We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for glue.
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glue Product List and Ranking from 43 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 03, 2025～Sep 30, 2025
This ranking is based on the number of page views on our site.

glue Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 03, 2025～Sep 30, 2025
This ranking is based on the number of page views on our site.

  1. 寺田 Tokyo//Electronic Components and Semiconductors
  2. null/null
  3. 積水フーラー Tokyo//Chemical
  4. 4 東亞合成 新製品開発事業部　機能性接着剤部 Tokyo//Chemical
  5. 5 味の素ファインテクノ Kanagawa//Chemical
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glue Product ranking

Last Updated： Aggregation Period:Sep 03, 2025～Sep 30, 2025
This ranking is based on the number of page views on our site.

  1. Epoxy-based adhesive Araldite 2011 (TDS and SDS available) 寺田
  2. Easy welding and bonding with adhesive! A versatile adhesive that works with any material.
  3. Epoxy adhesive Araldite RAPID 寺田
  4. 4 A one-component heat-curing epoxy resin adhesive proposed by Ajinomoto Fine-Techno. 味の素ファインテクノ
  5. 5 Comprehensive Catalog "Industrial Adhesives" ノガワケミカル

glue Product List

736～750 item / All 1141 items

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Development of medical adhesive LYDEX(R)

Development of medical adhesive LYDEX(R)

A medical adhesive that combines strong adhesion and high flexibility! It rapidly decomposes and disappears within the body!

Our company is engaged in the development of "medical adhesive LYDEX(R)." LYDEX(R) is based on dextran, a polymer pharmaceutical ingredient with proven safety, and polylysine, a food additive. It consists of aldehyde-modified dextran and succinic anhydride-treated polylysine, each of which is subjected to simple modifications. By mixing these two components in appropriate ratios, we obtain a formulation that exhibits high adhesive performance, sealant effects, and hemostatic effects, which rapidly degrades and disappears in the body after use. 【Features】 ■ Combines strong adhesion with high flexibility ■ Uses raw materials with no risk of infection, ensuring excellent safety ■ A medical adhesive that can be formulated in various forms and used in many fields ■ Research and development of application technologies is primarily advancing in five areas *For more details, please refer to the PDF document or feel free to contact us.

  • others

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High thermal conductivity & electrical insulation one-component room temperature curing adhesive

High thermal conductivity & electrical insulation one-component room temperature curing adhesive

Contributes to overall cost reduction of equipment, such as reducing assembly man-hours and the number of fixed parts!

This is a one-component, room temperature curing elastic adhesive that highly integrates high thermal conductivity and insulation properties. It improves heat resistance and combustion properties, making it suitable for fixing and bonding complex shapes of thermal transfer sections and heat-generating components, which were difficult with conventional sheet-type heat dissipation materials. It maintains elasticity even after curing, making it less susceptible to the effects of thermal cycles, and being siloxane-free makes it ideal as a heat dissipation material for various electrical and electronic components. 【Features】 - Improved heat resistance and combustion properties - Suitable for fixing and bonding complex shapes of thermal transfer sections and heat-generating components - Good workability, contributing to overall cost reduction of equipment - Maintains elasticity after curing, making it less susceptible to the effects of thermal cycles - Siloxane-free, ideal as a heat dissipation material for various electrical and electronic components *For more details, please refer to the PDF document or feel free to contact us.

  • Other consumables

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Cryogenic-use room temperature curing adhesive Nitofix® SK-229

Cryogenic-use room temperature curing adhesive Nitofix® SK-229

An epoxy-based two-component room temperature curing adhesive that has adhesive properties even in extremely low temperature environments!

