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Substrate×三和電子サーキット - List of Manufacturers, Suppliers, Companies and Products

Substrate Product List

16～30 item / All 40 items

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Thin plate bending substrate

Thin plate bending substrate

Surface treatment includes heat-resistant preflux and electroplating/non-electrolytic gold plating! Compatible with routers.

The "Thin Plate Bending Substrate" is a substrate that serves as an alternative to flexible substrates, using thin glass epoxy substrates (FR-4) with a thickness of 0.1mm or less, which are used for several bends or bending during assembly. Applications include LED lighting substrates used on curved surfaces, substrates that require component mounting and bending, and substrates for connections between boards, all suitable for several bends. Please feel free to contact us when you need assistance. 【Specifications (partial)】 ■ Number of layers: Single-sided / Double-sided ■ Thickness: 0.06 to 0.1mm ■ Minimum bending radius: Can be bent up to 5 times at R1.5 ■ Outline processing: Router compatible *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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End face through-hole substrate. Our unique processing solves copper burrs and powder drop!

End face through-hole substrate. Our unique processing solves copper burrs and powder drop!

We will solve the implementation issues and challenges arising from the miniaturization of electronic components with our special structures such as edge-through-hole boards and laminated boards.

End face through holes are formed by cutting through holes created at the edges of the substrate using contour processing. Traditionally, copper burrs were generated during the cutting of through holes, but our company can provide end face through holes without burrs even with router processing thanks to our unique process. Additionally, this unique process allows for the partial etching of landless through holes and the copper plating of through holes. In printed circuit boards for electronic device applications such as compact modules, miniaturization and heat dissipation are required. Our company offers special structure printed circuit boards tailored to your needs, such as metal cavity structure boards and three-dimensional structure boards through lamination.

  • Circuit board design and manufacturing

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Sanwa Electronics Circuit Co., Ltd. Business Introduction

Sanwa Electronics Circuit Co., Ltd. Business Introduction

We will take on and respond to all kinds of special substrates.

Sanwa Electronic Circuit Co., Ltd. was established in 1955 as Sanwa Electric Manufacturing Co., Ltd. and has consistently engaged in the production of printed circuit boards for over half a century. Currently, with the dramatic evolution of electronic devices, printed circuit boards are required to fulfill new roles beyond their traditional electrical functions, including thermodynamic, optical, and structural roles, necessitating different perspectives and ideas in manufacturing. To swiftly respond to these customer needs, we integrated our group companies involved in printed circuit boards in 2004, marking a new beginning as Sanwa Electronic Circuit Co., Ltd. Through this integration, we have consolidated the development, production, and sales capabilities cultivated over many years by our group companies, establishing a system that can comprehensively meet QCD (Quality, Cost, Delivery) requirements while maintaining and developing a production system that leverages the unique characteristics of each factory. This has allowed us to build a flexible production system capable of accommodating a wide range of product specifications and lot sizes, from small to large. Moving forward, we will focus on strengthening our proposal-based sales capabilities and enhancing the development, production technology, and production management necessary to realize this. For more details, please contact us or download our catalog.

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Device substrate (LED substrate, sensor substrate)

Device substrate (LED substrate, sensor substrate)

We can accommodate a substrate thickness of 0.04mm! We respond widely to our customers' needs.

The "device substrate" becomes a single electronic component by mounting elements through bonding and other methods. As the miniaturization of electronic components has progressed in recent years, device substrates are also required to be smaller and thinner. Our company can accommodate substrate thicknesses starting from 0.04mm, and we respond widely to our customers' needs. 【Our Specifications】 ■ Thickness: 0.04mm to 5.0mm ■ Hole diameter: φ0.1 and above ■ Materials: BT resin, FR-4 (including HF), G-10, high heat-resistant substrates *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing

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Printed circuit board "double-sided board"

Printed circuit board "double-sided board"

The substrate mainly uses FR-4 and CEM-3 materials! We provide circuit boards tailored to your needs.

