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Polishing machine Product List and Ranking from 27 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Jul 16, 2025～Aug 12, 2025
This ranking is based on the number of page views on our site.

Polishing machine Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Jul 16, 2025～Aug 12, 2025
This ranking is based on the number of page views on our site.

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Polishing machine Product ranking

Last Updated： Aggregation Period:Jul 16, 2025～Aug 12, 2025
This ranking is based on the number of page views on our site.

  1. Belt Grinder "Bader Machine"
  2. Vibration polishing machine (art pattern polishing machine)
  3. Drill Grinder "PT-01N"
  4. 4 Manual Sample Grinder "IM-P2" [Made in Japan]
  5. 5 Horizontal Ball Grinding Machine "ND460" *Grinding Stone Diameter φ460

Polishing machine Product List

481～495 item / All 539 items

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Processing machinery - Grinding machine

Processing machinery - Grinding machine

Leave it to us for polishing machines!

Our company develops and manufactures ultra-precision processing machines, and we handle "grinding machines" as processing equipment. We offer a range of machines including ultra-large double-sided lapping machines, optical grinding machines, and oscillating single-sided grinding machines. Please feel free to contact us if you have any inquiries. 【Product Lineup】 ■ Ultra-large double-sided lapping machine: MODEL TDX-48B ■ Optical grinding machine: MODEL TOP-1200 ■ Oscillating single-sided grinding machine: MODEL TSOP-600 *For more details, please download the PDF or contact us.

  • Wafer processing/polishing equipment

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WISE Corporation Printed Circuit Board Hole Filling Paste Removal Grinding Device

WISE Corporation Printed Circuit Board Hole Filling Paste Removal Grinding Device

A completely different polishing method from the conventional one! It demonstrates high capability in removing resin, paste, and ink after the filling process.

We would like to introduce the "Filling Paste Removal Polishing Device" manufactured by WISE (Italy), which we handle. This product utilizes a completely different polishing method from conventional ones, demonstrating high capability in removing resin, paste, and ink after the filling process. The processing range for substrates is 650 and 760 mm. It can accommodate panel thicknesses from 0.3 mm up to a maximum of 12 mm. 【Features】 ■ A completely different polishing method from conventional ones ■ High capability in removing resin, paste, and ink after the filling process ■ Processing range for substrates: 650 and 760 mm ■ Panel thickness: 0.3 mm ■ Maximum panel thickness: 12 mm *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment

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Round Blade Grinder LA300 (Manufactured by MVM) [Short Delivery Time]

Round Blade Grinder LA300 (Manufactured by MVM) [Short Delivery Time]

A 'reasonable' sharpening machine for re-sharpening slitter knives!

The "LA300" is a grinding machine designed for sharpening slitter knives (upper and lower blades). This practical, convenient, and compact machine is easy to use and can grind up to an outer diameter of 300mm. Additionally, it uses a 1.5kW motor with automatic feed and allows for angle settings from 0 degrees to 70 degrees. 【Specifications】 ■ Grinding stone motor power: 1.5kW ■ Grinding stone outer diameter: 127mm ■ Table rotation speed: 3 to 35rpm ■ Maximum grindable outer diameter: 300mm ■ Machine size: 700x500x1500mm *For more details, please download the PDF or feel free to contact us.

  • Other processing machines
  • Grinding Machine
  • Other abrasives

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Round blade grinding machine / grinding machine with rotating table LA500 (manufactured by MVM)

Round blade grinding machine / grinding machine with rotating table LA500 (manufactured by MVM)

A 'reasonable' grinding machine for sharpening slitter knives of various shapes!

The "LA500" is a very versatile, unique, and user-friendly grinding machine. It features a very sturdy and high-rigidity base, and thanks to its excellent weight distribution, it operates without vibration, allowing for high-quality finishing grinding. Additionally, we also offer a version called "LA700" for grinding circular blades and discs with a diameter of up to 700mm. 【Specifications】 ■ Grinding wheel motor power: 2.2-3.7kW ■ Grinding wheel inner diameter: 150mm ■ Outer diameter of the central hole of the grinding wheel: 20mm ■ Variable speed of the rotating table: 3-35rpm ■ Diameter of the magnetic table: 300-350-400mm ■ Outer diameter of the magnetic chuck: 25mm *For more details, please download the PDF or feel free to contact us.

