We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for heat sink.
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heat sink Product List and Ranking from 63 Manufacturers, Suppliers and Companies

Last Updated: Aggregation Period:Dec 24, 2025~Jan 20, 2026
This ranking is based on the number of page views on our site.

heat sink Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Dec 24, 2025~Jan 20, 2026
This ranking is based on the number of page views on our site.

  1. Axuas Co., Ltd. Aichi//Consumer Electronics
  2. ザワード Tokyo//Trading company/Wholesale
  3. LSIクーラー Tokyo//Industrial Electrical Equipment
  4. 4 三協サーモテック 東京事務所 Tokyo//Other manufacturing
  5. 5 リーダー Osaka//others

heat sink Product ranking

Last Updated: Aggregation Period:Dec 24, 2025~Jan 20, 2026
This ranking is based on the number of page views on our site.

  1. Flexible heat sink LSIクーラー
  2. Aluminum Water-Cooled Heat Sink "YC Series" LSIクーラー
  3. Heat Sink for Printed Circuit Board - Product Catalog 三協サーモテック 東京事務所
  4. 4 Power semiconductor fan and heat sink integrated forced air cooling unit Axuas Co., Ltd.
  5. 5 Water-cooled heat sink 高木製作所

heat sink Product List

586~600 item / All 728 items

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BGA heatsink 23 x 23mm height 25mm

BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.

JARO's fan heat sink, widely adopted in automobiles, medical devices, and communication equipment. Efficient heat dissipation: BGA heat sinks quickly dissipate heat from components using aluminum. Compact design: BGA heat sinks are designed to match the size of ICs or components, allowing them to function efficiently even in limited spaces. Secure mounting: BGA heat sinks are often bonded to ICs or components using special adhesives for efficient heat transfer. Versatile: BGA heat sinks are used in a variety of devices, including computers, servers, game consoles, and industrial systems.

  • JBHAE2304-2D.jpg
  • logo JARO Thermal.png
  • Other semiconductors

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BGA heatsink 40 x 40mm height 23mm

BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.

JARO's fan heat sink, widely adopted in automobiles, medical devices, communication equipment, and more. Efficient heat dissipation: BGA heat sinks quickly dissipate heat from components using aluminum. Compact design: BGA heat sinks are designed to match the size of ICs or components, allowing them to function efficiently even in limited spaces. Secure mounting: BGA heat sinks are often adhered to ICs or components using special adhesives for efficient heat transfer. Versatile: BGA heat sinks are used in a variety of devices, including computers, servers, game consoles, and industrial systems.

  • JBHAE4003-2D.jpg
  • logo JARO Thermal.png
  • Other semiconductors

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Width 100mm Height 40mm High-performance air-cooled aluminum heat sink

High-Performance Heat Sink for Power Electronics PM (Profilmecc) Series

The PM (Profilmecc) series offered by Meccal (Italy) is an innovative product. It is a completely custom-made heat sink while also featuring standard solution specifications. Manufactured using a unique patented technology for the mechanical assembly of the base and fins, Profilmecc guarantees excellent mechanical specifications. * Width, length, height, and fin shape can be designed according to application. * Designable dimension range: Width: MAX 1000mm, Length: MAX 1300mm, Base height: 8 - 50mm, Fin height: MAX 190mm * Capable of hole processing and surface treatment (anodizing, etc.).

  • profilmecc-01.jpg
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  • profilmecc-03.jpg
  • foto-pagina-profilmecc.jpg
  • logo.png
  • Other electronic parts

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Width 150mm Height 60mm High-performance air-cooled aluminum heat sink

High-performance heat sink series for power electronics PM (Profilmecc)

The PM (Profilmecc) series provided by Meccal (Italy) is an innovative product. It is a completely custom-made heat sink while also offering standard solution specifications. Profilmecc, manufactured using a unique patented technology for the mechanical assembly of the base and fins, ensures excellent mechanical specifications. * Width, length, height, and fin shape can be designed according to application. * Designable dimension range: Width: MAX 1000mm, Length: MAX 1300mm, Base height: 8 - 50mm, Fin height: MAX 190mm * Supports hole processing and surface treatment (anodizing, etc.).