A "double-sided board" is a printed circuit board that forms circuits on both sides of the substrate and connects the circuits on both sides through plated through holes. Our company offers various substrates tailored to applications, including high-density boards for miniaturization and increased component placement flexibility, thin boards, COH boards, edge-plated through-hole boards, and thick copper boards for high current applications. We can also accommodate requests for short delivery times, and we mainly use FR-4 and CEM-3 materials as the substrate. 【Features】 ■ Mainly uses FR-4 and CEM-3 materials as the substrate ■ Can accommodate requests for substrates with high heat resistance and other specifications ■ Can respond to requests for short delivery times *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing

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Printed circuit board "Single-sided board"

Printed circuit board "Single-sided board"

We accommodate requests for short delivery times! We provide circuit boards tailored to various applications.

A "single-sided board" is a printed circuit board that has circuits formed only on one side of the substrate. Our company offers various types of boards tailored to different applications, including high-density single-sided boards for miniaturization and increased component mounting density, as well as power boards that can handle high currents. We can also accommodate single-sided boards that excel in soldering using special molds. Additionally, we respond to requests for small lot sizes, router-processed products, and short delivery times. 【Features】 ■ The base materials primarily used are FR-4, CEM-3, and FR-1. ■ We can also accommodate single-sided boards that excel in soldering using special molds. ■ We respond to requests for small lot sizes, router-processed products, and short delivery times. *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing

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High thermal conductivity substrate "Copper Inlay Substrate" *Includes comparison materials for thermal dissipation state.

High thermal conductivity substrate "Copper Inlay Substrate" *Includes comparison materials for thermal dissipation state.

We offer a substrate embedded with copper coins to efficiently dissipate heat.

Among the diversifying electronic components, there are those that generate a significant amount of heat during operation. To efficiently dissipate the heat from such electronic components, Sanwa Electronic Circuit offers substrates embedded with copper coins. These are ideal for applications such as power supply boards and high-frequency boards. 【Features】 ○ Solutions for heat dissipation measures (enhanced heat dissipation effect and improved design flexibility) ○ Heat dissipation measures for high heat-generating elements → Various copper inlay substrates can be adopted, ranging from 2-layer to high-multilayer boards. For more details, please contact us or download the catalog.

  • Printed Circuit Board

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Build-up substrate

Build-up substrate

Mounting of narrow-pitch electronic components due to the build-up structure! Compatible with chip-on-hole.

We would like to introduce our "Build-Up Boards." We can accommodate layer counts from 4 to 16 layers, and the VIA structure can support various inter-layer connections through laser and drill processing. Additionally, we can handle narrow pitch BGA/CSP mounting, impedance control, and various substrate materials tailored to different applications. 【Features】 ■ Layer count: Supports from 4 to 16 layers ■ VIA structure: Supports various inter-layer connections through laser and drill processing ■ Compatible with narrow pitch BGA/CSP mounting ■ Supports impedance control ■ Various substrate materials available for different applications ■ Chip-on-hole compatible *For more details, please refer to the PDF document or feel free to contact us.

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IVH substrate

IVH substrate

By using various VIA structures, we provide substrates tailored to your needs!

We would like to introduce the "IVH substrate" that we handle. It supports layer counts from 4 layers to 20 layers, and the VIA structure can accommodate various interlayer connections. It also supports ultra-small diameter VIAs. Additionally, it is compatible with impedance control and chip-on-hole, and we can provide various substrate materials tailored to different applications. 【Features】 ■ Layer count: Supports from 4 layers to 20 layers ■ VIA structure: Supports various interlayer connections ■ Supports ultra-small diameter VIAs ■ Supports impedance control ■ Various substrate materials available for different applications ■ Supports chip-on-hole *For more details, please refer to the PDF document or feel free to contact us.

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End face through-hole substrate

End face through-hole substrate

Contributing to the miniaturization of device substrates and module substrates, as well as the improvement of implementation density on motherboards!

We would like to introduce our "Edge Through-Hole Boards" that we handle. They enable high-density mounting, significantly contributing to the miniaturization of device boards and module boards, as well as improving the mounting density of motherboards. Additionally, we have established mass production technology for narrow-pitch edge through-holes. Please feel free to contact us when you need assistance. 【Features】 ■ Enables high-density mounting ■ Allows for the miniaturization of device boards and module boards ■ Significantly contributes to improving the mounting density of motherboards *For more details, please refer to the PDF document or feel free to contact us.

