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resin(pa) - List of Manufacturers, Suppliers, Companies and Products

Last Updated： Aggregation Period:Oct 15, 2025～Nov 11, 2025
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resin Product List

166～180 item / All 188 items

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[Newly Developed Product] Two-Component Heat-Curing Epoxy Resin TE-7130

[Newly Developed Product] Two-Component Heat-Curing Epoxy Resin TE-7130

General-purpose epoxy resin for encapsulating electrical and electronic components. Suitable for encapsulating motors, coils, and more.

"TE-7130" is a general-purpose, two-component, heat-curing epoxy resin for the encapsulation of electrical and electronic components. With a mixing ratio of 100:20, it is easy to handle, and after curing, it becomes an encapsulant that combines high strength and high insulation properties. Its greatest feature is the realization of a low coefficient of linear expansion of 27 ppm/K. This reduces expansion and contraction due to temperature changes, thereby lowering the risk of crack formation. It is resistant to thermal cycling, ensuring long-term reliability for power devices and electronic components. [Features] - Two-component heat-curing epoxy resin (mixing ratio 100/20) - Low coefficient of linear expansion: 27 ppm/K → strong against thermal cycling, crack suppression - High insulation properties (dielectric breakdown strength 33 kV/mm, volume resistivity 1×10^16 Ω·cm) - High strength (flexural strength 141 MPa, flexural modulus 10,000 MPa) - Low water absorption rate of 0.1% ensures long-term stability *For more details, the product specification sheet is available for download as a PDF from the link below, or please contact us. *Samples are also available, so please contact us if needed.

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[New Development] Two-component Heat-Curing Epoxy Resin TE-7000

[New Development] Two-component Heat-Curing Epoxy Resin TE-7000

Fills in detail with low viscosity! A highly reliable epoxy resin that can also be considered as a varnish alternative. Flexible response to work plans with a usable time of 24 hours.

The "TE-7000" is a two-component, heat-curing epoxy resin suitable for sealing applications in electrical and electronic components. Its low viscosity design allows for excellent filling of details and can accommodate complex part shapes. This product has a long pot life of 24 hours (at 60°C), ensuring stable sealing operations while providing ample time for work processes. Additionally, it has a proven track record of passing high-temperature tests at 180 degrees and thermal tests at -40°C and 180°C. 【Features】 ■ Two-component heat-curing epoxy resin (mixing ratio 100:60) ■ Excellent filling properties and workability due to low viscosity ■ Long pot life of 24 hours (at 60°C) ■ High insulation properties (dielectric breakdown strength over 25kV/mm, volume resistivity > 1×10^16Ω·cm) ■ Flexural strength of 81MPa and flexural modulus of 2,400MPa ■ Low water absorption rate of 0.3% for improved reliability *For more details, the product's specification sheet is available for download as a PDF from the link below, or you can contact us for more information. *Samples are also available, so please contact us if needed.

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[New Development] One-component Heat-Curing Epoxy Resin TE-5111K

[New Development] One-component Heat-Curing Epoxy Resin TE-5111K

This is a one-component heat-curing epoxy resin for new product development. It has a low curing shrinkage rate, a relatively high Tg point, and a fast curing time. [Properties table available]

TE-5111K is an epoxy resin with a low curing shrinkage rate, fast curing time, and a relatively high glass transition temperature of 168°C. It can be used for encapsulation of electrical and electronic components. Single-component heat-curing black epoxy resin Features: low coefficient of thermal expansion, low shrinkage, high workability (relatively low viscosity), high heat resistance, short curing time *For more details, we have published a product specification sheet, so please download the PDF from the link below or contact us. *Samples are also available, so please contact us if you need them.

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  • Other electronic parts

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Impregnating sealant "5100"

Impregnating sealant "5100"

Seal the gaps inside the electric wires and wire harnesses. A new sealing method to replace O-rings and potting.