  • Other processing machines
  • Grinding Machine
  • Other abrasives

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Ultrasonic Polishing Device "LAPTRONμ"

Ultrasonic Polishing Device "LAPTRONμ"

Ultrasonic polishing device suitable for processing the corners of discharge targets!

"LAPTRONμ" is an ultrasonic polishing device that features the smallest diameter in the series at Φ20mm for the ultrasonic hand tool and a Φ5mm chuck. It can be used not only with ceramics and wood chips + paste but also with metal bond diamond chips. It is particularly suitable for processing corners of discharge surfaces that are prone to unevenness and for product shapes that are less than 1mm. 【Specifications】 ■ Size and Weight ・ Main Unit: W236×D160×H105 (mm) / Approx. 2.3kg ・ Hand Tool: Φ20×L120 (mm) / Approx. 57g ■ Input: AC100V 50/60HZ ■ Output: Maximum 13W, etc. *For more details, please download the PDF or feel free to contact us.

  • Wafer processing/polishing equipment

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"Super Eight Finisher" - 8-Shape Full Flow Barrel Polishing Machine

"Super Eight Finisher" - 8-Shape Full Flow Barrel Polishing Machine

Achieving efficient polishing with an 8-shaped centrifugal surface flow type.

The "Super Eight Finisher" is a fully flowing high-speed barrel polishing machine that processes various materials uniformly through an "8-shaped motion." It can be used for materials other than metal, such as resin-based works, which are prone to cracking and deformation in conventional barrel polishing machines. Additionally, it can simultaneously process different applications and workpieces, allowing for a large quantity of workpieces to be processed at once. 【Features】 ■ The "8-shaped" flow created by rotation and revolution allows for smooth and uniform finishing in a short time. ■ Wide adaptability regardless of shape or material. ■ Suitable for high-speed automatic polishing of a variety of small lots with a four-tank system. *For more details, please download the PDF or feel free to contact us.

  • Wafer processing/polishing equipment

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Ultra-compact Centrifugal Barrel Polisher 'Mini Barrel II'

Ultra-compact Centrifugal Barrel Polisher 'Mini Barrel II'

This is an ultra-compact and lightweight model of a horizontal centrifugal barrel polishing machine.

The "Mini Barrel II" is a super compact centrifugal barrel polishing machine suitable for metal polishing of ultra-small parts, widely used for small-scale production processing in small manufacturing facilities and prototype processing in various research and development departments. It addresses issues such as "the tank is too large," "there is no installation space," and "the price is too high," which prevent the introduction of barrel polishing machines in small production lines and research and development facilities. 【Features】 ■ Ideal for automating the polishing of small parts in small quantities ■ Equipped with two polishing tanks of just 250cc each ■ Ultra-compact design that can be placed on a desk or workbench ■ Achieves an affordable price for a centrifugal barrel polishing machine ■ Easily usable with a standard AC100V power supply *For more details, please download the PDF or feel free to contact us.

  • Wafer processing/polishing equipment

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Urethane rotary barrel polishing machine

Urethane rotary barrel polishing machine

Contributing to the reduction of environmental impact and total cost down in the barrel polishing process.

Our company offers a dual-purpose "urethane rotary barrel polishing machine" that excels not only in functionality but also in cost performance. Compared to conventional natural rubber (NR), it features a lining made of cast urethane resin with very high durability. Additionally, it significantly reduces the various costs, waiting times, and environmental impact associated with relining rubber linings. 【Key Points】 ■ High durability ■ Significant reduction in costs, waiting times, and environmental impact ■ Stable quality ■ Minimal thermal distortion ■ Improved maintenance workability *For more details, please download the PDF or feel free to contact us.

