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Product Example: Lead Frame

Introducing custom precision lead frames for small signal transistors and optical semiconductors!

Here is an introduction to a case study on the production of lead frames used in discrete (individual) semiconductor small signal packages. The materials for the lead frames are mainly Cu alloys and 42 Alloy, with thicknesses ranging from 0.08 to 0.2 mm. The punching parts achieve a processing accuracy of ±0.02 mm, resulting in high-quality lead frames. 【Case Study】 ■ Product: Lead frame for small signal transistors ■ Industry: Semiconductor ■ Processing Classification: Press, punching, bending ■ Accuracy: ±0.02 mm (punching parts) ■ Material: Cu alloy, 42 Alloy *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract

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[Product Example] Portable Shield Frame, Cover, Frame

Examples of manufacturing ultra-small shield components that support the prevention of troubles in advanced electronic devices.

This is an introduction to a case study on the production of electromagnetic wave shield frame components used in mobile phones. The material for the shield frame is a 0.2mm thick brass (C7521) sheet. By attaching a shield cover to the shield frame (the main component) fixed by solder reflow, it is possible to shield the electromagnetic waves generated from the built-in circuit board. 【Case Study】 ■ Product: Shield frame for mobile phones ■ Industry: Electrical equipment ■ Processing classification: Pressing, punching, bending ■ Accuracy: ±0.03mm ■ Material: Brass ■ Dimensions: 40mm × 45mm × 1.5mm (H) *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract
  • Other electronic parts

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