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Processing System Product List and Ranking from 21 Manufacturers, Suppliers and Companies

Last Updated: Aggregation Period:Jul 30, 2025~Aug 26, 2025
This ranking is based on the number of page views on our site.

Processing System Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Jul 30, 2025~Aug 26, 2025
This ranking is based on the number of page views on our site.

  1. RATTUNDE Aichi//Industrial Machinery
  2. null/null
  3. オプトン Kanagawa//Industrial Machinery
  4. 4 シュロニガージャパン Tokyo//Industrial Machinery (Komaxグループ)
  5. 4 ダイナミックツール Kyoto//Machine elements and parts 本社(京都)

Processing System Product ranking

Last Updated: Aggregation Period:Jul 30, 2025~Aug 26, 2025
This ranking is based on the number of page views on our site.

  1. RATTUNDE ACS(R) Fully Automatic High-Speed Cutting Processing System RATTUNDE
  2. Processing system through information linkage between pipe bending robot and non-contact 3D measuring device. オプトン
  3. Precision Laser Wire Processing System "GEMINI-4" シュロニガージャパン (Komaxグループ)
  4. HIT Non-Contact Ultrasonic Processing System ダイナミックツール 本社(京都)
  5. 4 Molding Processing System "GO MOLDING SYSTEM" 郷製作所

Processing System Product List

31~35 item / All 35 items

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HIT Non-Contact Ultrasonic Processing System

Non-contact ultrasonic processing system

HIT's non-contact ultrasonic tool holder allows for efficient machining of complex shapes using demanding advanced materials such as ceramics, quartz glass, tungsten carbide, Inconel, fiberglass, and even composite materials, simply by combining it with your existing tools, thereby enhancing productivity. By applying ultrasonic vibrations to the tool's rotation, it reduces wear between the tool and the workpiece and facilitates chip removal. It decreases cutting resistance, improves machining efficiency and tool life, and minimizes edge cracks and burrs, achieving an excellent surface finish of Ra<0.1mm. By supplying energy to the tool non-contact, it enables the exchange of multiple ultrasonic tool holders and standard tool holders via an automatic tool changer (ATC).

  • Other cutting tools

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YAG laser thin film processing system

Can be used for various applications! Such as patterning of organic devices and cutting of metal wiring for ICs, etc.

We provide a YAG laser thin film processing system that is widely used for semiconductor development, failure analysis, and repair applications such as FPD. It offers stable, high-quality laser irradiation at both high and low power, significantly reducing the impact on the substrate and surrounding areas, and enabling high-quality laser processing on materials different from conventional ones. **Main Applications:** - Removal of protective films and organic thin films using DUV lasers - Cutting and removal of IC metal wiring such as gold and aluminum, exposing underlying patterns - Drilling for EB testers and probing - Pre-treatment for FIB (such as pre-processing), pre-treatment for SEM, TEM, etc. (such as marking) - Precise transfer of laser marks from the back surface of samples to the front using failure analysis equipment - Simple photomask creation and photomask modification - Correction of various defects in FPDs: CF protrusion correction, OC foreign matter protrusion correction, ITO short cutting, etc. - Direct patterning on organic films and correction of pattern collapse - Spot annealing - Integration into electrical measurement systems for defect and failure analysis, etc. We can customize and provide integration into various devices such as semi-auto systems and probers for a wide range of applications.

  • Semiconductor inspection/test equipment

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