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Plating Product List

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Mitsuya Development Plating [High Lubricity, Low Contact Resistance, Non-Magnetic]

Mitsuya Development Plating [High Lubricity, Low Contact Resistance, Non-Magnetic]

For those who need non-magnetic and lubricating properties, please give it a try!

With the advancement of high technology in devices that are sensitive to magnetism, there has been a trend towards higher density and higher performance in measuring and analytical instruments. As a result, there is a growing demand for non-magnetic properties not only in the main functional components but also in connectors and contact parts that have been previously overlooked. Additionally, with the economic growth of emerging countries, the introduction of the aforementioned measuring and analytical instruments is progressing. However, due to the high cost of the equipment itself, the frequency of updates is much slower than in developed countries, and there is a desire for longer lifespans. Therefore, we have developed a non-magnetic coating that enhances the longevity of insertion and removal cycles and reduces contact resistance, improving the specifications as outlined below: - Maintains low contact resistance even after 60,000 sliding tests - Solder wetting properties and contact resistance are equivalent to conventional products! - Non-magnetic just like conventional products! *For more details, please download the catalog or contact us.

  • Plating Equipment

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Hard silver plating

Hard silver plating

Excellent wear resistance and sliding properties! High hardness of about Hv155 and can be made into a thin film!

Hard silver plating is a product developed for the charging terminal applications of electric vehicles (EVs) and plug-in hybrid electric vehicles (PHEVs). Compared to conventional silver plating with a hardness of Hv80-110, it has a high hardness of approximately Hv155 (+15 -5), providing excellent sliding properties and wear resistance. In particular, it allows for the thinning of areas that were previously addressed with thick conventional silver plating. Compared to silver plating, it tends to have lower friction, and the contact resistance values remain stable even with a high number of insertions and removals. 【Features】 ■ Excellent sliding properties and wear resistance ■ High hardness of approximately Hv155 ■ Enables thinning of areas previously addressed with thick conventional silver plating ■ Expected to be applied to connectors for industrial equipment requiring insertion and removal *For more details, please refer to the PDF document or feel free to contact us.

  • Crimp Terminal

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Cobalt-nickel alloy plating

Cobalt-nickel alloy plating

Improving the contact resistance and high-temperature durability of solid oxide fuel cells (SOFC)!

Cobalt-nickel alloy plating has good mechanical properties, durability, and heat resistance. [Composition ratio] Co 70wt%: Ni 30wt% each ±5wt% [Film thickness] ~3μm In examples where plating was applied to components of solid oxide fuel cells (SOFC), when used at high temperatures around 800°C, the resistance value of conventional metal components typically increases. However, by applying cobalt-nickel alloy plating compared to untreated or nickel-plated components, a lower resistance value can be maintained.

  • alloy
  • Other metal materials

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Gold-iron alloy plating

Gold-iron alloy plating

It is environmentally friendly gold plating!

By converting environmentally concerning substances such as cobalt and nickel into iron, which is a non-harmful iron group element, it can be expected to serve as an environmentally friendly alternative plating.

  • Sensors
  • others

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Gold plating / Gold alloy plating

Gold plating / Gold alloy plating

Chemically extremely stable! Excellent corrosion resistance and electrical conductivity!

"Au/Au alloy plating" is a material for electronic components that is chemically very stable and has excellent corrosion resistance and electrical conductivity. When used as an electrical contact material, a hard Au alloy plating with additives such as Co, Ni, and Fe is employed. Hard Au plating using Fe is used as an environmentally friendly hard Au plating that does not use allergenic substances. 【Features】 ■ Chemically very stable ■ Excellent corrosion resistance ■ Excellent electrical conductivity *For more details, please refer to the PDF document or feel free to contact us.

  • Other metal materials

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Tin-lead alloy plating

Tin-lead alloy plating

Optimal for high-temperature lead-free solder materials! Achieved mass production of gold-tin alloy plating, reducing wafer loss costs!

Gold-tin alloy plating shows a eutectic point with a composition of gold 80: tin 20, and a melting point of 280°C. 【Points】 - Gold-tin alloy plating does not expose the wafer to high temperatures during the process, preventing thermal degradation. - It allows for control of film thickness and enables thin film formation (with a proven 33% cost reduction). - The alloy ratio can be changed arbitrarily, resulting in a wide range of coating compositions (with a proven range of Au 70 to 90 wt%). - Plating on fine patterns is possible. - It has good oxidation resistance and solderability, enabling highly reliable bonding. - There are few voids and impurities, and no flux is needed, so cleaning after reflow is unnecessary. We welcome any questions or consultations. Please feel free to contact us.

  • Wafer
  • Sensors
  • alloy

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Thin tin reflow hoop plating

Thin tin reflow hoop plating

In the process, it is possible to have a thickness difference in Sn plating (reel to reel)! The amount of tin shavings during insertion and secondary pressing can be significantly reduced!

**Previous Issues** In conventional tin plating, it has been difficult to maximize the characteristics of both the press-fit and soldering areas, and the generation of tin shavings after secondary processing has been a challenge. **Effects** - Plating of varying thicknesses has become possible. - By reducing the thickness of the coating on the press-fit area, we can suppress tin shavings during insertion, while increasing the thickness of the soldering area helps maintain solderability. - When performing secondary processing, exposing the underlying nickel in the bent section significantly reduces the occurrence of tin shavings. - By conducting reflow treatment, we suppress the occurrence of whiskers. Additionally, by performing the treatment at an optimal temperature for the specified coating thickness, we can prevent the formation of wrinkles and rough surfaces in the plating. Please feel free to contact us with any questions, no matter how trivial!