"5100" is a sealant suitable for sealing gaps inside electric wires, wire harnesses, and similar applications. It maintains flexibility even after curing, making it suitable for sealing gaps in molded parts of connectors and sensors. Have you ever experienced oil or humid air leaking through gaps inside a wire harness? Or have you encountered situations where the insulation was damaged during use, allowing water to enter? In such scenarios, our impregnating liquid "5100" demonstrates high reliability. Additionally, "5100" retains high flexibility even after curing. Due to the differences in thermal expansion coefficients between resin and metal molded products, gaps can significantly shift when subjected to thermal shock. Even in such cases, "5100" moves with the shifting gaps, helping to minimize their occurrence. 【Basic Properties】 ■Material Acrylic resin ■Heat Resistance -40℃ to 150℃ 【Target Materials】 ■Fluoropolymer wires ■Cross-linked polyethylene wires ■Super engineering plastics such as PPS and PEEK ■Engineering plastics such as PA6, PA66, POM, and PBT

  • Other cable related products

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Development and Evaluation/Test Methods of High-Pressure Hydrogen Tanks for Fuel Cell Vehicles

Development and Evaluation/Test Methods of High-Pressure Hydrogen Tanks for Fuel Cell Vehicles

What non-metal materials are required for the development of lightweight hydrogen containers at high pressures of 70 MPa!?

High-Pressure Hydrogen Tanks for Fuel Cell Vehicles: R&D, Safety Inspection, Regulatory Trends, etc. ★Will regulatory relaxation be implemented as a national policy!? What non-metallic materials are required for the development of lightweight hydrogen containers at 70 MPa!? 【Venue】 Kawasaki City International Exchange Center, 2nd Floor, Conference Room 5【Kanagawa, Kawasaki】 Date and Time August 23, 2013 (Friday) 11:00-16:00

  • Company：AndTech
  • Price：10,000 yen-100,000 yen
  • Technical Seminar

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Room temperature short-term curing epoxy resin TE-6011K

Room temperature short-term curing epoxy resin TE-6011K

A two-component epoxy resin that cures in 4 hours at room temperature! The reduction in curing time leads to cost savings.

TE-6011K 2-component fast-curing epoxy resin Features: Cures in 4 hours at room temperature Applications: Insulation and protection of electrical and electronic components 【Specifications (excerpt)】 ■Mixing viscosity: 19,500 (mPa·s) at 25℃ ■Glass transition temperature: 40℃ ■Cured density: 1.65 (water displacement method) ■Mixing ratio R/H: 100/38 ■Curing conditions: 25℃ x 4h

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  • Other electronic parts

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[Research Material] Global Market for Emulsion PVC Paste Resin

[Research Material] Global Market for Emulsion PVC Paste Resin

World Market for Emulsion PVC Paste Resin: Micro-suspension Method, Emulsion Method, Plastic Flooring, Artificial Leather, Paint ...

This research report (Global Emulsion PVC Paste Resin Market) investigates and analyzes the current state and outlook for the global market of emulsion PVC paste resin over the next five years. It includes information on the overview of the global emulsion PVC paste resin market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the emulsion PVC paste resin market focus on micro-suspension method and emulsion method, while the segments by application include plastic flooring, artificial leather, paints and coatings, wallpaper, and automotive sealing. The regional segments are categorized into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa, to calculate the market size of emulsion PVC paste resin. It also includes the market share of major companies in the emulsion PVC paste resin sector, product and business overviews, and sales performance.

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[Research Material] Global Market for High-Temperature Thermoplastic Resins (HTTs)

[Research Material] Global Market for High-Temperature Thermoplastic Resins (HTTs)

Global Market for High-Temperature Thermoplastic Resins (HTTs): High-Temperature Fluoropolymers, High-Performance Polyamides (HPPA), Polyphenylene Sulfide (PP ...

This research report (Global High Temperature Thermoplastics (HTTs) Mark) investigates and analyzes the current state and outlook for the global market of high-temperature thermoplastic resins (HTTs) over the next five years. It includes information on the overview of the global high-temperature thermoplastic resin (HTTs) market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The market segments by type for high-temperature thermoplastic resins (HTTs) include high-temperature fluoropolymers, high-performance polyamides (HPPA), polyphenylene sulfide (PPS), sulfone polymers (SP), liquid crystal polymers (LCP), aromatic ketone polymers (AKP), and polyimides (PI). The segments by application focus on transportation, electrical & electronics, industrial, and medical. The regional segments are divided into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa, to calculate the market size of high-temperature thermoplastic resins (HTTs). Market share of major companies in high-temperature thermoplastic resins (HTTs) ...

