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resin(pa) - List of Manufacturers, Suppliers, Companies and Products

Last Updated： Aggregation Period:Dec 03, 2025～Dec 30, 2025
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resin Product List

181～195 item / All 200 items

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[Research Material] Global Market for PVC Paste Resin

[Research Material] Global Market for PVC Paste Resin

World Market for PVC Paste Resin: Micro-Suspension Method, Emulsion Method, Plastic Flooring, Artificial Leather, Paints & Coatings ...

This research report (Global Polyvinyl Chloride Paste Resin Market) investigates and analyzes the current status and outlook for the global market of polyvinyl chloride paste resin over the next five years. It includes information on the overview of the global polyvinyl chloride paste resin market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the polyvinyl chloride paste resin market focus on micro-suspension method and emulsion method, while the segments by application target plastic flooring, artificial leather, paints & coatings, wallpaper, and automotive sealing. The regional segments are divided into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa to calculate the market size of polyvinyl chloride paste resin. It also includes the market share of major companies in the polyvinyl chloride paste resin sector, product and business overviews, and sales performance.

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[New Development] Two-component Room Temperature Curing Epoxy Resin TE-1006-2

[New Development] Two-component Room Temperature Curing Epoxy Resin TE-1006-2

Room temperature curing × high adhesion × high moisture resistance! Epoxy resin for small motors and sensors. Cures at room temperature, energy-saving high-performance epoxy.

The TE-1006-2 is a two-component, room temperature curing epoxy resin developed for preventing liquid leakage in small motors and sensor components. It can cure without the need for heating, at 25°C for 24 hours or at 100°C for 30 minutes, contributing to improved work efficiency and energy savings on-site. This product exhibits a shear adhesive strength of 21 MPa (SUS/SUS, 25°C), ensuring high adhesive reliability. Furthermore, it is designed to have high heat and humidity resistance, maintaining performance even in harsh environments. With its high thixotropic properties, it excels in workability, making it easy to apply and build up in targeted areas, thus accommodating a wide range of applications such as sealing small motors, sensors, and electronic components. **Features** - Two-component, room temperature curing epoxy resin (mixing ratio 100:12) - High adhesion with a shear adhesive strength of 21 MPa - High heat and humidity resistance design ensures long-term reliability *For more details, the product's specification sheet is available for download as a PDF below, or you can contact us for more information.* *Samples are also available, so please contact us if needed.*

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[Book] Trends in the Development of Next-Generation High-Speed and High-Frequency Transmission Materials (No. 2274)

[Book] Trends in the Development of Next-Generation High-Speed and High-Frequency Transmission Materials (No. 2274)

[Available for preview] - Low dielectric resin, high-frequency circuit boards, semiconductor packaging materials, optoelectronic fusion -

★5G/6G and the proliferation of generative AI support high-speed, high-capacity communication devices and materials all in one place! ★Requirements for materials used in 2.xD, 3D implementation, chiplets, and next-generation packaging, along with development examples from various companies. －－－－－－－－－－－－－－－－－－－－－ ■ Key Points of This Book 【Low Dielectric Loss Materials】 - Achieving low dielectric constant and adhesion - Design of PPE resin - Solvent-soluble polyimide resin - Fluorine resin with adhesion properties - Film formation of liquid crystal polymers - Olefin-based low dielectric films - Low dielectric halogen-free flame retardants - Development of glass cloth 【Fine Circuit Formation】 - Improving adhesion of difficult-to-bond materials - Copper sulfate plating process - High-adhesion Cu seed layer - Low-resistance, adhesive Cu layer formation technology 【Semiconductor Package Substrate Materials】 - Reducing thermal expansion of organic core materials - Interlayer insulating films - Solder resist - Photosensitive films - For high-end computers - FO-WLP, FO-PLP - For WOW process 【Co-Packaged Optics】 - Co-Packaged Optics - Compact and high-density optical packaging - Silicon photonics - Optical transceivers

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Molding and Processing: Miorex PGX-595 (HG)

Molding and Processing: Miorex PGX-595 (HG)

A highly reliable grade with excellent heat resistance, mechanical strength, and dimensional stability!

The Miolex series is a product that combines excellent thermal insulation, mechanical strength, outstanding dimensional stability, exceptional cost performance, safety without the use of asbestos, electrical insulation, and machinability. 【PGX-595(HG) (Basic Grade)】 Heat resistance temperature (°C): 400 Compression creep (％): 0.08 Bending strength (MPa): 120–130 Compression strength (MPa): 420–480 Impact strength (J/cm): 2.5 Thermal expansion rate (1/°C): 2.3×10^5 Thermal conductivity (W): 0.3 Volume resistivity (Ω-cm): FW,★1=10^15, FW,★2=10^13 Water absorption rate: 0.1 Specific gravity: 2.0–2.1 Our company performs precision machining of PGX-595(HG) using numerous machine tools in a temperature-controlled environment 24 hours a day. *For more details, please refer to the PDF document or feel free to contact us.

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Molding and Processing: Miorex PMX-561/562

Molding and Processing: Miorex PMX-561/562

It has high heat resistance and cost-effectiveness, along with a versatility that allows it to be used in a wide range of applications.

