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heat sink Product List and Ranking from 62 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Oct 01, 2025～Oct 28, 2025
This ranking is based on the number of page views on our site.

heat sink Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Oct 01, 2025～Oct 28, 2025
This ranking is based on the number of page views on our site.

  1. Axuas Co., Ltd. Aichi//Consumer Electronics
  2. LSIクーラー Tokyo//Industrial Electrical Equipment
  3. 高木製作所 Ibaraki//Industrial Electrical Equipment
  4. 4 三協サーモテック 東京事務所 Tokyo//Other manufacturing
  5. 5 ザワード Tokyo//Trading company/Wholesale
Go to Company Ranking

heat sink Product ranking

Last Updated： Aggregation Period:Oct 01, 2025～Oct 28, 2025
This ranking is based on the number of page views on our site.

  1. Aluminum Water-Cooled Heat Sink "YC Series" LSIクーラー
  2. Heat Sink for Printed Circuit Board - Product Catalog 三協サーモテック 東京事務所
  3. Water-cooled heat sink 高木製作所
  4. 4 Flexible heat sink LSIクーラー
  5. 5 Emerging Ceramics Heat Sink (Metal Metallurgy) Business

heat sink Product List

316～330 item / All 612 items

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[Technical Column #09] The Mechanism of Heat Sinks

[Technical Column #09] The Mechanism of Heat Sinks

Explaining our technology that further enhances the mechanism and heat dissipation of heat sinks!

This column explains the mechanism of heat sinks. Heat sinks are important components of high-performance electronic devices. We will introduce the mechanism of heat dissipation, the materials used, and our technology "Sugohie," which can further enhance heat dissipation, by the functional plating company, Ebina Denka Kogyo. [Contents (Excerpt)] ■ What is the mechanism of heat sinks? An explanation of the mechanism that supports high-performance electronic devices. ■ About heat sinks. ■ Reasons why heat sinks are necessary for high-performance electronic devices. ■ The mechanism of heat dissipation using heat sinks. ■ The mechanism of heat dissipation. *For detailed content of the column, please refer to the related links. For more information, feel free to contact us.

  • Other electronic parts
  • Plating Equipment

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Microchannel Heat Sink 'M4040/M2020'

Microchannel Heat Sink 'M4040/M2020'

Uniform temperature across the entire surface with matrix flow channels! We also accommodate custom orders and mass production.

The "M4040/M2020" is a microchannel heat sink that is effective for heat removal from high heat density sources. In the commonly seen "single flow path," there is a "temperature variation" on the cooling surface. WELCON's fluid distribution design technology achieves effective heat absorption from high heat density sources through uniform cooling. By improving the heat absorption density compared to conventional products, it enables downsizing, weight reduction, simplification, and energy saving, including the pump and piping. There is a proven track record of mass production for cooling CPUs in supercomputers. When combined with heat exchangers, precise temperature control is possible. 【Features】 ■ 260W/cm² heat absorption ■ Uniform temperature across the entire surface due to matrix flow paths ■ Customizable ■ Achieves low flow rate and low thermal resistance ■ Enables downsizing, weight reduction, simplification, and energy saving, including the pump and piping *For more details, please refer to the PDF document or feel free to contact us.

  • Other environmental equipment

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Case Study of Microchannel Heat Sink Development

Case Study of Microchannel Heat Sink Development

It is possible to cool uniformly without temperature variation! We offer customization of standard products and prototype development from scratch.

Many existing heat sinks have a simple structure known as a 1-path structure, where the flow path from the inlet to the outlet is connected by a single line. In this case, there is a temperature variation between the inlet side, where fresh refrigerant is supplied, and the outlet side, where the refrigerant is heated by the heat source. The heat sinks provided by WELCON as standard products can cool uniformly without temperature variation. They feature a "matrix flow path" that implements microchannels with fine chambers like those in liquid crystals, allowing fresh refrigerant to be distributed uniformly. [Features] - No temperature variation - Can cool uniformly - Fresh refrigerant is distributed uniformly by implementing fine chambers like those in liquid crystals with microchannels *For more details, please refer to the PDF document or feel free to contact us.