  • profilmecc-01.jpg
  • profilmecc-02.jpg
  • profilmecc-03.jpg
  • foto-pagina-profilmecc.jpg
  • logo.png
  • Other electronic parts

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Width 250mm Height 85mm High-performance air-cooled aluminum heat sink

High-performance heat sink series for power electronics PM (Profilmecc)

The PM (Profilmecc) series provided by Meccal (Italy) is an innovative product. It is a fully custom-made heat sink while also offering standard solution specifications. Manufactured using a unique patented technology for the mechanical assembly of the base and fins, Profilmecc guarantees excellent mechanical specifications. * Width, length, height, and fin shape can be designed according to application. * Designable dimension range: Width: MAX 1000mm, Length: MAX 1300mm, Base height: 8 - 50mm, Fin height: MAX 190mm * Also supports hole processing and surface treatment (anodizing, etc.).

  • profilmecc-01.jpg
  • profilmecc-02.jpg
  • profilmecc-03.jpg
  • foto-pagina-profilmecc.jpg
  • logo.png
  • Other electronic parts

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Large aluminum heat sink for high-performance air cooling, 300mm wide and 135mm high.

High-performance heat sinks for power electronics PM (Profilmecc) series

The PM (Profilmecc) series provided by Meccal (Italy) is an innovative product. It is a completely custom-made heat sink while also offering standard solution specifications. Manufactured using a unique patented technology for the mechanical assembly of the base and fins, Profilmecc ensures excellent mechanical specifications. * Width, length, height, and fin shape can be designed according to application. * Designable dimension range: Width: MAX 1000mm, Length: MAX 1300mm, Base height: 8 - 50mm, Fin height: MAX 190mm * Also supports hole processing and surface treatment (anodizing, etc.).

  • profilmecc-01.jpg
  • profilmecc-02.jpg
  • profilmecc-03.jpg
  • foto-pagina-profilmecc.jpg
  • logo.png
  • Other electronic parts

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SK548 Heat Sink Width 50mm x Height 10mm

Aluminum extruded heat sink with a width of 50mm and a height of 10mm - available in various lengths.

Our company, Aquas, is the official domestic distributor of the German global manufacturer Fischer Elektronik. SK548 Series Width: 50 mm x Height: 10 mm Length: 37.5 mm / 50 mm / 75 mm / 100 mm / 1000 mm Thermal resistance: 10.45 - 4.65 K/W Black anodized (SA), natural color anodized (ME), degreased (AL) *Please consult us if you have a desired length other than the above. *You can download the English catalog for extruded heat sinks.

  • sk548.eps.jpg
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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Large heat sink for power modules W800mm H135mm

High-performance heat sink series for power electronics PM (Profilmecc)

The PM (Profilmecc) series offered by Meccal (Italy) is an innovative product. It is a completely custom-made heat sink while also featuring standard solution specifications. Manufactured using a unique patented technology for the mechanical assembly of the base and fins, Profilmecc guarantees excellent mechanical specifications. * Width, length, height, and fin shape can be designed according to application. * Designable dimension range: Width: MAX 1000mm, Length: MAX 1300mm, Base height: 8 - 50mm, Fin height: MAX 190mm * Also supports hole processing and surface treatment (anodizing, etc.).

  • profilmecc-01.jpg
  • profilmecc-02.jpg
  • profilmecc-03.jpg
  • foto-pagina-profilmecc.jpg
  • logo.png
  • Other electronic parts

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SK499 | Aluminum heat sink compatible with transistor clips

Aluminum heat sink for mounting on a circuit board, capable of securing a transistor with a clip, dimensions 46 mm wide x 33 mm high.

Our company, Aquas, is the official domestic distributor of the German global manufacturer Fischer Elektronik. SK499 Extruded heat sink measuring 46 mm wide x 33 mm high. Transistors can be secured using a separately sold retaining spring (spring clip). Length variations are available. *Please feel free to contact us for more details.

