Visualization of reactive species behavior (1) Invasion of reactive species into narrow spaces
Comparison of Ar plasma treatment and oxygen plasma treatment using "PLAZMARK heat-resistant labels."
We installed the wafer with a gap and evaluated the movement of reactive species entering that gap using "PLAZMARK Heat Resistant" No. 101 attached to the back of the wafer. Comparing Ar plasma treatment and O2 plasma treatment, the O2 plasma treatment caused discoloration even at the center of the back side of the wafer, suggesting the presence of long-lived oxygen radicals that can wrap around. Additionally, since the back side of the wafer did not discolor with Ar plasma treatment, it is believed that Ar ions do not wrap around to the back side. 【Discharge Conditions】 ■ RF Plasma Device (Arios Co., Ltd.) - Ar gas = 5Pa, Power = 80W, Time = 60sec - O2 gas = 5Pa, Power = 80W, Time = 30sec *For more details, please refer to the related links or feel free to contact us.
- Company:サクラクレパス PI事業部
- Price:Other