Low dielectric resin filler for additives in semiconductor packaging and assembly materials.
It is a resin filler with low dielectric properties, an additive that meets the requirements of Dk 3.0 and Df 0.002 or lower for 5G and 6G.
We offer a lineup of hollow types (non-foamed) with excellent low dielectric constant and solid types that consider handling properties. 【Intended Applications】 Additives for materials in semiconductor packaging and mounting fields. 【Product Lineup】 Particle Structure: Hollow Type Particle Structure: Solid Type For information on composition, particle size, hollow ratio, apparent density, dielectric properties (Dk, Df), and heat resistance, please download the materials for confirmation. 【Customization Examples】 Coarse particle cutting Hollow ratio adjustment Surface treatment Flame retardancy improvement
- Company:積水化成品工業
- Price:Other