Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
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16～30 item / All 39 items
We consistently carry out everything from crystal growth of single crystal sapphire to cutting, grinding and polishing, PSS processing, GaN epitaxial growth, and special processing!
In the doujin industry, we mainly provide sapphire materials using the Kyropoulos method. Our sapphire substrates are produced in domestic factories as well as through contract manufacturing with reputable overseas manufacturers.
Over 10 years of manufacturing experience for substrates for thermoelectric modules (Peltier elements). For power devices, solid-state relays (SSR), and more!
This is an insulating substrate for heat dissipation, which has a copper circuit board bonded to an alumina ceramic substrate using the DCB (Direct Copper Bond) method. *DCB (Direct Copper Bond) method refers to the technique of bonding a copper circuit board to a ceramic substrate through eutectic reaction. **Features** - Over 10 years of manufacturing experience for substrates used in thermoelectric modules (Peltier elements). - Manufactured at a 100% wholly-owned subsidiary in China. - Options for alumina ceramic white boards from Japan, Germany, or China. - The ceramic substrate can flexibly accommodate various external dimensions through mold processing, laser processing, etc. - The ceramic white board and copper plate are bonded using in-house equipment, and copper plating processes such as etching are applied before shipment. - The surface of the copper circuit can be treated in various ways, including untreated, Ni plating, and Ni + Au plating. *For more details, please contact us or download the PDF.*
![Substrates, etc. Brain Power [Authorized Dealer]](https://image.mono.ipros.com/public/product/image/4b3/2001525336/IPROS2031350881699948693.png?w=280&h=280)
From memory modules to 5G optical transceivers and rigid-flex. PCB technology that excels in high density and high reliability.
Brain Power (Qing Yuan) Co., Ltd. is a PCB specialized manufacturer and a JEDEC member headquartered in Guangdong, China, with a large-scale factory. The company handles double-sided, multilayer, HDI, FPC, rigid-flex, high-frequency, and optical module compatible boards, with a maximum monthly production capacity of 120,000 square meters and an average of 1,200 employees, developing high-density and high-performance products for the global market. Major customers include memory module, SSD, automotive equipment, and communication equipment manufacturers.
High heat resistance and high strength! Ceramic wiring board using DPC plating method.
The "DPC substrate" is a ceramic wiring substrate that offers higher heat resistance and strength than conventional thick-film printed circuit boards. It is a substrate using the DPC (Direct Plated Copper) plating method, compatible with various materials such as alumina (Al₂O₃), aluminum nitride (AlN), silicon nitride (Si₃N₄), and glass. 【Specifications】 ■ Base material: Compatible with various materials including alumina, aluminum nitride, silicon nitride, and glass ■ Conductor thickness: 10 to 100 μm *For more details, please refer to the PDF document or feel free to contact us.
CHIN POON INDUSTRIAL CO., LTD.
Chinpoon Industrial Co., Ltd. was established on September 26, 1979, and is a specialized company in the manufacturing of single-sided, double-sided, multilayer, and built-up printed circuit boards. Until now, our company has focused on manufacturing and services to ensure customer satisfaction. Furthermore, we have developed manufacturing capabilities for carbon printing and silver through-holes, becoming one of the leaders in printed circuit boards in the Southeast Asian region. By introducing advanced technology and the latest related equipment, we have maintained an automated production process to meet our customers' demands for delivery times and quality. Additionally, through CAM operations via our in-house network, we provide speedy sample manufacturing and quality services. Our company is dedicated to maintaining quality and providing better services to our customers. As we face the challenges of the 21st century, Chinpoon will continue to take further steps toward success through quality, price, delivery, service, and cooperation with our work partners.
We offer custom products such as 100-200mm bonded wafers (SOI, SiSi), dielectric separation, and deep trench etching with a high aspect ratio.
Icemos Technology is a best-in-class supplier of MEMS and advanced engineering substrates. With over 20 years of experience, Icemos promises that all customers will receive excellent service from inquiry to product delivery, backed by exceptional manufacturing skills and the latest technological developments. Our engineering team provides technical support for innovative product development, design proposals, and special services. If existing products are not listed, we will also develop unique special products in collaboration with our customers. This is the service that sets us apart. SOI = Silicon on Insulator SiSi = Silicon Silicon bonded DSOI = Double SOI DSP = Double Sided Polished CSOI = Cavity SOI Thin SOI TSOI = Trench SOI TSV = Through-Silicon Vias Foundry services Please feel free to contact us. http://jp.icemostech.com/products.html
Achieves ultra-thin, flat, compact design with low ESR (Equivalent Series Resistance).
CAP-XX's electric double-layer capacitors (supercapacitors) are the world's thinnest at 0.6mm thick, compact yet high-capacity, and feature a high energy density, allowing for high output even under peak load due to their low ESR (equivalent series resistance). They are available in a wide range of options to suit various usage conditions and applications.
Instant measurement of reel internal parts! Compatible with trays, sticks, and cut products.