"Nitofix® SK-229" is a room temperature curing adhesive that exhibits excellent adhesion over a wide temperature range from extreme low temperatures to room temperature. It has excellent heat shock resistance and provides superior adhesion to materials such as steel plates, plywood, and plastics. It is suitable for applications including the bonding of superconducting coils, fixing and adhering insulation materials for LNG and LPG tanks, and bonding FRP, aluminum, rubber, and plastics. 【Features】 - Excellent adhesion over a wide temperature range from extreme low temperatures to room temperature - Superior heat shock resistance - Excellent adhesion to materials such as steel plates, plywood, and plastics - Has a moderate viscosity, preventing dripping and leakage during application, resulting in excellent workability *For more details, please refer to the PDF document or feel free to contact us.

  • glue

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Sustainable adhesive

Sustainable adhesive

We will contribute to the SDGs with adhesive!

Are you struggling with your recent efforts towards the SDGs? Do you want to contribute to the SDGs in any way? Our adhesives can help with that! For example, If you want to reduce utility costs... we can suggest adhesives that cure at room temperature as well as heat-cured ones! If you feel unwell due to solvent odors... we can propose solvent-free adhesives! To contribute as much as possible, we also offer "adhesives" made from biomass-derived materials and biomass materials tailored to your needs. Please take a look at our materials!

  • plastic

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Construction Achievements: Basque Resin Stone Remake

Construction Achievements: Basque Resin Stone Remake

It is possible to install without removing the existing flooring! Bask Resin Anti-Slip Stone Remake Method!

Since the existing flooring will not be removed or disposed of, the renewal work can be carried out significantly reducing construction time and costs without concerns about noise or dust. The existing flooring will be finished with a 10mm thick application of "Basque Resin Stone Remake" directly by plastering. The pavement surface allows water to drain smoothly, making it slip-resistant and providing anti-slip measures. The unevenness caused by damaged pavement will also be resolved, allowing for a flat, barrier-free installation.

  • Company：バスク
  • Price：Less than 10,000 yen
  • Organic Natural Materials

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Are you struggling with the heat resistance of components? Adhesive materials that can cure at low temperatures.

Are you struggling with the heat resistance of components? Adhesive materials that can cure at low temperatures.

Shortening the curing process! Achieving application to materials with low heat resistance and suppression of warping and deformation due to thermal stress. Epoxy-based thermosetting adhesives and sealants.

★Are you facing any of the following issues? 　〇 Want to bond low heat-resistant parts at a low curing temperature 　〇 Want to relieve stress caused by heat 　〇 Want to achieve snap curing inline 'Plain Set' is a one-component epoxy resin adhesive developed based on the technology of latent curing agents that our company has accumulated over the years. It is utilized in various fields such as precision electronic components like camera modules, semiconductor mounting, communication components, and car electronics. We offer a lineup of products with unique features, including: "Flexible Type" "Gas Barrier Type" "UV and Heat Combined Type" "Conductive Type," among others, with their respective characteristics available in the catalog. 【Features】 ■ Suitable for assembling electronic components that include heat-sensitive materials due to its low-temperature curing capability of below 80°C ■ Can cure in just a few seconds at low temperatures of 120°C and 150°C ■ With a low thermal history, it alleviates stress caused by material contraction during cooling, suppressing warping and deformation *For more details, please refer to the PDF materials or feel free to contact us. Also, please visit our company website at the URL below.

  • glue

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Are you having trouble bonding with different materials? One-component flexible epoxy resin adhesive.

Are you having trouble bonding with different materials? One-component flexible epoxy resin adhesive.

Exhibits rubber-like flexibility and low elasticity! Effective for bonding heterogeneous materials with a large difference in thermal expansion coefficients. "Plain Set - Flexible Type"

★Are you facing any of these issues? 　〇 The adhesive area is small, and the adhesive part peels off or breaks during drop impact tests. 　〇 You want to significantly reduce vibrations and noise from motors, etc. 　〇 Different materials such as engineering plastics and metals do not bond well together. The "Plain Set Flexible Type" is a low-temperature curing adhesive that provides flexible bonding with high impact resistance and stress relaxation effects. Generally, epoxy resins have high strength and elasticity, but our unique formulation technology achieves a composition with low elasticity and flexibility. It solves problems such as "the adhesive part peels off or breaks" and "the vibrations and noise from motors are loud." 【Features】 ■ Cures at a low temperature of 80°C ■ Becomes a rubber-like elastomer after curing, providing effective flexibility for stress relaxation and shock/vibration absorption ■ As a low-elasticity material, it has high peel strength and is effective for bonding dissimilar materials with a large difference in linear expansion coefficients. *For more details, please refer to the PDF document or feel free to contact us. Also, please visit our company website at the URL below.

