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pad Product List

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Insulating and heat-dissipating material, thermal conductive soft pad

It has high-performance thermal conductivity properties and can solve many thermal problems!

The thermal conductive soft pad has high-performance thermal conductivity properties and can solve many thermal issues. It can also be attached to the surfaces of electronic components of various shapes, including ICs, CPUs, LEDs, laptops, and DVD devices. It has already been widely adopted in memory modules, heat pipe units, voltage regulator power supplies, and automotive electronic devices. By adding a fiberglass layer, mechanical strength can be enhanced, and adhesive tape can also be added. For more details, please contact us or refer to the catalog.

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Laminated wear-resistant material with aluminum foil laminated cushion pad

Ideal for high-pressure pressing processes in soft-type FPC board manufacturing!

The aluminum foil laminated cushion pad is specially designed for the first layer of the soft type FPC substrate manufacturing lamination process (high-temperature pressing). The pad, composed of aluminum foil and silicone rubber, excels in shock absorption and high-pressure characteristics, making it ideal for filling the gap between patterns in the FPC lamination process. Its smooth silicone surface offers excellent friction durability and chemical resistance. For more details, please contact us or refer to the catalog.

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Insulating and heat-dissipating materials, semiconductor devices, insulating and heat-dissipating pads.

High electrical durability! Excellent mechanical durability and puncture resistance!

Semiconductor device insulation and heat dissipation pads are used in many electronic devices as an alternative to traditional mica insulation sheets, thanks to their excellent thermal and electrical properties. Additionally, they are reinforced with a fiberglass cloth layer, enhancing their resistance to breakage, penetration, and bending. Adhesive tape (with PSA) can be added on one side or both sides as an option. We offer a wide variety of shapes to accommodate diverse applications. For more details, please contact us or refer to our catalog.

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Layered, abrasion-resistant material layered cushion pad

Available for use in the lamination process of printed circuit boards and FPC boards (high-temperature pressing)!

The laminated cushion pad is specially designed as an alternative to traditional craft paper for the lamination process (high-temperature pressing) of printed circuit boards and FPC boards. The product is composed of laminated silicone glass fiber reinforcement, demonstrating excellent shock absorption capability and high-pressure durability during the manufacturing process. The thick, rigid surface excels in abrasion resistance and chemical reaction resistance. Products are available in various dimensions and thicknesses in two standard colors. For more details, please contact us or refer to the catalog.

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Layered wear-resistant material with iron foil laminated cushion pad

Ideal for high-pressure pressing processes in soft-type FPC board manufacturing!

The iron foil laminated cushion pad is specially designed for the bottom layer of the soft type FPC substrate manufacturing lamination process (high-temperature pressing). The pad, composed of iron foil and silicone rubber, excels in shock absorption and high-pressure characteristics, maintaining horizontal alignment during the pressing process. Its smooth and hard silicone surface offers excellent friction durability and chemical resistance. For more details, please contact us or refer to the catalog.

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