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TEG chip
We can offer standard and custom options to fit your budget. We also accommodate various bump processing. We will respond to your specifications for wiring materials, insulation materials, etc. Additionally, we can create from just one piece, so please feel free to consult with us.
Creation of TEG chips for implementation evaluation using techniques such as film formation, photo-etching, and plating.
At Toyowa Sangyo Co., Ltd., we create TEG chips for implementation evaluation using technologies such as film formation, photo-etching, and plating. We offer options for standard and custom products tailored to our customers' budgets and specifications. We can also accommodate small quantities. Please feel free to consult with us. Additionally, we provide back grinding processing for wafers and can handle processing for evaluation implementation boards. For more details, please contact us or refer to our catalog.