  • glue
  • Other polymer materials

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For those struggling with solder connections! A one-component conductive adhesive that can cure at low temperatures.

For those struggling with solder connections! A one-component conductive adhesive that can cure at low temperatures.

[Exhibition Participation] No need for reflow or flux cleaning! Reduction of processes and use of materials with low heat resistance is possible. "Plain Set - Conductive Type"

★Are you facing any of these issues? 〇 Unable to apply solder due to the inclusion of heat-sensitive components 〇 Want to mount and join components on flexible substrates 〇 Looking to improve connection reliability between terminals (gold, copper, nickel, tin, etc.) The "Plain Set Conductive Type" is a conductive adhesive that balances conductivity and adhesion based on a low-temperature curing of 80°C. It excels in adhesion and crack resistance, and because it can cure at low temperatures, it can serve as an alternative to solder for electronic components that cannot withstand reflow or high curing temperatures due to heat resistance issues. By not using solder, it eliminates the need for flux cleaning, contributing to a reduction in processes. 【Features】 ■ Cures at a low temperature of 80°C ■ Can replace solder ■ Suppresses the increase in contact resistance with nickel and tin 【Exhibition Information】 Exhibition Name: High-Function Materials Week Adhesive Bonding EXPO Date: October 29 (Tuesday) to 31 (Thursday), 2024, 10:00 AM to 6:00 PM (ends at 5:00 PM on the last day) Venue: Makuhari Messe Booth Number: 15-27 *For more details, please refer to the PDF document or feel free to contact us. Also, please visit our website at the URL below.

  • glue

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Yunimec "Surface Mount Adhesive"

Yunimec "Surface Mount Adhesive"

Introduction of the registered trademark "Unimec" heat-curing conductive materials.

"Surface mount adhesive" is a thermosetting conductive adhesive that can undergo low-temperature processing compatible with lead-free mounting and has high-temperature solder reflow resistance. Our trademark "Unimec" is a conductive material that can be processed at low temperatures, consisting of a thermosetting resin primarily based on epoxy resin, with specially treated in-house processed conductive powder uniformly dispersed. The development and blending of conductive powders enable the production of products with various characteristics. [Features] ■ Low-temperature processing possible ■ Thermosetting conductive material ■ Compatible with lead-free mounting ■ High-temperature solder reflow resistance *For more details, please refer to the PDF document or feel free to contact us.

  • Other terminal blocks
  • Other polymer materials
  • Other electronic parts

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Low-temperature curing low-elasticity conductive adhesive

Low-temperature curing low-elasticity conductive adhesive

70℃ curing possible - good conductivity!

Development is underway for flexible/stretchable substrates for wearable devices. It accommodates substrates that do not have heat resistance for that purpose. 【Product/Device Features】 - Compatible with dispense coating - Can cure at 70°C! - Good conductivity - Supports component mounting on stretchable/flexible substrates ~ Achieves an elastic modulus of 0.6 GPa (25°C/DMA) with a thermosetting type ~ - High reliability ~ Connectivity stability after 1000 temperature cycles ~

  • Composite Materials
  • glue
  • Other electronic parts

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[Technology Introduction] Hot Melt Molding

[Technology Introduction] Hot Melt Molding

Unique development of molds and molding units for hot melt! Molding is possible at low pressure and low temperature!