The "Assure Series" is an X-ray component counter that accurately counts the number of internal parts in a reel with "Smart," "Simple," and "Speedy" features. It can measure while still in the packaging, allowing for counting even in ESD bags or with desiccants. Additionally, as a feature exclusive to the Pro model, it can be managed even more efficiently with the built-in barcode camera. 【Features】 ■ One of the smallest installation footprints in the industry ■ Fast and easy counting ■ Measurement can be done while still in packaging ■ Component absence detection function ■ Pro model exclusive features *For more details, please refer to the related links or feel free to contact us.
Gold / Silver / Aluminum / ITO coated substrate (slide glass / cover slip / silicon wafer / mica)
Surface plasmon resonance (SPR), microarrays, biosensors, nanotechnology, neurobiology, self-assembled monolayers (SAM), X-ray diffraction (XRD), semiconductors, and a variety of research applications can utilize atomic force microscopy (AFM), scanning electron microscopy (SEM), transmission electron microscopy (TEM), and other electron microscopy techniques. In addition to slide glass, we also offer silicon wafers and mica substrates. The main coatings are gold (Au), silver (Ag), aluminum (Al), and ITO. High-reflectivity gold-coated slides are ideal for observing backscattered electron images (BSE) (10-15 eV) and secondary electron images (SE) (5 eV) using SEM. For backscattered electron images <BSE>, a gold thickness of 10 nm is recommended, while for secondary electron images <SE>, products of 50/100 nm are suggested.
![[Research Material] World Market for LED Sapphire Substrates](https://image.mono.ipros.com/public/product/image/a1b/2000841135/IPROS39512792689256152094.jpeg?w=280&h=280)
World Market for LED Sapphire Substrates: 1 inch, 2 inches, 3 inches, 4 inches, 5 inches, 6 inches, 8 inches, others, light-emitting diodes ...
This research report (Global LED Sapphire Substrate Market) investigates and analyzes the current status and outlook for the global LED sapphire substrate market over the next five years. It includes information on the overview of the global LED sapphire substrate market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the LED sapphire substrate market include 1-inch, 2-inch, 3-inch, 4-inch, 5-inch, 6-inch, 8-inch, and others, while the segments by application include light-emitting diodes (LED), radio frequency integrated circuits (RFIC), laser diodes, silicon sapphire (SoS) ICs, and others. The regional segments are categorized into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa to calculate the market size of LED sapphire substrates. The report also includes the market share of major companies in the LED sapphire substrate market, product and business overviews, and sales performance.
![[Research Material] Global Market for Sapphire Composite Substrates](https://image.mono.ipros.com/public/product/image/1bf/2001470627/IPROS25186941302919118481.jpeg?w=280&h=280)
World Market for Sapphire Composite Substrates: C-Plane Sapphire Substrates, R/M-Plane Sapphire Substrates, Patterned Sapphire Substrates ...
This research report (Global Sapphire Compound Substrate Market) investigates and analyzes the current state and outlook for the global sapphire compound substrate market over the next five years. It includes information on the overview of the global sapphire compound substrate market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the sapphire compound substrate market include C-Plane sapphire substrates, R/M-Plane sapphire substrates, and patterned sapphire substrates, while the segments by application include LED, RFIC, laser diodes, silicon-on-sapphire (SoS) ICs, and others. The regional segments are divided into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa to calculate the market size of sapphire compound substrates. It also includes the market share of major companies in the sapphire compound substrate market, product and business overviews, and sales performance.
![[Research Material] World Market for Double-Sided Printed Circuit Boards](https://image.mono.ipros.com/public/product/image/362/2001460676/IPROS25088691762923591273.jpeg?w=280&h=280)
World Market for Double-Sided Printed Circuit Boards: Glass Fiber, Paper, Metal, Ceramic, Others, Industrial/Medical, Home Appliances, Military/Aerospace, Others
This research report (Global Double Sided Printed Circuit Board Market) investigates and analyzes the current state and outlook for the global market of double-sided printed circuit boards over the next five years. It includes information on the overview of the global double-sided printed circuit board market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the double-sided printed circuit board market include fiberglass, paper, metal, ceramic, and others, while the segments by application cover industrial/medical, home appliances, military/aerospace, and others. The regional segments are categorized into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa, to calculate the market size of double-sided printed circuit boards. The report also includes the market share of major companies in the double-sided printed circuit board sector, product and business overviews, and sales performance.
![[Research Material] World Market for Single-Sided Printed Circuit Boards](https://image.mono.ipros.com/public/product/image/adf/2001481416/IPROS43792779215493735878.jpeg?w=280&h=280)
World Market for Single-Sided Printed Circuit Boards: Glass Fiber, Metal, Ceramics, Others, Computers, Phones, Faxes, Automotive Electronics, Others
This research report (Global Single Sided Printed Circuit Board Market) investigates and analyzes the current state and outlook for the global market of single-sided printed circuit boards over the next five years. It includes information on the overview of the global single-sided printed circuit board market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the single-sided printed circuit board market focus on glass fiber, metal, ceramics, and others, while the segments by application cover computers, phones, faxes, automotive electronics, and others. The regional segments calculate the market size of single-sided printed circuit boards by dividing them into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa. The report also includes the market share of major companies in the single-sided printed circuit board market, product and business overviews, and sales performance.