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Aluminum base substrate

Aluminum base substrate

We offer substrates tailored for various applications that require heat dissipation! Aluminum thickness can be accommodated up to 2.00mm.

The "aluminum base substrate" we handle is a high heat dissipation substrate that utilizes the heat dissipation properties of aluminum. We provide substrates tailored for various applications that require heat dissipation, with aluminum thickness options of 1.00mm, 1.50mm, 2.00mm, and a special specification of 0.30mm. For other specifications such as insulation layer thickness, thermal conductivity, and copper foil thickness, please feel free to consult us. 【Features】 ■ High heat dissipation substrate that utilizes the heat dissipation properties of aluminum ■ Substrates provided for various applications requiring heat dissipation *For more details, please refer to the PDF materials or feel free to contact us.

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Multilayer substrate

Multilayer substrate

From 4 layers to 36 layers! We provide high-precision multilayer PCBs tailored to the needs of high multilayer/high density.

We would like to introduce the "multilayer boards" that we handle. We can accommodate layer counts from 4 layers to 36 layers, with board thicknesses ranging from thin boards to a maximum of 8mm. We also support micro-diameter vias and impedance control. Additionally, we offer various substrate materials tailored to different applications, and we can accommodate chip-on-hole designs as well. 【Features】 ■ Layer count: Supports from 4 layers to 36 layers ■ Board thickness: Supports from thin boards to a maximum of 8mm ■ Supports micro-diameter vias ■ Supports impedance control ■ Various substrate materials available for different applications ■ Supports chip-on-hole designs *For more details, please refer to the PDF document or feel free to contact us.

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High Thermal Conductivity Substrate "Bending Aluminum Base Substrate"

High Thermal Conductivity Substrate "Bending Aluminum Base Substrate"

The intended use is for automotive decorative accessories, etc.! A thin aluminum base substrate with a thickness of 0.40mm.

We would like to introduce our high thermal conductivity substrate, the "Bendable Aluminum Base Substrate." One of its features is that it has flexibility similar to that of a flexible circuit while being able to maintain a bent shape, which is a significant advantage. It also possesses heat dissipation properties as an aluminum base substrate. Please feel free to consult us when you need assistance. 【Features】 ■ Thickness: 0.40mm ■ Flexibility similar to that of a flexible circuit ■ Ability to maintain a bent shape ■ Also possesses heat dissipation properties *For more details, please refer to the PDF document or feel free to contact us.

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High-speed signal and high-density substrate "IVH substrate"

High-speed signal and high-density substrate "IVH substrate"

Supports IVH substrates from 4 layers to 20 layers! Component mounting on the surface of the IVH section is also possible.

We would like to introduce our high-speed signal and high-density substrate, the "IVH substrate," which we handle. By using the IVH structure, we can achieve high density tailored to our customers' needs. Additionally, we can accommodate low dielectric materials for high-frequency applications. Please feel free to consult us when you need assistance. 【Features】 ■ Supports IVH substrates from 4 layers to 20 layers ■ High density tailored to customer needs ■ Component mounting on the surface of the IVH part is possible, compatible with chip-on-hole ■ Impedance control is possible ■ Can also accommodate low dielectric materials for high-frequency applications *For more details, please refer to the PDF document or feel free to contact us.

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Bonding substrate

Bonding substrate

Miniaturization of devices, heat dissipation applications, and printed circuit boards tailored to individual product implementations!

Our company is capable of providing custom-designed printed circuit boards (PCBs) that meet your specific requirements, thanks to our special three-layer substrates and the bonding structures of materials and copper foils. Applications include device substrates and substrates with bonded structures of metals (such as copper foil and aluminum) or other materials. Printed circuit boards for devices require structures that accommodate miniaturization, heat dissipation, and individual product implementations. 【Applications】 ■ Device substrates ■ Substrates with bonded structures of metals (such as copper foil and aluminum) or other materials *For more details, please refer to the PDF document or feel free to contact us.

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