We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Printed circuit board mounting.
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Printed circuit board mounting Product List and Ranking from 74 Manufacturers, Suppliers and Companies

Last Updated: Aggregation Period:Nov 05, 2025~Dec 02, 2025
This ranking is based on the number of page views on our site.

Printed circuit board mounting Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Nov 05, 2025~Dec 02, 2025
This ranking is based on the number of page views on our site.

  1. 鳥取スター電機グループ 技術企画課(鳥取コスモサイエンス内) Tottori//Consumer Electronics
  2. クロスエフェクト Kyoto//Resin/Plastic
  3. TOPBAND JAPAN Aichi//Other manufacturing
  4. 4 和田電器株式会社 Osaka//Electronic Components and Semiconductors
  5. 5 ルックス電子 Tokushima//Electronic Components and Semiconductors

Printed circuit board mounting Product ranking

Last Updated: Aggregation Period:Nov 05, 2025~Dec 02, 2025
This ranking is based on the number of page views on our site.

  1. Tottori Cosmo Science Co., Ltd. Business Introduction 鳥取スター電機グループ 技術企画課(鳥取コスモサイエンス内)
  2. Vacuum casting for rapid prototyping and small batch production using silicone rubber molds. クロスエフェクト
  3. TOPBAND JAPAN Co., Ltd. Company Introduction TOPBAND JAPAN
  4. 4 Printed Circuit Board Assembly "Dip Carrier (Variable Width)" 和田電器株式会社
  5. 5 Not only circuit board design but also component mounting (can be handled without a metal mask). 東邦システム 本社交野工場

Printed circuit board mounting Product List

91~93 item / All 93 items

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Surface mount of electronic components in 0402 size on printed circuit boards.

Leave the printed circuit board assembly of 0402 size chip components used in small electronic parts to us. Printed circuit board assembly for ultra-small chip components.

In recent years, with the advancement of electronic components, the miniaturization of parts has been rapidly progressing. We often hear concerns about the difficulty in finding assembly companies that can handle extremely small sizes like the 0402 chip. Our company engages in various printed circuit board assembly, board assembly, and the development and manufacturing of FA equipment, and we can accommodate assembly components from 0402 to high-density and closely spaced types like CSP and BGA. We have 9 assembly lines (6 of which are equipped with our own developed board warpage prevention system), and we also have axial and radial processes. We welcome factory tours, so please feel free to consult with us. *For more details, please refer to the PDF materials or feel free to contact us.*

  • Surface treatment contract service
  • Contract manufacturing
  • Embedded system design service

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Supports inspection equipment such as AOI and rework! Printed circuit board assembly.

Leave printed circuit board assembly to Lux Electronics! We have the know-how backed by actual production experience.

In recent years, the miniaturization of electronic components has rapidly progressed alongside their increased functionality. Many companies possess mounting machines compatible with 0402 components, but our company also supports inspection equipment such as AOI and rework. 【Features of LUX Electronics' Printed Circuit Board Assembly】 ■ 9 lines in total ■ Supports the latest cutting-edge surface mounting technology ■ Labor-saving and cost reduction through in-house developed systems ■ Short delivery system ■ Capable of integrated production from assembly process to completion ■ Increased productivity through process improvements using in-house developed products *For more details, please refer to the PDF materials or feel free to contact us.

  • Surface treatment contract service
  • Contract manufacturing
  • Embedded system design service

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Puriken Co., Ltd. Printed Circuit Board Assembly

Align the mounting surface of components that cannot be reflowed twice! Heavy components will be placed on the back side of the assembly.

We would like to introduce "implementation," which is a key point in our design. Since the temperature behind tall components tends to rise less, we consider the flow direction of reflow when arranging components. If it leads to mass production, we will adjust the pad dimensions, shapes, and mounting pitch to match the specifications of the mass production factory. 【Features】 ■ Align the mounting surface of components that cannot undergo double reflow Heavier components are placed on the back side of the mounting ■ Arrange components considering the flow direction of reflow ■ Match the thermal capacity of the land on both sides of chip components as much as possible ■ Consider the space for soldering iron for hand-placed components *For more details, please feel free to contact us.

  • Circuit board design and manufacturing

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