We offer substrates tailored for various applications that require heat dissipation! Aluminum thickness can be accommodated up to 2.00mm.
The "aluminum base substrate" we handle is a high heat dissipation substrate that utilizes the heat dissipation properties of aluminum. We provide substrates tailored for various applications that require heat dissipation, with aluminum thickness options of 1.00mm, 1.50mm, 2.00mm, and a special specification of 0.30mm. For other specifications such as insulation layer thickness, thermal conductivity, and copper foil thickness, please feel free to consult us. 【Features】 ■ High heat dissipation substrate that utilizes the heat dissipation properties of aluminum ■ Substrates provided for various applications requiring heat dissipation *For more details, please refer to the PDF materials or feel free to contact us.
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basic information
[Aluminum Thickness] ■0.30mm (Special Specification) ■1.00mm ■1.50mm ■2.00mm *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Leave the design and manufacturing of printed circuit boards to us! <Sanwa Electronics Circuit Company Information>
Company information
Sanwa Electronic Circuit produces printed circuit boards used in various aspects of daily life, including smartphones, car navigation systems, computers, wireless devices, ETC, automotive equipment, and medical devices. Our company was founded in 1955 as Sanwa Electric Manufacturing Co., Ltd. After expanding production and sales through four group companies specializing in circuit boards, we integrated these companies in 2004 and launched as Sanwa Electronic Circuit Co., Ltd. with a new divisional structure. During this time, thanks to the guidance and support of our clients, we have developed and grown as a dedicated printed circuit board company for over half a century, advancing alongside the progress of printed circuit boards. We sincerely appreciate your continued support and patronage.
![Aluminum base substrate [Noise and heat countermeasures with aluminum grounding]](https://image.mono.ipros.com/public/product/image/60e/2000453850/IPROS74680725463744925251.jpeg?w=280&h=280)
![[Problems with Aluminum-Backed Boards] I want to adopt them, but the commercially available ones do not match the specifications.](https://image.mono.ipros.com/public/product/image/916/2000751845/IPROS67610094923306362105.jpeg?w=280&h=280)
![[Concerns about Device Assembly] It requires technology to mount the circuit board onto the aluminum casing.](https://image.mono.ipros.com/public/product/image/881/2000751842/IPROS53284928688238343837.jpeg?w=280&h=280)
![Understand in 3 minutes! A substrate that dissipates heat faster [Materials available].](https://image.mono.ipros.com/public/product/image/1ab/2001482620/IPROS9539451614471571514.jpg?w=280&h=280)
