Packed with our company's know-how on the occurrence and measurement methods of "warping" in semiconductor packages!
This document summarizes the WTI blog of Wave Technology Co., Ltd., which is engaged in the "Development Design Promotion Business" aimed at solving the shortage of engineers, covering the years 2017 to 2020, specifically focusing on semiconductor packaging. It includes topics such as "What is packaging?", an "Introduction to semiconductor packaging," and "Electrical characteristic models for noise analysis." Please take a moment to read it. 【Contents (Excerpt)】 ■2017.6.6 What is packaging? ■2017.6.13 There are many types of packaging! ■2017.9.26 Introduction to semiconductor packaging Part 3: 'High-functionality packages' ■2017.12.26 Introduction to semiconductor packaging Part 4: 'Wire BGA packages' ■2018.4.3 Introduction to semiconductor packaging Part 5: 'Lead frame packages' *For more details, please refer to the PDF document or feel free to contact us.
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【Other Published Content (Excerpt)】 ■2018.4.16 WTI can also handle semiconductor chip packaging and chip evaluation boards! ■2018.7.10 Definition of pulse waveform ■2018.10.16 Analysis aimed at seeing the unseen ■2018.11.27 Towards evaluating the reliability of semiconductor package implementation - Daisy chain samples to identify break points ■2019.1.29 Basic knowledge of cardboard *For more details, please refer to the PDF materials or feel free to contact us.
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As a development and design company, we promote the development, design, and evaluation of semiconductor peripheral circuits and application products through simulation technology.