[Concerns about Device Assembly] It requires technology to mount the circuit board onto the aluminum casing.
Achieving grounding of the aluminum section! This improves the usability and design flexibility of the aluminum section. By pre-installing and securing with screws, labor reduction becomes possible!
When it comes to aluminum base substrates, the mainstream products are those that have an insulating layer pre-attached to aluminum, released by substrate material manufacturers. However, this limits the choice of aluminum thickness and the dielectric constant of the substrate to only what is available in the existing lineup, imposing restrictions on design. Therefore, our company has made it possible to create aluminum base substrates using a unique method that bonds the substrate material to aluminum, allowing for customization according to your specifications. This significantly enhances design flexibility, enabling requests such as increasing aluminum thickness or using high-dielectric materials like Teflon or PPE for miniaturization. Additionally, it is possible to process the substrate after bonding, allowing for the creation of cavities for mounting components by machining only the substrate portion. 【Features (Aluminum Base Through-Hole Substrate)】 ■ Method of bonding substrate material and aluminum - High-frequency bonding film - Eutectic solder (lead-free options available upon consultation) ■ Realization of GND connection for the aluminum part ■ Dramatic improvement in the usability of the aluminum part ■ Automatic mounting via reflow is also possible (in cooperation with partner companies) *For more details, please refer to the PDF document or feel free to contact us.
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【Features (Solder Bonded Aluminum Base Substrate)】 ■ There are two types of bonding methods, which can be selected based on budget and application. ■ A method that adheres aluminum and the substrate using a bonding sheet. ■ A method that melts the solder plating applied to the aluminum using heat press, bonding it with the copper foil part of the substrate through alloying. ■ The aluminum part is grounded and has the same performance as aluminum base through-hole substrates. ■ Miniaturization of through-holes is possible. ■ Design flexibility is improved. * For more details, please refer to the PDF materials or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Since our establishment, Kyoei Electric Co., Ltd. has consistently provided products that satisfy our customers based on the philosophy of "coexistence and co-prosperity with society," contributing to societal development for half a century through our business activities. Our "trading business," which handles a wide range of electronic, electrical, and industrial materials and components, as well as manufacturing equipment and office automation devices, and our "manufacturing business," which conducts integrated production from the design and development to mass production of printed circuit boards, are the two wheels that drive our company. We are fully committed to leveraging the characteristics of these two businesses to coordinate products and technology, providing various values globally in response to the demands of the times. Additionally, aiming to enhance customer satisfaction, we have obtained ISO 9001 certification for our quality management system, and further, in line with our policy of being an "environmentally friendly company," we have obtained ISO 14001 certification for our environmental management system. Moving forward, we will continue to strive to meet our customers' needs at a high level with the "co-prosperityism" that we have cultivated since our founding.