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[Research Material] Global Market for PVC Paste Resin

[Research Material] Global Market for PVC Paste Resin

World Market for PVC Paste Resin: Micro-Suspension Method, Emulsion Method, Plastic Flooring, Artificial Leather, Paints & Coatings ...

This research report (Global Polyvinyl Chloride Paste Resin Market) investigates and analyzes the current status and outlook for the global market of polyvinyl chloride paste resin over the next five years. It includes information on the overview of the global polyvinyl chloride paste resin market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the polyvinyl chloride paste resin market focus on micro-suspension method and emulsion method, while the segments by application target plastic flooring, artificial leather, paints & coatings, wallpaper, and automotive sealing. The regional segments are divided into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa to calculate the market size of polyvinyl chloride paste resin. It also includes the market share of major companies in the polyvinyl chloride paste resin sector, product and business overviews, and sales performance.

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[New Development] Two-component Room Temperature Curing Epoxy Resin TE-1006-2

[New Development] Two-component Room Temperature Curing Epoxy Resin TE-1006-2

Room temperature curing × high adhesion × high moisture resistance! Epoxy resin for small motors and sensors. Cures at room temperature, energy-saving high-performance epoxy.

The TE-1006-2 is a two-component, room temperature curing epoxy resin developed for preventing liquid leakage in small motors and sensor components. It can cure without the need for heating, at 25°C for 24 hours or at 100°C for 30 minutes, contributing to improved work efficiency and energy savings on-site. This product exhibits a shear adhesive strength of 21 MPa (SUS/SUS, 25°C), ensuring high adhesive reliability. Furthermore, it is designed to have high heat and humidity resistance, maintaining performance even in harsh environments. With its high thixotropic properties, it excels in workability, making it easy to apply and build up in targeted areas, thus accommodating a wide range of applications such as sealing small motors, sensors, and electronic components. **Features** - Two-component, room temperature curing epoxy resin (mixing ratio 100:12) - High adhesion with a shear adhesive strength of 21 MPa - High heat and humidity resistance design ensures long-term reliability *For more details, the product's specification sheet is available for download as a PDF below, or you can contact us for more information.* *Samples are also available, so please contact us if needed.*

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[Book] Trends in the Development of Next-Generation High-Speed and High-Frequency Transmission Materials (No. 2274)

[Book] Trends in the Development of Next-Generation High-Speed and High-Frequency Transmission Materials (No. 2274)

[Available for preview] - Low dielectric resin, high-frequency circuit boards, semiconductor packaging materials, optoelectronic fusion -

★5G/6G and the proliferation of generative AI support high-speed, high-capacity communication devices and materials all in one place! ★Requirements for materials used in 2.xD, 3D implementation, chiplets, and next-generation packaging, along with development examples from various companies. －－－－－－－－－－－－－－－－－－－－－ ■ Key Points of This Book 【Low Dielectric Loss Materials】 - Achieving low dielectric constant and adhesion - Design of PPE resin - Solvent-soluble polyimide resin - Fluorine resin with adhesion properties - Film formation of liquid crystal polymers - Olefin-based low dielectric films - Low dielectric halogen-free flame retardants - Development of glass cloth 【Fine Circuit Formation】 - Improving adhesion of difficult-to-bond materials - Copper sulfate plating process - High-adhesion Cu seed layer - Low-resistance, adhesive Cu layer formation technology 【Semiconductor Package Substrate Materials】 - Reducing thermal expansion of organic core materials - Interlayer insulating films - Solder resist - Photosensitive films - For high-end computers - FO-WLP, FO-PLP - For WOW process 【Co-Packaged Optics】 - Co-Packaged Optics - Compact and high-density optical packaging - Silicon photonics - Optical transceivers

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Molding and Processing: Miorex PGX-595 (HG)

Molding and Processing: Miorex PGX-595 (HG)

A highly reliable grade with excellent heat resistance, mechanical strength, and dimensional stability!

