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copper×古河電気工業 - List of Manufacturers, Suppliers, Companies and Products

copper Product List

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Strainable Colson Copper 'EFHD-97'

Strainable Colson Copper 'EFHD-97'

Ideal for securing shield cases and connectors! Reduces energy loss in high-speed data communication.

"EFHD-97" is a product that imparts formability to Colson copper, which is non-magnetic and excels in the balance of strength and conductivity. While "Colson copper" is generally considered unsuitable for deep drawing, this product improves formability through a unique manufacturing process. As a result, items that were previously manufactured using stainless steel, bronze, or brass can be enhanced to achieve higher performance (non-magnetic, high conductivity, high durability). 【Features】 ■ Suitable for deep drawing ■ Non-magnetic with an excellent balance of strength and conductivity ■ High-strength and high-conductivity types are also under development *For more details, please refer to the PDF document or feel free to contact us.

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High thermal conductivity, high-performance oxygen-free copper "GOFC"

High thermal conductivity, high-performance oxygen-free copper "GOFC"

For improving the reliability of power semiconductors! Oxygen-free copper strips that are easy to inspect and can suppress chip delamination.

"GOFC" is a high-purity oxygen-free copper that is resistant to grain growth even when heated, and its low Young's modulus helps suppress chip delamination. It is intended as an alternative to standard oxygen-free copper for applications involving heat, such as power semiconductor substrates. Since it has the same composition as standard oxygen-free copper, it is easy to substitute, and it suppresses the "grain growth (coarsening)" that is a weakness of oxygen-free copper during heating. Additionally, the low Young's modulus reduces thermal stress caused by differences in thermal expansion rates between the substrate and the chip, resulting in a reliable product with less likelihood of delamination at the bonding surface. 【Features】 - Resistant to grain growth even when heated, reducing background noise during automatic inspection with cameras (improved signal-to-noise ratio). - Low Young's modulus minimizes the generation of thermal stress, suppressing chip delamination. - Suitable for heat dissipation materials such as heat sinks and heat spreaders. *For more details, please refer to the PDF document or feel free to contact us.*

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