Basic Knowledge of Sputtering
Free technical data available! Enables precise and hard film formation! Applicable to the production of automotive mirrors and more.
There are several methods for forming thin films on the surfaces of substrates such as film and glass, including coating, printing, plating, and vapor deposition. However, the technique used to accurately form nano-level thin films composed of metals or ceramics is called "sputtering." In actual sputtering, the role of the "stone" is played by inert gases such as argon (Ar) that are filled in a vacuum container (vacuum chamber). In sputtering, argon gas is introduced into the vacuum, and a negative voltage is applied to the target material, generating a glow discharge, which is also used in fluorescent lights. The positively charged, plasma-formed argon ions then collide with the surface of the target material at ultra-high speeds (about 3.2 km per second), violently ejecting particles (atoms and molecules) from the target material. The ejected particles adhere vigorously to the surface of the substrate, and as they accumulate, a thin film is formed. This is the principle of sputtering. *For more detailed information, please refer to the related links. For further inquiries, feel free to contact us.*
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