The Miolex series is a product that combines excellent thermal insulation, mechanical strength, outstanding dimensional stability, exceptional cost performance, safety without the use of asbestos, electrical insulation, and machinability. 【PMX-561(HR-1) (Basic Grade)】 Heat resistance temperature (°C): 500 Compression creep (％): 0.27 Bending strength (MPa): 44–55 Compression strength (MPa): 120–150 Impact strength (J/cm): 1.1 Thermal expansion rate (1/°C): 9.0×10^6 Thermal conductivity (W): 0.3 Volume resistivity (Ω-cm): FW,★1 = 10^14, FW,★2 = 10^9 Water absorption rate: 4.0–0.6 Specific gravity: 2.0–2.2 At our company, we perform precision machining of PMX-561(HR-1) and PMX-562(HR-2) using a variety of machine tools in a temperature-controlled environment managed 24 hours a day. *For more details, please refer to the PDF document or feel free to contact us.

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Miolex suitable for use as insulation plates for molding machines and molds [machining].

Miolex suitable for use as insulation plates for molding machines and molds [machining].

Thickness tolerance of ±0.01 is possible! A highly reliable grade with excellent heat resistance, mechanical strength, and dimensional stability!

The Miolex series is a product that combines excellent thermal insulation, mechanical strength, outstanding dimensional stability, exceptional cost performance, safety without the use of asbestos, electrical insulation, and machinability. 【PGX-595(HG) (Basic Grade)】 Heat resistance temperature (°C): 400 Compression creep rate (%): 0.08 Bending strength (MPa): 120–130 Compression strength (MPa): 420–480 Impact strength (J/cm): 2.5 Thermal expansion rate (1/°C): 2.3×10^5 Thermal conductivity (W): 0.3 Volume resistivity (Ω-cm): FW,★1=10^15, FW,★2=10^13 Water absorption rate: 0.1 Specific gravity: 2.0–2.1 Our company performs precision machining of PGX-595(HG) in a temperature-controlled environment using numerous machine tools, 24 hours a day. *For more details, please refer to the PDF document or feel free to contact us.

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Newly Developed Product: UV-Curable Epoxy Acrylate TRU-0220FR

Newly Developed Product: UV-Curable Epoxy Acrylate TRU-0220FR

UV-curable epoxy acrylate that balances transparency and high strength. Suitable for applications requiring reliability equivalent to UL94 V-0.

"TRU-0220FR" is a one-component UV-curable epoxy acrylate resin developed for the coating of electronic components. It allows for rapid curing under UV irradiation from a metal halide lamp (1,500mJ/cm²), contributing to improved productivity in mass production processes. This product features low viscosity (2,100mPa·s), making it easy to work with and suitable for filling and coating complex part shapes. It is flame-retardant (equivalent to UL94 V-0 at 5mm thickness) and can be adapted for use in fields where safety is a concern. It balances transparency and high hardness, with a low water absorption rate of 0.3%, providing excellent moisture and heat resistance. Suitable applications include electronic component coatings, transparent protective materials, and areas requiring heat resistance and flame retardancy. 【Features】 ■ One-component UV-curable epoxy acrylate resin ■ High reactivity with rapid curing (UV: 1,500mJ/cm²) ■ Excellent workability due to low viscosity *For more details, the product specification sheet is available for download as a PDF below, or please contact us. *Samples are also available, so please reach out if needed.

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UV-curable resin, high thixotropic type TRU-0250K

UV-curable resin, high thixotropic type TRU-0250K

Cationic UV-curable resin, providing high thixotropy.

TRU-0250K Cationic UV-curable resin Features: Heat resistance, moisture resistance Applications: Protection of small motors and sensors 【Specifications (excerpt)】 ■ Viscosity: 25℃ 158,000 (mPa·s) ■ Glass transition temperature: 125℃ ■ Shear adhesion strength: Substrate failure GL/GL 25℃ Substrate failure GL/GL 85℃/85℃RH after 1000h ■ Recommended curing conditions: UV metal halide lamp 3,000mJ/cm²

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UV-curable resin, high glass transition temperature type TRU-0251

UV-curable resin, high glass transition temperature type TRU-0251

It is a cationic UV-curable resin. It has a Tg of 150°C and excellent heat resistance.