  • Heat exchanger
  • Other electronic parts
  • air conditioning

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[Technical Data] Reduced Temperature Variation! High-Performance Water-Cooled Microchannel Heat Sink

[Technical Data] Reduced Temperature Variation! High-Performance Water-Cooled Microchannel Heat Sink

If you're looking to enhance the performance of heat management components while also achieving miniaturization, weight reduction, and energy efficiency, this is a must-see!

Our company designs, manufactures, and sells microchannel heat sinks. We can suppress the temperature rise to 40°C for a heat generation of 260W/cm². The microchannel flow paths are arranged across the entire cooling surface, ensuring that the refrigerant is evenly distributed throughout all flow paths. Fresh refrigerant uniformly spreads within the plane, reducing temperature variations, improving cooling efficiency, and achieving low thermal resistance. 【Features】 ■ Suppresses temperature rise to 40°C for a heat generation of 260W/cm² ■ Microchannel flow paths are arranged across the entire cooling surface ■ Internal structure ensures even distribution of refrigerant across all flow paths ■ Reduces refrigerant volume ■ No need to significantly lower the refrigerant inlet temperature *For more details, please refer to the PDF document or feel free to contact us.

  • Other environmental equipment

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Dual-side heating compatible with 10,000W! Microchannel dual-side cooling water-cooled heat sink.

Dual-side heating compatible with 10,000W! Microchannel dual-side cooling water-cooled heat sink.

Uniform temperature distribution! Suitable for power semiconductor cooling, computing board (GPU, etc.) cooling, and more.

The "WEL-Cool Heat Sink" is a microchannel water-cooled heat sink (cold plate) that can be customized in various ways, including dual-side cooling, thin design, size, and performance. It features a microchannel structure on both sides, allowing for simultaneous cooling. Additionally, it achieves high performance (low thermal resistance) while maintaining low pressure loss. The innovative internal structure helps to equalize the temperature distribution. Please feel free to contact us for inquiries. 【Features】 ■ Simultaneous cooling on both sides ■ High performance (low thermal resistance) and low pressure loss ■ Equalized temperature distribution ■ Manufactured using diffusion bonding, with no filler metal used in the product ■ Customization available in various forms *For more details, please refer to the PDF document or feel free to contact us.

  • Other machine elements

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【Large Semiconductor Heat Sink】Information for Forced Air Cooling and Water Cooling

【Large Semiconductor Heat Sink】Information for Forced Air Cooling and Water Cooling

Simplifying the mechanical riveting process to achieve high performance while keeping costs low!

Introducing heat sinks that contribute to the compactness of units and exhibit excellent characteristics in high-density electronic devices, including large semiconductor heat sinks for forced air cooling and water cooling. ■□■Features■□■ ■ By adopting a mechanical crimping method, the fin thickness has been reduced and a narrow pitch has been achieved, resulting in an increased surface area and excellent thermal resistance even at the same dimensions. ■ The mechanical crimping process has been simplified, achieving high performance while maintaining low costs. ■ The fin height can be freely set. For other functions and details, please contact us.

  • Other electronic parts

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Information on Medium-Sized High-Power Semiconductor Heat Sinks

Information on Medium-Sized High-Power Semiconductor Heat Sinks

Heat sink (radiator) medium-sized heat sink (medium-sized, for high-power semiconductors)

The LEX medium-sized heat sink series, designed for cooling in high-density electronic devices that are becoming more powerful due to advancements in semiconductor technology, offers a total of 276 models that are the most rational and cater to all users. 【Features】 ○ Medium-sized products can be complexly processed using large machining centers. ○ A wide variety of extruded materials are available, allowing for selection of materials that meet customer needs. A versatile heat sink made from flat extruded materials. It is suitable for both natural cooling and forced air cooling applications. (Refer to the graphs in the catalog for performance data during natural and forced cooling.) If heat dissipation and thermal transport using metal alone are insufficient for heat dissipation measures, it is possible to enhance heat dissipation by installing heat pipes. - For more details, please contact us or download the catalog.

  • Other electronic parts

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Heat Sink DHP Series

Heat Sink DHP Series

We have added the models recommended by Marusan Electric as standard products in our lineup.

