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[Data] WTI Blog April 2018 - March 2019

[Data] WTI Blog April 2018 - March 2019

Important considerations when designing semiconductor packages and antennas are included!

This document summarizes the WTI blog of Wave Technology Co., Ltd., which is engaged in the "Development Design Promotion Business" aimed at solving the shortage of engineers, from April 3, 2018, to March 29, 2019. It introduces the fifth installment of semiconductor package introductions on April 3, 2018, titled "Lead Frame Package," as well as embedded security measures that developers in the IoT era should be aware of from May 8, 2018, and considerations when designing antennas from June 5, 2018. In addition, it includes a wealth of useful information related to products and industries. We encourage you to read it. [Contents (excerpt)] ■ April 3, 2018 - April 24, 2018 ■ May 8, 2018 - May 29, 2018 ■ June 5, 2018 - June 26, 2018 ■ July 3, 2018 - July 31, 2018 ■ August 7, 2018 - August 28, 2018 *For more details, please refer to the PDF document or feel free to contact us.

  • Other contract services
  • Embedded system design service
  • Circuit board design and manufacturing

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[Information] WTI Blog: Semiconductor Packaging Edition

[Information] WTI Blog: Semiconductor Packaging Edition

Packed with our company's know-how on the occurrence and measurement methods of "warping" in semiconductor packages!

This document summarizes the WTI blog of Wave Technology Co., Ltd., which is engaged in the "Development Design Promotion Business" aimed at solving the shortage of engineers, covering the years 2017 to 2020, specifically focusing on semiconductor packaging. It includes topics such as "What is packaging?", an "Introduction to semiconductor packaging," and "Electrical characteristic models for noise analysis." Please take a moment to read it. 【Contents (Excerpt)】 ■2017.6.6 What is packaging? ■2017.6.13 There are many types of packaging! ■2017.9.26 Introduction to semiconductor packaging Part 3: 'High-functionality packages' ■2017.12.26 Introduction to semiconductor packaging Part 4: 'Wire BGA packages' ■2018.4.3 Introduction to semiconductor packaging Part 5: 'Lead frame packages' *For more details, please refer to the PDF document or feel free to contact us.

  • Other semiconductors
  • Evaluation Board

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[Data] WTI Blog November 2020

[Data] WTI Blog November 2020

Evaluation and analysis methods for BGA packages and BGA substrate design are published!

This document summarizes the WTI blog of Wave Technology Co., Ltd., which is engaged in the "Development Design Promotion Business" aimed at solving the shortage of engineers, from November 2, 2020, to November 27, 2020. It introduces topics such as "Recommendation for Automatic Measurement - Basics of Instrument Control" from November 2, 2020, "Evaluation and Analysis Methods for BGA Packages" from November 10, 2020, and "What is the Required Ground Area for Each LTE Band?" from November 11, 2020. Additionally, it includes a wealth of useful information related to products and industries. We encourage you to take a look. [Contents] ■ November 2, 2020: Recommendation for Automatic Measurement - Basics of Instrument Control ■ November 5, 2020: Required Functions for Power Conditioners (Part 1) ■ November 6, 2020: Trying Illumination Control with Arduino Part 1 ■ November 10, 2020: Evaluation and Analysis Methods for BGA Packages ■ November 11, 2020: What is the Required Ground Area for Each LTE Band? (Radiation Efficiency of Monopole Antennas) *For more details, please refer to the PDF document or feel free to contact us.

  • Other contract services
  • Embedded system design service
  • Circuit board design and manufacturing

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[Data] WTI Blog June 2021

[Data] WTI Blog June 2021

Publication on alternative product research for EOL measures and introduction to semiconductor package assembly processes!

This document summarizes the WTI blog of Wave Technology Co., Ltd., which is engaged in "development and design promotion business" to solve the shortage of engineers, from June 1, 2021, to June 29, 2021. It introduces topics such as "Investigation of Alternatives in EOL Measures" on June 8, 2021, "Continued Design Considering PCB Manufacturing" on June 14, 2021, and "The Ventilation Policy for Electronic Devices is the Same as for Rooms" on June 23, 2021. In addition, we have published a wealth of useful information regarding products and industries. We encourage you to read it. [Contents (excerpt)] ■ June 1, 2021: What is ESD Testing? ■ June 8, 2021: Investigation of Alternatives in EOL Measures - Using Crystal Oscillators as an Example ■ June 14, 2021: Continued Design Considering PCB Manufacturing ■ June 15, 2021: WTI Supports Sustainable Development ■ June 22, 2021: Functions Required for Power Conditioners (Part 2) *For more details, please refer to the PDF document or feel free to contact us.

  • Other contract services
  • Embedded system design service
  • Circuit board design and manufacturing

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[Data] Shirutoku Report No. 24 # Evaluation and Analysis Methods of BGA Packages

[Data] Shirutoku Report No. 24 # Evaluation and Analysis Methods of BGA Packages

A structure in which electrodes are provided on the substrate, solder balls are formed on top, and are joined to the electrodes on the package side!

★★Shirutoku Report: Useful Information You Should Know★★ In this report, we will discuss the analysis methods for "BGA packages." "BGA" stands for "Ball Grid Array," which is a type of package for integrated circuits (ICs). In simple terms, it is a surface mount package that has electrodes (lands) on the substrate, with solder balls formed on top to connect to the electrodes on the package side. For more details, please take a look. [Contents] ■ About BGA Packages ■ Dyeing Analysis ■ Cross-Section Polishing *For more information, please refer to the PDF document or feel free to contact us.*

  • Contract Analysis
  • Contract Analysis
  • Other analyses

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