TRU-0251 Cationic UV-curable resin Features: Heat resistance, moisture resistance Applications: Protection of small motors and sensors 【Specifications (excerpt)】 ■ Viscosity: 10,500 (mPa·s) at 25°C ■ Glass transition temperature: 150°C ■ Shear adhesion strength: Substrate failure GL/GL at 25°C Substrate failure GL/GL after 1,000 hours at 85°C/85% RH ■ Recommended curing conditions: UV metal halide lamp 3,000 mJ/cm²

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[Market Report] Global Petroleum Resin Market

[Market Report] Global Petroleum Resin Market

Global Petroleum Resin Market: Promoting Innovation and Expected to Reach 5.4 Billion USD by 2031

The global petroleum resin market is witnessing a dynamic surge, driving innovation and transforming industries. According to recent market reports, the global petroleum resin market reported revenues of approximately $2.77 billion in 2022 and is projected to reach an estimated $5.4 billion by 2031. This remarkable growth trajectory is driven by a robust annual compound growth rate. A growth rate of 7.7% (CAGR) is expected during the forecast period from 2023 to 2031. Petroleum resins derived from cracked petroleum fractions are low molecular weight thermoplastic hydrocarbon resins known for their calming effects and slightly moist characteristics. These versatile resins are applied across a wide range of industries, including paints, coatings, printing inks, varnishes, lithographic inks, paper, adhesives, concrete hardeners, and rubber. Petroleum resins are available in various forms, including crushed nuggets, powders, solid blocks, flakes, solutions, beads, and dispersions. You can check the application method by clicking the [PDF Download] button or apply directly through the related links.

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High thermal conductivity epoxy resin TE-7163 (2Wm/k)

High thermal conductivity epoxy resin TE-7163 (2Wm/k)

This is an epoxy resin recommended for heat dissipation and insulation sealing of motors, coils, capacitors, and more. It offers good workability due to its short curing time and low viscosity.

TE-7163 Two-component heating curing epoxy resin Features: High thermal conductivity, short curing time, low viscosity Applications: Heat dissipation insulation sealing for electronic devices such as industrial motors, coils, transformers, and capacitors ■Mixing viscosity: 25℃ 12,500 / 60℃ 2,000 (mPa·s) ■Thermal conductivity: 2.0 (W/mK) ■Recommended curing conditions: 120℃ x 1h + 150℃ x 1h *For more details, please download the PDF from the bottom or feel free to contact us.

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General-purpose potting resin TE-7017, high thixotropy, low elasticity modulus product.

General-purpose potting resin TE-7017, high thixotropy, low elasticity modulus product.

The general-purpose potting resin is endowed with high thixotropy and low elasticity. Due to the anhydride curing, it is characterized by a long usable time after mixing the two components (approximately 6 to 8 hours).

TE-7017 Two-component heating curing epoxy resin Features: Acid anhydride curing, high thixotropy (T.I 4.5), low elastic modulus, crack resistance Applications: Potting for various electronic components ■ Flexural modulus: 3,800 (MPa) ■ Volume resistivity: >1 x 10¹⁶ (MΩ·m) ■ Recommended curing conditions: 120℃ x 3h + 160℃ x 1h For more details, please download the PDF below or feel free to contact us.

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General-purpose potting resin TE-3106 low viscosity/high strength product

General-purpose potting resin TE-3106 low viscosity/high strength product

It is a low viscosity, high strength general-purpose potting resin. Due to the anhydride curing, it is characterized by a long usable time after mixing the two components (approximately 6 to 8 hours).

TE-3106 Two-component heating curing epoxy resin Features: Acid anhydride curing, low viscosity, high strength, crack resistance Applications: Potting for various electronic components ■ Mixing viscosity: 1,800 at 25℃ ■ Flexural strength: 150 (MPa) ■ Recommended curing conditions: 80℃ for 2 hours + 100℃ for 4 hours *For more details, please download the PDF below or feel free to contact us.

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High thermal conductivity epoxy resin TE-7127 (4 W/m·K)

High thermal conductivity epoxy resin TE-7127 (4 W/m·K)

Metal-based fillers are dispersed and blended into epoxy resin to achieve high thermal conductivity. This formulation aims to balance high thermal conductivity with usability.

TE-7127 Two-component heating curing epoxy resin Features: High thermal conductivity, short curing time, environmentally friendly (non-lead, non-halogen), low thermal expansion The linear expansion coefficient is low at 14, making it less prone to cracking. Applications: Used in general electronic components where both insulation and high thermal conductivity are required, such as casting agents, sealing materials, and surface protectants. ■ Mixing viscosity: 60℃ 15,000 (mPa·s) ■ Thermal conductivity: 4.0 (W/mK) ■ Flame retardancy: Equivalent to V-0 ■ Recommended curing conditions: 120℃ x 1h + 150℃ x 1h *For more details, please download the PDF from below or feel free to contact us.

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[Market Report] Global Molding Materials Market

[Market Report] Global Molding Materials Market

The global molding materials market is expected to reach 17.16 billion USD by 2031.

The global molding materials market is expected to experience significant growth, with revenues reaching $10.6 billion in 2022. According to recent market research, the market is projected to expand at a compound annual growth rate (CAGR) of 5.5% during the forecast period from 2022. By 2031, it is estimated to ultimately reach $17.16 billion. Molding materials, known for their excellent properties, are versatile composites that are seeing increased demand across various industries, including automotive, electrical, industrial, electronics, and aerospace. Molding materials are composites formulated from a blend of silica, epoxy resins, phenolic resins, polyesters, pigments, and other additives. These compounds exhibit a range of properties such as high strength, heat resistance, corrosion resistance, and dimensional stability. As a result, molding materials are widely used in the manufacturing of parts and products that require durability, reliability, and precision. For application methods, please check the [PDF download] button or apply directly through the related links.

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