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Low-cost Sub-THz Non-destructive 3D Scanner TeraScan100

It is a simple inspection tool that enables 3D sub-terahertz NDT non-destructive testing sensing and imaging.

◆ Low-cost Sub-THz inspection tool ◆ 3D terahertz imaging scanner ◆ Equipped with THz FMCW radar transceiver ◆ Imaging area 300 x 300mm² ◆ Dynamic range representative value 60dB ◆ Maximum acquisition rate 10Hz ◆ User-friendly design with plug & play ◆ 3D data acquisition software TeraScan Easy included ◆ 3D visualization software TeraVisio 3D included *PDF catalog is available for download. Please contact us for more details.

  • Other inspection equipment and devices

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2-axis galvanometer scanner

It is an XY deflection unit that deflects and focuses laser beams in two dimensions.

● Deflecting and focusing lasers in two dimensions ● For applications requiring high-speed processing ● Compact design ● Digital control Raylase's two-axis galvanometer scanner is an XY deflection unit that deflects and focuses laser beams in two dimensions. It is ideal for various applications that require high-speed processing in a medium-sized processing area. *For more details, please download the PDF or contact us.*

  • Other processing machines

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3-axis galvanometer scanner

A 3D deflection unit that adds a Z-axis to a 2D XY deflection unit, enabling processing in three dimensions.

- 3D compatible (X, Y, Z axes) - Capable of scanning up to 2000mm x 2000mm with a small spot diameter - Can process three-dimensional parts and surfaces with irregularities - Robust and sturdy design - All-in-one solution for changing working distance and scan area The 3-axis galvanometer scanner is a three-dimensional deflection unit that adds a Z-axis to the 2D XY deflection unit, enabling three-dimensional processing. It is suitable for on-the-fly applications that involve processing moving targets, as well as for handling three-dimensional parts and surfaces with irregularities through setup. It can also handle processing over a wide scanning area of up to 2000 mm x 2000 mm with a small spot diameter. It is robust, fast, and offers excellent flexibility. Furthermore, a single unit can change working distance, scan area, and spot size. It can be used with various lasers such as Nd:AG, diode, and CO2 lasers. *You can download the PDF catalog. Please contact us for more details.

  • Other processing machines

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High-speed laser defect scanner for substrates

Defect inspection imaging device that visualizes defects in substrates such as glass substrates, semiconductor substrates, and display substrates.

High-speed laser defect scanner for substrates, PrimaScan series. It is a defect inspection imaging device that visualizes defects on substrates such as glass substrates, semiconductor substrates, and display substrates. It achieves high-speed measurements and high PSL particle sensitivity in the nanometer range. Compatible with transparent, translucent, and opaque substrates. The lineup includes PrimaScan, PrimaScan R&D, and PrimaScan P, catering to sample sizes up to 600mm x 600mm. It can be used for wafer incoming inspection, wafer chuck inspection, inspection of blanket films (wafer with film), inspection of internal stress and gaps in micro-lens arrays for AR/VR/MR applications, and inspection of coating defects in photoresists.

  • Circuit Board Inspection Equipment

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SiC GaN wafer photoluminescence-compatible defect scanner

High-speed laser defect scanner compatible with photoluminescence mapping.

It has been developed to meet the needs for subsurface defect inspection and classification functions of silicon carbide (SiC) and gallium nitride (GaN) based wafers and compound semiconductor materials. A variety of wafer processing options are available, minimizing the cost per pass while providing best-in-class throughput and sensitivity, catering to both research and development and mass production.

  • Circuit Board Inspection Equipment

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