  • Wafer processing/polishing equipment

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[Production Achievements] Cutting Blade Grinding Machine / Three-Sided Blade Grinding Machine

[Production Achievements] Cutting Blade Grinding Machine / Three-Sided Blade Grinding Machine

Up to a blade length of 2000mm! A clean and functional edge alignment is required for both appearance and performance!

The "cutting blade sharpening machine" is a grinder used in paper mills and other facilities for sharpening cutting blades up to 2 meters in length used for cutting paper. Since blades can chip within a day, it is often used late at night to re-sharpen the blades in time for the next day's paper production. The cutting edge of the blade is thin and continuous like a Japanese sword, requiring a beautifully precise sharpening accuracy both visually and functionally. Additionally, there is a "three-way blade" sharpening machine used in binding factories that simultaneously cuts all three edges of magazines, which is equipped with a mechanism for automatic supply and discharge of the workpiece. Both types are designed for the workpiece to move, but there are also models with a moving column that have been produced. *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment

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Vibratory Automatic Polishing Machine "Vibromet 2"

Vibratory Automatic Polishing Machine "Vibromet 2"

Specialized polishing machine for final finishing. Compatible with large samples using a 12-inch polishing bowl.

Vibromet 2 can remove slight tissue alterations that occur during sample preparation without using hazardous chemicals required for electrolytic polishing, exposing the material's original structure on the analysis surface. ■ No worry about distorting the sample surface. Finishes the surface suitable for AFM and EBSD analysis. ■ Does not use hazardous chemicals. ■ No adjustments needed during polishing.

  • Testing Equipment and Devices

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Single-Sided Lap Grinding Machine "HIT-36L-3R"

Single-Sided Lap Grinding Machine "HIT-36L-3R"

We have considered ease of use with a simple design that is necessary and minimal.

The "HIT-36L-3R" is a one-sided lap grinding machine that excels in operability and maintainability. It employs a mechanism that allows for the easy attachment and detachment of the base plate using a center bolt, making it simple to replace and clean the base plate. Additionally, by adopting an optional forced drive and oscillating drive mechanism, it enables stable rotation of the workpiece, stable management of the base plate's flatness, and improvement of the workpiece's flatness. 【Table Specifications】 ■ Target Workpiece: Maximum outer diameter of approximately Φ350mm ■ Usable Table Diameter: Φ910mm without water cooling mechanism ■ Processing Axis: 3-row revolving guide rollers ■ Table Rotation Electric Motor: AC200V 3-phase 2.2kw inverter motor ■ Table Rotation Speed: Stepless variable speed 10 to 60 rpm, etc. *For more details, please download the PDF or feel free to contact us.

  • Wafer processing/polishing equipment

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Cylindrical grinding machine for SiC

Cylindrical grinding machine for SiC

Developing cylindrical polishing for SiC, which is expected to be the next-generation power semiconductor!

Based on the technology cultivated with silicon cylindrical grinding machines, we developed a cylindrical grinding machine for SiC. SiC, which is expected to be the next-generation power semiconductor, has a high processing difficulty, and we have overcome many challenges to complete it as production equipment.

  • Wafer processing/polishing equipment
  • Other semiconductor manufacturing equipment

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Tabletop Precision Grinding Device

Tabletop Precision Grinding Device

This one machine handles everything from wrapping (rough polishing) to polishing, and is capable of precision polishing of compound semiconductors such as GaAs and InP.

We support everything from lapping (coarse polishing) to polishing, and we monitor and automatically correct the surface shape of the lapping plate itself with a resolution of 0.1μm. The polishing tool communicates with the main unit, allowing for chart displays of the polishing rate, setting of target polishing amounts, and configuration of multi-recipes. Additionally, we offer chemical models compatible with CMP for compound semiconductors such as GaAs and InP, enabling high-precision, high-speed, and damage-free CMP all with a single machine. (De-layering is also possible.)

  • CMP Equipment

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