The hot melt molding of the Nakagawa Electric Group began with the supply of in-vehicle components for hybrid vehicles. Through repeated trial and error regarding materials, surface roughness, gate positions, and cooling circuits, we developed unique molds and molding units. Compared to conventional potting molding, our process allows for molding at low pressure and low temperature. Additionally, as a result of our unique research and development, we have minimized damage to circuit connections while enabling weight reduction and miniaturization. Furthermore, by using transparent materials, it is easy to check the circuit connections even after molding. 【Features】 ■ Molding at low pressure and low temperature ■ Minimizing damage to circuits *For more details, please refer to the PDF document or feel free to contact us.

  • Other Auto Parts
  • Other optical parts
  • Other machine elements

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Blister pack adhesive

Blister pack adhesive

We will introduce products that have excellent low-temperature heat sealability for PET and PVC films.

At Nippon Chemical Coatings Co., Ltd., we handle "adhesives for blister packs." We offer both solvent-based and water-based options. Our products, which are used to bond printed cardboard backing and shaped transparent plastics (PET, PVC) with heat and pressure, have a proven track record of high performance. Blister packs are used for items such as toothbrushes and dry batteries. 【Features】 ■ One-component type ■ Excellent low-temperature heat sealability for PET and PVC films *For more details, please refer to the PDF materials or feel free to contact us.

  • glue

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Tabletop Bookbinding Machine 'BQ-P65'

Tabletop Bookbinding Machine 'BQ-P65'

The binding strength has been further enhanced! This compact design makes it an ideal desktop binding machine for office environments.

The "BQ-P65" is a desktop binding machine that allows you to perform your preferred binding with simple button operations. It supports three types of binding: hardcover binding, tape binding, and hot melt binding. It is equipped with an automatic shutdown feature and a deodorizing filter. With beautiful hardcover binding, it enhances the finish of presentation materials and collections. 【Features】 ■ Easy operation by simply following the LED lamp instructions displayed on the control panel ■ High-speed production capable of handling 180 books in a short time ■ Ensures reliable adhesive application and strong nipping function for sturdy and beautiful binding ■ Compatible with hardcover binding, tape binding, and hot melt binding ■ Deodorizes adhesive odors with the deodorizing filter, keeping the office environment comfortable ■ Reduces power consumption by adopting low-temperature adhesive and energy-saving mode *For more details, please refer to the PDF document or feel free to contact us.

  • Other PCs and OA equipment

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Wireless Binding Machine 'BQ-270V'

Wireless Binding Machine 'BQ-270V'

From small-scale production to variable binding! Achieve high-quality binding with a setup time of just a few dozen seconds.

The "BQ-270V" is a wireless binding machine compatible with variable binding, equipped with a thickness input device as standard, allowing for quicker setup changes. Almost all operational settings and fine adjustments can be configured via a touch panel. It employs a clamping belt transport system that stably conveys a variety of covers and a high-precision alignment mechanism, ensuring consistently high-quality binding. 【Features】 ■ Considerate operability ■ Quick setup ■ High-speed binding ■ High-quality binding ■ Variable binding ■ Integration with JDF Work Flow *For more details, please refer to the PDF materials or feel free to contact us.

  • Other PCs and OA equipment

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Automatic Bookbinding Machine 'BQ-160'

Automatic Bookbinding Machine 'BQ-160'

The on-demand model of Bind Quick has arrived! It enables the production of 180 books in a time frame!

The "BQ-160" is a semi-professional binding machine that accommodates binding from thin materials to those up to 40mm thick. With easy-to-understand operation via a touch panel and user-friendly features that reduce the operator's workload, it achieves a production rate of 180 books per hour. To ensure that anyone can easily set it up, it features a graphical color touch panel. 【Features】 ■ Equipped with a navigation function ■ Sturdy construction securely grips the spine, achieving high binding quality ■ Automatic clamping reduces the burden on the operator ■ Equipped with a roughening function (for scoring) ■ Unique design of the glue drum ensures reliable glue application *For more details, please refer to the PDF materials or feel free to contact us.

  • Other PCs and OA equipment

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