slots: 1 PCIe [x16] + 2/1 PCIe [x8 (4-Lane)] ■ 3 display outputs: VGA, DVI, DP ■ 3 GbE / 6 USB3.2 / 6 COM / 1 DI + 1 DO ■ 2.5" SATA HDD x 2 (front operation) / CFast x 2 / mSATA x 2 ■ Wide DC input 9–48V / 24–48V (when GPU card is installed) ■ Extended operating temperature -40 to 70℃
POS, industrial terminal-oriented, 14-inch fanless panel computer, projected capacitive touch panel, front waterproof and dustproof IP66.
Features ■ 14" Wide 1366x768 TFT LCD ■ Flat front panel, fanless cooling system ■ CPU: Core i5-6500TE 2.3GHz / Core i3-6100TE 2.7GHz / Celeron G3900TE 2.3GHz ■ Front panel waterproof and dustproof IP66 ■ Slim design with aluminum die-casting
POS, industrial terminal-oriented, 15.6-inch fanless panel computer, projected capacitive touch panel, front waterproof and dustproof IP56.
Features ■ 15.6" Wide 1920x1080 TFT LCD ■ Fanless cooling system ■ CPU Core i5-7300U/i3-6100U/Celeron 3955U ■ Ultra-slim bezel (4.8mm), flat front panel ■ Multi-touch projected capacitive touch panel ■ Front panel waterproof and dustproof IP56 ■ Slim design with aluminum die-cast ■ VariIO expansion box/Mini compatible
POS, industrial terminal-oriented, 15-inch fanless panel computer, projected capacitive multi-touch panel, front waterproof and dustproof IP66.
Features ■ 15" 1024x768 / 17" 1280x1024 TFT LCD ■ Flat front panel, fanless cooling system ■ CPU Core i5-7300U/i5-6300U/i3-6100U/Celeron 3955U ■ Flat front panel ■ Multi-touch projected capacitive touch panel ■ Front panel waterproof and dustproof IP66 ■ Slim design with aluminum die-cast
Poindus, POS, industrial terminal, 15/17 inch panel computer, multi-touch panel, front waterproof and dustproof IP66.
Features ■ 15" 1024x768 / 17" 1280x1024 TFT LCD ■ Flat front panel, fanless cooling system ■ CPU Core i5-6500TE/i3-6100TE/Celeron G3900TE ■ Multi-touch projected capacitive touch panel ■ Front panel waterproof and dustproof IP66 ■ Slim design with aluminum die-cast
15-inch, Elkhart Lake Celeron J6412 CPU, capacitive touch, front waterproof IP66, fanless feature
**Poindus VariPOS/PPC 750 Features** ■15" 1024x768 ■True Flat design, fanless cooling system ■CPU Celeron J6412 Elkhart Lake ■Flat front panel ■Multi-touch projected capacitive touch panel ■Front panel waterproof and dustproof IP66 ■Slim design with aluminum housing ■VESA mount compatible ■Easily replaceable VariIO expansion box support ■I/O expansion box (optional) 1 × GbE 2 × USB 3.0, 4 × USB 2.0 1 × USB Type-C 2 × 12V Powered USB, 1 × 24V Powered USB 4 × COM (RS-232) (DB-9) (DC 0/5/12V compatible (default 0V, switchable via jumper settings) 1 × LPT (D-Sub 25) 1 × Cash drawer (RJ-11)
12th Generation Alder Lake-P Core i5/i3 CPU, POS, industrial terminal, 15" touch panel PC, IP66
Features ■15" 1024x768 ■True Flat design, fanless cooling system ■Intel Alder Lake-P Core i5-1235U / i3-1215U ■Flat front panel ■Multi-touch projected capacitive touch panel ■Front panel waterproof and dustproof IP66 ■Slim design with aluminum housing ■VESA (100×100mm) mountable
