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heat sink Product List and Ranking from 63 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Dec 31, 2025～Jan 27, 2026
This ranking is based on the number of page views on our site.

heat sink Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Dec 31, 2025～Jan 27, 2026
This ranking is based on the number of page views on our site.

  1. Axuas Co., Ltd. Aichi//Consumer Electronics
  2. ザワード Tokyo//Trading company/Wholesale
  3. LSIクーラー Tokyo//Industrial Electrical Equipment
  4. 4 リーダー Osaka//others
  5. 5 三協サーモテック 東京事務所 Tokyo//Other manufacturing
Go to Company Ranking

heat sink Product ranking

Last Updated： Aggregation Period:Dec 31, 2025～Jan 27, 2026
This ranking is based on the number of page views on our site.

  1. Aluminum Water-Cooled Heat Sink "YC Series" LSIクーラー
  2. Heat Sink for Printed Circuit Board - Product Catalog 三協サーモテック 東京事務所
  3. Flexible heat sink LSIクーラー
  4. Cold forged copper pin fin heat sink Axuas Co., Ltd.
  5. 4 Freshly machined heat sink ザワード

heat sink Product List

376～390 item / All 738 items

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[Technical Data] Reduced Temperature Variation! High-Performance Water-Cooled Microchannel Heat Sink

[Technical Data] Reduced Temperature Variation! High-Performance Water-Cooled Microchannel Heat Sink

If you're looking to enhance the performance of heat management components while also achieving miniaturization, weight reduction, and energy efficiency, this is a must-see!

Our company designs, manufactures, and sells microchannel heat sinks. We can suppress the temperature rise to 40°C for a heat generation of 260W/cm². The microchannel flow paths are arranged across the entire cooling surface, ensuring that the refrigerant is evenly distributed throughout all flow paths. Fresh refrigerant uniformly spreads within the plane, reducing temperature variations, improving cooling efficiency, and achieving low thermal resistance. 【Features】 ■ Suppresses temperature rise to 40°C for a heat generation of 260W/cm² ■ Microchannel flow paths are arranged across the entire cooling surface ■ Internal structure ensures even distribution of refrigerant across all flow paths ■ Reduces refrigerant volume ■ No need to significantly lower the refrigerant inlet temperature *For more details, please refer to the PDF document or feel free to contact us.

  • Other environmental equipment

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Dual-side heating compatible with 10,000W! Microchannel dual-side cooling water-cooled heat sink.

Dual-side heating compatible with 10,000W! Microchannel dual-side cooling water-cooled heat sink.

Uniform temperature distribution! Suitable for power semiconductor cooling, computing board (GPU, etc.) cooling, and more.

The "WEL-Cool Heat Sink" is a microchannel water-cooled heat sink (cold plate) that can be customized in various ways, including dual-side cooling, thin design, size, and performance. It features a microchannel structure on both sides, allowing for simultaneous cooling. Additionally, it achieves high performance (low thermal resistance) while maintaining low pressure loss. The innovative internal structure helps to equalize the temperature distribution. Please feel free to contact us for inquiries. 【Features】 ■ Simultaneous cooling on both sides ■ High performance (low thermal resistance) and low pressure loss ■ Equalized temperature distribution ■ Manufactured using diffusion bonding, with no filler metal used in the product ■ Customization available in various forms *For more details, please refer to the PDF document or feel free to contact us.

  • Other machine elements

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【Large Semiconductor Heat Sink】Information for Forced Air Cooling and Water Cooling

【Large Semiconductor Heat Sink】Information for Forced Air Cooling and Water Cooling

Simplifying the mechanical riveting process to achieve high performance while keeping costs low!

Introducing heat sinks that contribute to the compactness of units and exhibit excellent characteristics in high-density electronic devices, including large semiconductor heat sinks for forced air cooling and water cooling. ■□■Features■□■ ■ By adopting a mechanical crimping method, the fin thickness has been reduced and a narrow pitch has been achieved, resulting in an increased surface area and excellent thermal resistance even at the same dimensions. ■ The mechanical crimping process has been simplified, achieving high performance while maintaining low costs. ■ The fin height can be freely set. For other functions and details, please contact us.

  • Other electronic parts

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Information on Medium-Sized High-Power Semiconductor Heat Sinks

Information on Medium-Sized High-Power Semiconductor Heat Sinks

Heat sink (radiator) medium-sized heat sink (medium-sized, for high-power semiconductors)

The LEX medium-sized heat sink series, designed for cooling in high-density electronic devices that are becoming more powerful due to advancements in semiconductor technology, offers a total of 276 models that are the most rational and cater to all users. 【Features】 ○ Medium-sized products can be complexly processed using large machining centers. ○ A wide variety of extruded materials are available, allowing for selection of materials that meet customer needs. A versatile heat sink made from flat extruded materials. It is suitable for both natural cooling and forced air cooling applications. (Refer to the graphs in the catalog for performance data during natural and forced cooling.) If heat dissipation and thermal transport using metal alone are insufficient for heat dissipation measures, it is possible to enhance heat dissipation by installing heat pipes. - For more details, please contact us or download the catalog.

