Ultra-high heat-resistant bismaleimide resin "HR3030/3032/3070"
Low softening point, ultra-high heat resistance, high thermal decomposition temperature, and low shrinkage bismaleimide-based resin!
"HR3030/3032/3070" is a bismaleimide resin characterized by low softening point, ultra-high heat resistance, high thermal decomposition temperature, and low shrinkage. When measured for molecular weight by GPC, "HR3030" is 670 Mw, "HR3032" is 1000 Mw, and "HR3070" is 660 Mw. 【Features】 ■ Low softening point ■ Ultra-high heat resistance ■ High thermal decomposition temperature ■ Low shrinkage ■ Bismaleimide resin *For more details, please refer to the PDF document or feel free to contact us.
- Company:プリンテック
- Price:Other