laser×佐用精機製作所 - メーカー・企業と製品の一覧

Sayou Seiki Seisakusho Co., Ltd. Company Profile

Support problem-solving at each stage from the phase of shaping the image to the completion of prototyping and mass production.

Sayo Seiki Manufacturing Co., Ltd. is a supporter of semiconductor processing. By assisting in the launch of development products for major companies, we have been fortunate to gain experience in the assembly of various genres, including not only LEDs but also LDs, microwaves, Hall elements, MEMS, and related modules. Leveraging our past experiences, we are here to assist with "production from a single item" and "turning just an image into a tangible product." If you encounter any difficulties, please do not hesitate to reach out to us. Our experienced staff is confident that we can be of service to your company. 【Sales Items】 ■ Semiconductor processing and assembly services from prototypes to mass production ■ Design and manufacturing of tools and jigs necessary for processing and assembly *For more details, please refer to the PDF materials or feel free to contact us.

企業：佐用精機製作所
価格：Other

Contract manufacturing

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Resin sealing (molding) service

We provide high-quality resin encapsulation (molding) services, even for small quantities!

We handle several types of resins, including epoxy, silicone, acrylic, and urethane, for resin encapsulation. We will prepare the encapsulating resin according to your preferences. Using coating equipment, we provide high-quality resin encapsulation (molding) services. 【Features】 ■ Prototyping for resin encapsulation is possible with small quantities. ■ Short lead times and low-cost options are available using simple molding techniques. ■ Encapsulation with phosphors and additives is possible. ■ We can perform not only the resin encapsulation process but also the preceding and subsequent process work consistently in-house.

企業：佐用精機製作所
価格：Other

Lamps and light emitting devices
Printed Circuit Board
Sensors

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Points to consider when designing components with flip chip using AuSn joints.

During prototyping and mass production, problems are sure to arise! Points to consider for quality when designing AuSn joints.

The content I am about to reveal is based on our company's past experiences. Many of these experiences were gained during the mass production of LDs at Sanyo Electric. Additionally, regarding LEDs, we have gained significant experience while assisting with problem-solving during the implementation of CREE chip flip chips, which are based on AuSn bonding. The main purpose of this column is to help you recognize the quality considerations that should be taken into account when designing AuSn bonded products. *For detailed content of the column, please refer to the PDF document. For more information, feel free to contact us.*

企業：佐用精機製作所
価格：Other

LED Module
diode
Other semiconductors

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Image of the operating principle of LEDs and points of focus for troubleshooting.

We will introduce the causes of troubles in a column format that can be understood through images!

This time, I will explain the operating principle of LEDs and the troubles that can be seen from that principle through imagery. LEDs vary widely in shape and issues depending on their individual wavelengths and applications. It becomes difficult to grasp the operating principle from the physical phenomena of optical semiconductors. If you can understand it intuitively, you will see that there are many similarities among the various shapes and issues. *For detailed content of the column, you can view it in the PDF materials. Please feel free to contact us for more information.

企業：佐用精機製作所
価格：Other

LED Module
diode
Other semiconductors

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Principles of Joining Imagery and Troubleshooting Focus Points

Understanding wire bonds through images! Introducing topics such as WB as a joining method in a column.

There is a lack of explanations that connect the problems and their causes commonly encountered in the fields of design and quality management as images. When one can grasp the concepts in the fields of design and quality management, it becomes valuable knowledge when considering material design or when hypothesizing the causes of issues within semiconductors. Our company has experienced a large volume of wire bonding under major manufacturers since the early wire bonding days of the 1980s. We have encountered many issues, including complaints. *For detailed content of the column, please refer to the PDF document. For more information, feel free to contact us.*

企業：佐用精機製作所
価格：Other

glue

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laser×佐用精機製作所 - メーカー・企業と製品の一覧

laserの製品一覧

Sayou Seiki Seisakusho Co., Ltd. Company Profile

Resin sealing (molding) service

Points to consider when designing components with flip chip using AuSn joints.

Image of the operating principle of LEDs and points of focus for troubleshooting.

Principles of Joining Imagery and Troubleshooting Focus Points

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