We have added models recommended by Marusan Electric as standard products to our lineup. Standard products can be offered at a low price as they do not require molds. We are introducing the Intel CPU-specific types "104DHP91-91" and "104DHP90-90," as well as the 1U server types "26DHP83-106.5" and "24.5DHP90.3-90.3." For more details, please contact us or refer to the catalog.

  • Cooling system

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Heater Comb Fit

Heater Comb Fit

The principle of comb-fit coupling is...

The surfaces of the aluminum materials that make up the heat sink's base and fins are covered with a hard oxide film due to exposure to air. By instantly removing this hard oxide film and pressing the newly formed surfaces of the fins and base against each other with pressure, the metal surfaces bond together, improving the thermal conductivity between the base and fins. *Online meetings are also possible, so please feel free to contact us.*

  • Other electronic parts

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Heat sink for surface mount devices, SQ series

Heat sink for surface mount devices, SQ series

The SQ series is an aluminum extruded type with a slit fin type.

We are pursuing high performance for heat sinks and radiators. The semiconductor devices (such as transistors, CPUs, IGBTs, etc.) used in current electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. A heat sink is an electronic component radiator that prevents the destruction of the device by quickly transferring and cooling this heat. Most of them consist of a base plate to which the heat-generating device is attached and fins that dissipate heat from the base plate. The cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves using a fan to force air circulation or using cooling media such as water. In LSI coolers, we continue to pursue high performance supported by thermal theory to achieve efficient heat processing with heat sinks. The SQ series heat sinks for surface-mounted devices are made of extruded aluminum and feature a slit fin design. *Online meetings are also possible, so please feel free to contact us.

  • Other electronic parts

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Free comprehensive catalog available! Electronic component radiator "heat sink"

Free comprehensive catalog available! Electronic component radiator "heat sink"

Utilizing the excellent thermal conductivity of aluminum for heat dissipation and absorption! Preventing reliability and performance degradation or failure due to temperature rise in semiconductor devices.

Heat sinks are used as practical and economical cooling methods in various industries. This method is adopted in the semiconductor industry as the most practical and economical cooling solution to prevent reliability and performance degradation, as well as destruction due to temperature rise in semiconductor devices. Additionally, the "heat sink" of LSI coolers is characterized by its resistance to vibration, which can also help reduce initial costs. 【Contents】 - V Series: Hollow type (for medium power forced air cooling) - M Series: Multipurpose, general-purpose fin-type heat sinks - H Series: Multipurpose, general-purpose fin-type heat sinks *This download is a digest version. If you would like the complete version, please contact us. *Online meetings are also possible, so feel free to reach out to us.

  • Cooling system

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Heat dissipation solutions that solve the heat dissipation problems faced by electronic devices!

Heat dissipation solutions that solve the heat dissipation problems faced by electronic devices!

You can download various heat dissipation product information materials in bulk.

● Thermal Rubber: A silicone-based resin material that conducts heat. It quickly dissipates heat from the source. ● Cool Staff: A groundbreaking heat dissipation film that condenses multiple heat dissipation pathways into a single sheet of film. ● Heat Sink: Compatible with precision processing through various extrusion and processing techniques. ● FAN Motor: Also compatible with integrated designs with heat sinks. ● Heat Dissipation Paint: A thermosetting paint with general heat dissipation properties in a solution form.

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  • Other electronic parts

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Universal heat sink, passive heat sink

Universal heat sink, passive heat sink

This is a general-purpose heat sink used in various environments such as natural air cooling and forced air cooling.

- Sold individually, more than one available for online shopping - Immediate delivery available - Customization options such as additional processing are also possible

  • Other electronic parts

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Shoulder screw type heat sink

Shoulder screw type heat sink

The method of securing the heat sink and board with shoulder screws holds the heat sink in place using the tension of the spring.

We provide a method to secure the heat sink and board with shoulder screws, holding the heat sink in place with the tension of the spring. Depending on your specifications, we can offer a total solution that includes shoulder screws, springs, and thermal interfaces.

  • Other electronic parts

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Heat sink for DC-DC converter

Heat sink for DC-DC converter

Standard products are available for sale from one piece, with same-day shipping OK! We also accommodate additional processing and customization! Leave it to us from prototypes to mass production!

This is a heat sink for DC-DC converters. Here is an introduction to various heat sinks.

  • Other electronic parts
  • fan

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