  • Other metal materials

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High reflectivity gold plating

High reflectivity gold plating

Successfully conducted experiments aboard the NASA Space Shuttle!

Among glossy metals, silver plating is considered to have good reflection across a wide range of wavelengths. However, silver plating tarnishes quickly in the air. To solve this problem, Mitsuya developed high-reflective gold plating. Compared to our conventional gold plating, the reflectivity has improved by 4-6%. High-reflective gold plating is widely used in various applications, such as: - Marking on wafers during semiconductor manufacturing processes - Pulse laser welding - Laser cutting machines Astronaut Koichi Wakata conducted experiments to create alloys using an imaging furnace installed on NASA's Space Shuttle. The reflective mirror of this imaging furnace uses the high-reflective gold plating developed by Mitsuya. This mirror is the most critical component for the imaging furnace.

  • Wafer
  • Other markings
  • Other metal materials

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Indium plating

Indium plating

It is used as low-temperature joining materials and metal seals!

Indium is characterized by its soft material properties, low melting point, good water resistance, and good alkali resistance. Our indium plating comes in two types: inorganic acid bath and organic acid bath. Both are white, matte, with a hardness of Hv5 or lower, and a melting point within the range of 156.6±1℃.

  • Other metal materials
  • others

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Plating on titanium material

Plating on titanium material

You can impart various plating characteristics without heat treatment!

Titanium is a non-magnetic metal with a specific gravity between that of iron and aluminum, characterized by high strength and light weight. It has excellent corrosion resistance due to the formation of a stable oxide film on its surface, but this oxide film tends to result in a high contact resistance. While it excels in corrosion resistance, it has some weaknesses in wear resistance. 【Features】 - It is possible to apply a coating that adheres well to titanium materials without using heat treatment. - It supports various coatings, not only precious metal plating but also using a nickel base. - By applying copper or nickel plating, it can enhance the electrical conductivity and wear resistance of titanium materials. - Since adhesion can be secured without heat treatment, post-processing using an electric furnace after plating is unnecessary.

  • Other metal materials
  • others

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Plating on a wafer

Plating on a wafer

From prototype to mass production! We accept plating for various types of wafers!

This is an acidic copper plating used for circuit boards, silicon wafers, etc. (with gloss agent) ■ Platable wafer materials: GaAs, Si, etc. ■ Platable electrode materials: Seed layers of Cu, Au, etc. ■ Mass production wafer sizes: 3 inches, 4 inches ■ Mass production capacity: 1,000 wafers/month ■ Prototype wafer sizes: 3, 4, 8 inches ■ Types of plating: Electrodeposited copper plating, electrolytic and electroless nickel plating, electrolytic and electroless gold plating, electrolytic and electroless palladium plating, electrolytic and electroless tin plating Our achievements: Mounting components for smartphones We will provide proposals that meet your requirements. Please feel free to contact us for any inquiries, no matter how trivial.

  • Wafer
  • others

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Black nickel plating

Black nickel plating

It is widely used in the field of optical devices, such as cameras and anti-reflective applications!

This is a black nickel-based alloy plating that is widely used in various fields, including automotive and motorcycle parts, as well as in optical devices such as cameras and anti-reflective applications that dislike light. Our company offers both electrolytic and electroless options. ■ Black Electrolytic Nickel Plating The appearance is a metallic black, and the shade of black varies depending on the material and the gloss of the substrate. The corrosion resistance is not very high, and it does not possess the flexibility typical of regular metals. Typically, black nickel plating is applied over nickel plating. ■ Black Electroless Nickel Plating This process produces a black coating through electroless nickel plating. There are two types: the "deposition type," which deposits the black coating, and the "post-treatment type," which darkens the coating after plating. For more details, please feel free to contact us.

  • Other optical parts
  • Laser Components
  • others

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Joint plating

Joint plating

Introducing Mitsuya's recommended joining coatings!

■Gold-Tin Alloy Plating Gold-tin alloy plating, composed of 80% gold and 20% tin eutectic, is the optimal alloy plating for high-temperature lead-free solder materials with a melting point of 280°C. ■Tin-Antimony Alloy Plating Compared to regular tin plating, it excels in preventing tin pest and has superior heat cycle durability. ■Indium Plating Indium has a very soft, dull white appearance and is prone to scratching. Its hardness is below Hv5, and its melting point is 156.6°C. It has also proven effective in preventing contact failure as a joining tool for bundling similar vessels.

  • Wafer
  • Sensors
  • others

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Tin plating

Tin plating

Tin plating can be used in various fields!

Tin is a relatively soft metal, which makes it widely used as a material for cans for food and beverages due to its role in improving the familiarity of sliding parts in machines and protecting iron sacrificially against organic acids contained in food. It has excellent solderability and is also utilized in functional plating for automotive parts, electronic components, and contacts. It serves as an alternative to expensive gold plating and is used in various fields as a long-term reliable plating film.

  • Sensors
  • Automotive Connectors
  • others

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Electrolytic and electroless plating on Ti materials

Electrolytic and electroless plating on Ti materials

Electrolytic and electroless plating can be performed on Ti materials.

It is possible to process pure Ti (Grade 1 and Grade 2) and 64Ti (Ti-6Al-4V). Electroplating and electroless plating can be performed on pure Ti and 64Ti, and plating can be done without heat treatment.

  • power supply

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