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Heat Sink DHP Series

Heat Sink DHP Series

We have added the models recommended by Marusan Electric as standard products in our lineup.

We have added models recommended by Marusan Electric as standard products to our lineup. Standard products can be offered at a low price as they do not require molds. We are introducing the Intel CPU-specific types "104DHP91-91" and "104DHP90-90," as well as the 1U server types "26DHP83-106.5" and "24.5DHP90.3-90.3." For more details, please contact us or refer to the catalog.

  • Cooling system

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Heater Comb Fit

Heater Comb Fit

The principle of comb-fit coupling is...

The surfaces of the aluminum materials that make up the heat sink's base and fins are covered with a hard oxide film due to exposure to air. By instantly removing this hard oxide film and pressing the newly formed surfaces of the fins and base against each other with pressure, the metal surfaces bond together, improving the thermal conductivity between the base and fins. *Online meetings are also possible, so please feel free to contact us.*

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Heat sink for surface mount devices, SQ series

Heat sink for surface mount devices, SQ series

The SQ series is an aluminum extruded type with a slit fin type.

We are pursuing high performance for heat sinks and radiators. The semiconductor devices (such as transistors, CPUs, IGBTs, etc.) used in current electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. A heat sink is an electronic component radiator that prevents the destruction of the device by quickly transferring and cooling this heat. Most of them consist of a base plate to which the heat-generating device is attached and fins that dissipate heat from the base plate. The cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves using a fan to force air circulation or using cooling media such as water. In LSI coolers, we continue to pursue high performance supported by thermal theory to achieve efficient heat processing with heat sinks. The SQ series heat sinks for surface-mounted devices are made of extruded aluminum and feature a slit fin design. *Online meetings are also possible, so please feel free to contact us.

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Free comprehensive catalog available! Electronic component radiator "heat sink"

Free comprehensive catalog available! Electronic component radiator "heat sink"

Utilizing the excellent thermal conductivity of aluminum for heat dissipation and absorption! Preventing reliability and performance degradation or failure due to temperature rise in semiconductor devices.

Heat sinks are used as practical and economical cooling methods in various industries. This method is adopted in the semiconductor industry as the most practical and economical cooling solution to prevent reliability and performance degradation, as well as destruction due to temperature rise in semiconductor devices. Additionally, the "heat sink" of LSI coolers is characterized by its resistance to vibration, which can also help reduce initial costs. 【Contents】 - V Series: Hollow type (for medium power forced air cooling) - M Series: Multipurpose, general-purpose fin-type heat sinks - H Series: Multipurpose, general-purpose fin-type heat sinks *This download is a digest version. If you would like the complete version, please contact us. *Online meetings are also possible, so feel free to reach out to us.

  • Cooling system

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Heat dissipation solutions that solve the heat dissipation problems faced by electronic devices!

Heat dissipation solutions that solve the heat dissipation problems faced by electronic devices!

You can download various heat dissipation product information materials in bulk.

● Thermal Rubber: A silicone-based resin material that conducts heat. It quickly dissipates heat from the source. ● Cool Staff: A groundbreaking heat dissipation film that condenses multiple heat dissipation pathways into a single sheet of film. ● Heat Sink: Compatible with precision processing through various extrusion and processing techniques. ● FAN Motor: Also compatible with integrated designs with heat sinks. ● Heat Dissipation Paint: A thermosetting paint with general heat dissipation properties in a solution form.

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Universal heat sink, passive heat sink

Universal heat sink, passive heat sink

This is a general-purpose heat sink used in various environments such as natural air cooling and forced air cooling.

- Sold individually, more than one available for online shopping - Immediate delivery available - Customization options such as additional processing are also possible

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Shoulder screw type heat sink

Shoulder screw type heat sink

The method of securing the heat sink and board with shoulder screws holds the heat sink in place using the tension of the spring.

We provide a method to secure the heat sink and board with shoulder screws, holding the heat sink in place with the tension of the spring. Depending on your specifications, we can offer a total solution that includes shoulder screws, springs, and thermal interfaces.

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Heat sink for DC-DC converter

Heat sink for DC-DC converter

Standard products are available for sale from one piece, with same-day shipping OK! We also accommodate additional processing and customization! Leave it to us from prototypes to mass production!

This is a heat sink for DC-DC converters. Here is an introduction to various heat sinks.

  • Other electronic parts
  • fan

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Quick Set Heat Sink Series

Quick Set Heat Sink Series

This is a method of securing a Z-shaped clip by hooking it onto anchor pins inserted into two small holes (diameter 1.8mm) made on the electronic circuit board.

- Small mounting area - Positioning guide - Easy attachment and detachment - Adjustable mounting load

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Round Heat Sink CN Series

Round Heat Sink CN Series

This is a heat sink with a round base shape.

- Standard heat sinks are available for sale and can be shipped the same day from one piece. - Additional processing and customization are also available. - We support everything from prototype heat sinks to mass production.

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