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Substrate(IGBT) - List of Manufacturers, Suppliers, Companies and Products | IPROS GMS

Last Updated： Aggregation Period:Jun 24, 2026～Jul 21, 2026
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Substrate Product List

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Ceramic substrate (alumina, aluminum nitride)

Ceramic substrate (alumina, aluminum nitride)

Alumina (Al2O3) and aluminum nitride (AlN) compatible. High thermal conductivity substrate for IGBT and power devices.

We provide ceramic substrates for power devices and IGBT applications that require high heat dissipation and high insulation. We offer two types: alumina (Al2O3, thermal conductivity ≧ 24W/m·K) and aluminum nitride (AlN, thermal conductivity ≧ 170W/m·K). Our products support DPC (operating temperature -55 to 350℃) and DBC (-55 to 800℃), with high-precision processing capabilities for maximum dimensions of 128×178mm, minimum pattern width of 0.100mm/pattern spacing of 0.075mm, and minimum hole diameter of 0.1mm.

  • Circuit board design and manufacturing
  • Substrate

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Metal matrix composite substrate Baseplate

Metal matrix composite substrate Baseplate

High thermal conductivity, low expansion, high rigidity, strong bonding, good weldability.

AlSiC substrates are widely used in equipment equipped with high-power IGBT modules due to their excellent thermodynamic and mechanical properties.

  • Other metal materials
  • Substrate

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Bus bar (bus bar) high current substrate

Bus bar (bus bar) high current substrate

By substrate-izing the busbar, high insulation and compactness are achieved!

We have substrate-ized busbars used for high current applications. By utilizing our special technology for substrate-ization, we achieve high insulation properties and a compact, lightweight design. We can accommodate lengths of up to 1,000mm. Additionally, substrate-ization offers the following benefits: - Mounting of power devices such as IGBTs and SiCs on the substrate. - After substrate mounting, installation into equipment is possible, leading to reduced assembly time and prevention of miswiring. - Space-saving due to simplified substrate and wiring, resulting in overall equipment miniaturization. - The greatest advantage of substrate-ization is its high insulation performance and usability. The insulation layer made with prepreg has a consistent thickness, eliminating concerns about variations in thickness like those seen with powder coating. - By covering areas other than the necessary parts with the substrate, handling becomes easier, and work during transportation and installation can be performed safely. *For more details, please refer to the PDF document or feel free to contact us.

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  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Substrate

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Thick copper busbar substrate and coil substrate [Proven up to a copper thickness of 3.0mm]

Thick copper busbar substrate and coil substrate [Proven up to a copper thickness of 3.0mm]

By substrate-izing busbars and coils used for high current applications, high insulation properties and a reduction in labor hours are achieved!

We have substrate-mounted busbars and coils used for high current applications in the heavy electrical and automotive industries. By substrate mounting, the following effects can be expected: - Substrate mounting of power devices such as IGBTs and SiCs - Installation on equipment after substrate mounting → Reduction of assembly work and prevention of miswiring - Space-saving due to substrate mounting and simplification of wiring → Miniaturization of the entire device - Generally, a thick copper substrate refers to a substrate with a copper foil thickness of 200μ (0.2mm) or more, but we have also achieved substrate mounting with 3000μ (3mm) copper plates. - The greatest advantage of substrate mounting is its high insulation performance and usability. The insulation layer using prepreg has a consistent thickness, so there is no concern about variation in thickness like with powder coating. - By covering areas other than the necessary parts with the substrate, handling becomes easier, and work during transportation and installation can be performed safely. *For more details, please refer to the PDF document or feel free to contact us.

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  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Substrate

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Metal-based heat dissipation substrate with low thermal expansion coefficient

Metal-based heat dissipation substrate with low thermal expansion coefficient

For the electrical wiring in the engine room and the gasoline tank meter! Compared to glass epoxy substrates, it has a lower coefficient of thermal expansion and stronger resistance to heat.

The "metal-based heat dissipation substrate" is a substrate that improves heat dissipation through thermal conduction, alleviating thermal issues. There are applications in high-brightness LED lighting (for vehicles and floodlights), as well as in automotive electrical components, ECUs, EPS, and DC/DC converters. Compared to standard glass epoxy substrates, it has a lower thermal expansion coefficient and greater resistance to heat. 【Features】 ■ A substrate that improves heat dissipation through thermal conduction by using metal as the base ■ Compared to standard glass epoxy substrates, it has a lower thermal expansion coefficient and greater resistance to heat *For more details, please refer to the PDF materials or feel free to contact us.

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  • Wiring materials
  • Substrate

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Special Printed Circuit Board "Metal Substrate"

Special Printed Circuit Board "Metal Substrate"

Metal materials can be selected from aluminum and copper! Utilizing thermal conductivity to enhance thermal diffusion.

A "metal substrate" is a printed circuit board that enhances thermal diffusion by utilizing the thermal conductivity of metal. Metal materials can be selected from aluminum or copper, and when using a copper core substrate, through-hole conduction with the copper core is also possible, allowing for applications such as ground and thermal conduction through-holes. As a common heat dissipation method, metal base substrates dissipate heat through the base metal on the back via heat sinks or enclosures, while metal core substrates can be mounted on the circuit side of the board or machined to expose the base metal, allowing contact with heat sinks or enclosures for heat dissipation. 【Features】 ■ Enhances thermal diffusion by utilizing the thermal conductivity of metal ■ Two types: metal base substrate and metal core substrate ■ Metal materials can be selected from aluminum or copper ■ Through-hole conduction with the copper core is possible when using a copper core substrate *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • others
  • Substrate

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Printed circuit board, metal substrate

Printed circuit board, metal substrate

Metal core substrate with excellent heat dissipation and heat resistance.

By machining the substrate to expose the metal core and directly mounting heat dissipation components such as heat sinks, it is possible to efficiently release the heat from components that operate at high temperatures to the outside.

  • Printed Circuit Board
  • Substrate

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Busbar for Data Centers - High Current Board

Busbar for Data Centers - High Current Board

A substrate for data centers that achieves high insulation properties and miniaturization.

In data center power supply systems, stable power supply and space-saving are required. Especially as density increases, improving power supply efficiency and addressing heat generation are crucial. The reliability of busbars is directly linked to the stable operation of the system, making high insulation and secure connections essential. Our busbars (bus bars) for high current substrates address these challenges. 【Usage Scenarios】 - Power units for data centers - Power supply within server racks - Power systems requiring high-density mounting 【Benefits of Implementation】 - Improved safety due to high insulation - Enhanced system efficiency through space-saving - Reduced assembly labor and prevention of wiring errors - Miniaturization of the entire device

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Substrate

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