Last Updated： Aggregation Period:Feb 18, 2026～Mar 17, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Feb 18, 2026～Mar 17, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Feb 18, 2026～Mar 17, 2026
This ranking is based on the number of page views on our site.
31～37 item / All 37 items
Excellent cost-performance embossing and stamping equipment.
The "ETM-8000" is a tray supply type embossing and stamping device. It reduces product damage through direct insertion. It comes standard with in-pocket 2D inspection, and 3D ball inspection can also be added. 【Features】 ■ Compatible with CSP – up to 20mm ■ Processing capacity: up to 8500 UPH *For more details, please download the PDF or feel free to contact us.
Power transistor, measurement inspection, visual inspection, tape storage, tube storage.
The "TH288LD" is a device that measures the electrical characteristics of power transistors with a gull-wing lead shape, housed in a plastic tube, using a tester connected in both high-temperature and room-temperature conditions. After that, an appearance inspection is performed, and the device is either stored in a tube or taped. Each configuration can be modified as needed. Additionally, it can accommodate various lead shapes of the device, such as straight leads and L-bent types. 【Device Specifications (Excerpt)】 ■ Processing capacity: 0.55 sec/1 device, including a test time of 250 ms ■ Supply: 80 plastic tubes; empty tubes are stored in a stocker ■ Measurement - High-temperature measurement: 1 or 2 locations, 3-terminal leaf contact High-temperature specification: 100℃ to 120℃ ±3℃ - Room temperature specification: 6 locations, 3-terminal leaf contact *For more details, please download the PDF or feel free to contact us.
Inspect each coil attached to the hoop material and tape it up!
This is an automatic machine that cuts each coil attached to the hoop material and transfers it to the pickup turntable, where it automatically conducts tests for characteristics, pressure resistance, etc., at each station, and tapes the good products. 【Features】 ■ Reduction of labor shortages in production sites ■ Improvement of product quality and production speed ■ Enhancement of safety and productivity *For more details, please download the PDF or feel free to contact us.
Check the actual usage amount of tape! Introducing the hot air taping machine made by H&H (Hong Kong).
The "AI-003" is a hot air taping machine manufactured by H&H (Hong Kong) that can accommodate tapes ranging from 4 to 28mm in width. It is compatible with stretch materials, as well as waterproof, reinforcement, and decorative tapes. Our company is the Japanese distributor for H&H (Hong Kong). We offer a variety of models that can be utilized for various applications, from waterproof processing to seamless-related tasks. 【Features】 ■ Compatible with tapes ranging from 4 to 28mm in width ■ Supports stretch materials ■ Records the actual usage amount of tape ■ Customizable software ■ Customizable attachments for different applications *For more details, please refer to the PDF document or feel free to contact us.
Hexa EVO+ is a device that inspects both the front and back sides of semiconductor IC packages and packages them for taping and other purposes.
Hexa EVO+ is a device for inspecting 3D appearance defects on both sides of semiconductor IC packages, ball arrays, leads, etc., and automatically packaging dies, IC sorting, and handler appearance inspection. It can accommodate a variety of inspection items and various packages. 【Features】 ● Appearance inspection for packages under 100mm ● Throughput, UPH90K ● Dual taping output support ● Automatic position correction ● Defective component management ● Appearance inspection contents ・3D front and back appearance inspection ・Ball and pad inspection ・Front, back, and side appearance inspection ・Package thickness inspection ・Color inspection ・Crack inspection
A device that extracts dies from wafers after dicing and transfers them to tape/reel while inspecting the dies. It is capable of inspection using visible light and infrared light.
tSort is a semiconductor sorting device that extracts dies from diced wafers/film frames and transfers them to tape/reels while inspecting the dies. It is capable of inspection using visible light and infrared light. 【Features】 ● 8”, 12”, diced wafers/film frames (WLCSP, BGA, eWLB, QFN, COG, etc.) ● Taping, compatible with JEDEC/canisters ● Throughput: 40,000 pph ● Inspection items - Co-planarity inspection of dies/solder balls/bumps - Bump defect detection - IR, infrared appearance inspection - 5-sided inspection - Die size - Dicing line edge inspection - Marking inspection - Scratch and foreign matter inspection
Automatic cover tape sealing and reel winding! Stick supply type appearance inspection automatic taping device.
The "FB-2000" is a device that automatically tapes good products after conducting a six-sided visual inspection of SOP-type devices. It individually transports electronic components supplied in sticks, performs a six-sided visual inspection, and then automatically inserts them into embossed carrier tape, seals with cover tape, and winds onto a reel. Please feel free to contact us if you have any inquiries. 【Specifications (partial)】 ■ Symmetrical devices: Devices stored in sticks ■ Supply form: Stick (stack height 400mm) ■ Processing capacity: 0.45 seconds per unit or less (8000 UPH) ■ Number of visual inspection positions: 6 positions ■ Classification: 2 classifications (good/bad) *For more details, please download the PDF or feel free to contact us.