  • sk499.eps.jpg
  • sk49975sa.jpg
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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SK-702 Transistor Clip Compatible Aluminum Heat Sink

Aluminum heat sink for board mounting that can secure a transistor without screws (W20 mm x H50 mm)

Our company, Aquas, is the official domestic distributor of the German global manufacturer Fischer Elektronik. SK-702 Extruded heat sink with a width of 20mm and a height of 50mm. Transistors can be secured using separately sold retaining springs (spring clips). Length variations are available. In addition to standard products, we can also manufacture custom products cut to your specified length. *Please feel free to contact us for more details.

  • sk702.eps.jpg
  • sk70250sa.jpg
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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BGA Heat Sink / HSB Series

Expansion of CUI's BGA heat sink lineup, covering sizes from 8.5mm to 69.7mm and power consumption from 1.92W to 21.74W.

A total of 15 new models have been added to the BGA heat sink lineup. The size range has expanded from 8.5 x 8.5mm to 69.7 x 69.7mm, with thicknesses from 5mm to 25mm, covering power consumption (75℃ΔT, natural air cooling) from 1.92W to 21.74W. The thermal resistance under various conditions has been specified, making it easy to evaluate the heat sinks.

  • Cooling system
  • Peltier element
  • Other electronic parts

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Heat sink for high-power LEDs

Achieving high thermal conductivity, lightweight design, and low cost! Heat sink for high-power LEDs.

The heat sink for high-power LEDs from Leading Edge Associates uses aluminum vapor chamber technology. This achieves improved thermal conductivity, reduced weight, and lower costs. With brazing processing, it becomes sturdier, and the extension fins provide even more effective heat dissipation. 【Features】 - Uses aluminum vapor chamber technology - Supports high-power LEDs up to 100W with natural convection - Compact and lightweight (both size and weight are one-third of conventional products) - Uses refrigerant as the working fluid, achieving a 30% increase in thermal conductivity - Made of 100% aluminum, 100% recyclable, eco-friendly For more details, please refer to the catalog or feel free to contact us.

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Composite heat sink

Composite heat sink optimized for thermal expansion with thermal conductivity of 1000 W/mK.

This is a super high thermal conductivity heat sink that combines core material TPG with a thermal conductivity of 1500 W/mK and capsule material optimized for thermal expansion. It is suitable for packaging high-power, high-frequency semiconductor chips.

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Sankyo International Co., Ltd. Business Introduction

Sincerity, quality, creativity, excellence! We are passionate about heat dissipation.

Sankyo International Co., Ltd. is the sales and service base in Japan for Jiangsu Sankyo Aluminum Technology Co., Ltd., a Chinese aluminum parts manufacturer. Our company mainly manufactures and imports aluminum heat sinks and motor frames at our headquarters and partner companies. Following the corporate philosophy of our parent company, Jiangsu Sankyo Aluminum Technology Co., Ltd., we pursue reliable product quality and service with the slogans of "Sincerity," "Quality," "Creativity," and "Excellence" to meet our customers' demands. [Roles] ■ Point of contact for Jiangsu Sankyo Aluminum in Japan ■ Meetings with customers ■ Handling of defects ■ Domestic transactions, JIT delivery, etc. *For more details, please refer to the catalog or feel free to contact us.

  • Other machine elements
  • Contract manufacturing

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Heat Sink "Offset SS Type"

Heat dissipation performance is improved compared to conventional comb-shaped heat sinks! Suitable for devices that require space-saving.

The "Offset SS Type" is a heat sink that improves heat dissipation by approximately 30%. By offsetting the fin pitch every other row, it significantly enhances performance compared to conventional extruded materials (comb-shaped) heat sinks. With a fin height of (maximum) 1/2, it can achieve performance equivalent to our conventional extruded material heat sinks, allowing for miniaturization and weight reduction of the equipment. The surface treatment can accommodate anodized specifications (colored), and it is capable of precision cutting, precision machining, and drilling processes. 【Features】 ■ Dividing and offsetting the fins disrupts the temperature boundary layer ■ Increases opportunities for air to collide with the fins, improving heat dissipation performance ■ Suitable for equipment that requires forced air cooling and space-saving designs ■ Surface treatment can accommodate anodized specifications (colored) ■ Capable of precision cutting, precision machining, and drilling processes *For more details, please refer to the related links or feel free to contact us.

  • aluminum
  • Other electronic parts
  • Other machine elements

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