The Miolex series is a product that combines excellent thermal insulation, mechanical strength, outstanding dimensional stability, exceptional cost performance, safety without the use of asbestos, electrical insulation, and machinability. 【PGX-595(HG) (Basic Grade)】 Heat resistance temperature (°C): 400 Compression creep (％): 0.08 Bending strength (MPa): 120–130 Compression strength (MPa): 420–480 Impact strength (J/cm): 2.5 Thermal expansion rate (1/°C): 2.3×10^5 Thermal conductivity (W): 0.3 Volume resistivity (Ω-cm): FW,★1=10^15, FW,★2=10^13 Water absorption rate: 0.1 Specific gravity: 2.0–2.1 Our company performs precision machining of PGX-595(HG) using numerous machine tools in a temperature-controlled environment 24 hours a day. *For more details, please refer to the PDF document or feel free to contact us.

  • Composite Materials
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Molding and Processing: Miorex PMX-561/562

Molding and Processing: Miorex PMX-561/562

It has high heat resistance and cost-effectiveness, along with a versatility that allows it to be used in a wide range of applications.

The Miolex series is a product that combines excellent thermal insulation, mechanical strength, outstanding dimensional stability, exceptional cost performance, safety without the use of asbestos, electrical insulation, and machinability. 【PMX-561(HR-1) (Basic Grade)】 Heat resistance temperature (°C): 500 Compression creep (％): 0.27 Bending strength (MPa): 44–55 Compression strength (MPa): 120–150 Impact strength (J/cm): 1.1 Thermal expansion rate (1/°C): 9.0×10^6 Thermal conductivity (W): 0.3 Volume resistivity (Ω-cm): FW,★1 = 10^14, FW,★2 = 10^9 Water absorption rate: 4.0–0.6 Specific gravity: 2.0–2.2 At our company, we perform precision machining of PMX-561(HR-1) and PMX-562(HR-2) using a variety of machine tools in a temperature-controlled environment managed 24 hours a day. *For more details, please refer to the PDF document or feel free to contact us.

  • Composite Materials
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Miolex suitable for use as insulation plates for molding machines and molds [machining].

Miolex suitable for use as insulation plates for molding machines and molds [machining].

Thickness tolerance of ±0.01 is possible! A highly reliable grade with excellent heat resistance, mechanical strength, and dimensional stability!

The Miolex series is a product that combines excellent thermal insulation, mechanical strength, outstanding dimensional stability, exceptional cost performance, safety without the use of asbestos, electrical insulation, and machinability. 【PGX-595(HG) (Basic Grade)】 Heat resistance temperature (°C): 400 Compression creep rate (%): 0.08 Bending strength (MPa): 120–130 Compression strength (MPa): 420–480 Impact strength (J/cm): 2.5 Thermal expansion rate (1/°C): 2.3×10^5 Thermal conductivity (W): 0.3 Volume resistivity (Ω-cm): FW,★1=10^15, FW,★2=10^13 Water absorption rate: 0.1 Specific gravity: 2.0–2.1 Our company performs precision machining of PGX-595(HG) in a temperature-controlled environment using numerous machine tools, 24 hours a day. *For more details, please refer to the PDF document or feel free to contact us.

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Newly Developed Product: UV-Curable Epoxy Acrylate TRU-0220FR

Newly Developed Product: UV-Curable Epoxy Acrylate TRU-0220FR

UV-curable epoxy acrylate that balances transparency and high strength. Suitable for applications requiring reliability equivalent to UL94 V-0.

"TRU-0220FR" is a one-component UV-curable epoxy acrylate resin developed for the coating of electronic components. It allows for rapid curing under UV irradiation from a metal halide lamp (1,500mJ/cm²), contributing to improved productivity in mass production processes. This product features low viscosity (2,100mPa·s), making it easy to work with and suitable for filling and coating complex part shapes. It is flame-retardant (equivalent to UL94 V-0 at 5mm thickness) and can be adapted for use in fields where safety is a concern. It balances transparency and high hardness, with a low water absorption rate of 0.3%, providing excellent moisture and heat resistance. Suitable applications include electronic component coatings, transparent protective materials, and areas requiring heat resistance and flame retardancy. 【Features】 ■ One-component UV-curable epoxy acrylate resin ■ High reactivity with rapid curing (UV: 1,500mJ/cm²) ■ Excellent workability due to low viscosity *For more details, the product specification sheet is available for download as a PDF below, or please contact us. *Samples are also available, so please reach out if needed.

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