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substrate - メーカー・企業554社の製品一覧とランキング

更新日： 集計期間:Nov 26, 2025～Dec 23, 2025
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substrateのメーカー・企業ランキング

更新日： 集計期間:Nov 26, 2025～Dec 23, 2025
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  1. 太洋テクノレックス 本社　和歌山 Wakayama//Electronic Components and Semiconductors
  2. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  3. JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室 Tokyo//Trading company/Wholesale
  4. 4 アイン 本社工場 Nagano//Electronic Components and Semiconductors
  5. 5 スクリーンプロセス Kanagawa//others
企業ランキングへ

substrateの製品ランキング

更新日： 集計期間:Nov 26, 2025～Dec 23, 2025
※当サイトの各ページの閲覧回数を元に算出したランキングです。

  1. <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス
  2. CAN/CANFD communication is possible with the sequencer! CANNEX サンプロシステム
  3. Noda Screen Co., Ltd. Company Profile NODASCREEN CO.,LTD.
  4. Long-sized printed circuit board ☆ up to 1500mm ☆ Ally Japan 横浜本社
  5. 4 High Thermal Conductivity Substrate "FGHP" モナテック

substrateの製品一覧

1816～1830 件を表示 ／ 全 1869 件

表示件数
LED signal light circuit board unit 'MR1505-24CY' 150φ yellow

LED signal light circuit board unit 'MR1505-24CY' 150φ yellow

Wide-angle ultra-high brightness signal light board unit equipped with 5φ bullet-type LED.

We would like to introduce our LED signal light circuit board unit, 'MR1505-24CY'. It has been a best-selling product for over 10 years as a specialized manufacturer of LED signal light circuit board units. Please feel free to contact us when you need assistance. 【Specifications (partial)】 ■ Supply Voltage: DC24V ■ Dimensions: 180mm square ■ Inner Diameter: 150φ ■ Number of LEDs: 100 ■ Emission Color: Yellow *For more details, please refer to the PDF document or feel free to contact us.

  • Signal lights and rotating lights

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LED signal lamp circuit board unit 'MR1105-24CBG' 110φ blue-green

LED signal lamp circuit board unit 'MR1105-24CBG' 110φ blue-green

Wide-angle ultra-high brightness signal light circuit board unit equipped with 5φ bullet-type LED.

We would like to introduce our LED signal light circuit board unit 'MR1105-24CBG' that we handle. It has been a best-selling product for over 10 years as a specialized manufacturer of LED signal light circuit board units. Please feel free to contact us if you have any inquiries. 【Specifications (partial)】 ■Supply Voltage: DC24V ■Dimensions: 135mm square ■Inner Diameter: 110φ ■Number of LEDs: 80 ■Emission Color: Blue-green *For more details, please refer to the PDF document or feel free to contact us.

  • Signal lights and rotating lights

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Semiconductor heat dissipation substrate for the purpose of heat release and absorption [heat sink]

Semiconductor heat dissipation substrate for the purpose of heat release and absorption [heat sink]

The coil material for the heat sink can be continuously processed up to a thickness of 5mm by adopting a progressive die! This contributes to lower costs and shorter delivery times. Please feel free to consult with us.

Our company handles heat sinks (base plates). Thanks to precision progressive dies, the dimensional accuracy of the outer shape and hole pitch has greatly improved, resulting in significantly enhanced finish quality on both the edge and shear surfaces. The coil material can be continuously processed up to a thickness of 5mm due to the adoption of progressive dies, contributing to lower costs and shorter delivery times. We utilize UV printing. In addition to micron-level flatness and specified warp processing, we also support resist baked printing. 【Features】 ■ High dimensional accuracy of the outer shape and hole pitch due to precision progressive dies ■ Continuous processing of coil material up to a thickness of 5mm through the use of progressive dies ■ Adoption of UV printing ■ Capability for micron-level flatness and specified warp processing ■ Support for resist baked printing *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract

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[Power Supply Design Proposal Example] Consistent Support up to Electrical Operation Testing

[Power Supply Design Proposal Example] Consistent Support up to Electrical Operation Testing

From substrate to the development of various testing devices, we provide comprehensive support! We can reduce the burden on our customers!

Traditionally, when the manufacturer we had been outsourcing the production of power boards to went out of business, we received a request for board production from them. Until now, we had only outsourced visual inspections, and no electrical operation tests were conducted. Although the request was for board production, we proposed the development and manufacturing of an automatic testing device, as well as conducting electrical operation tests in-house. By providing a comprehensive solution, we were able to reduce the burden on our customers. [Case Overview] ■ Issue: The manufacturer we had been outsourcing to went out of business. ■ Proposal: Development and manufacturing of an automatic testing device, and conducting electrical operation tests in-house. ■ Result: Reduced the burden on customers through a comprehensive solution. *For more details, please refer to the related link page or feel free to contact us.

  • Circuit board design and manufacturing

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[Problems with Aluminum-Backed Boards] I want to adopt them, but the commercially available ones do not match the specifications.

[Problems with Aluminum-Backed Boards] I want to adopt them, but the commercially available ones do not match the specifications.

Achieving grounding of the aluminum section! This improves the usability and design flexibility of the aluminum section.

When it comes to aluminum base substrates, the mainstream products are those that have an insulating layer pre-attached to aluminum, released by substrate material manufacturers. However, this limits the choice of aluminum thickness and the dielectric constant of the substrate to only what is available in the existing lineup, imposing restrictions on design. Therefore, our company has made it possible to create aluminum base substrates using our unique method of bonding the substrate material to aluminum, allowing for customization according to your specifications. This significantly enhances design flexibility, enabling requests such as increasing aluminum thickness or using high-dielectric materials like Teflon or PPE for miniaturization. Additionally, it is possible to process the substrate after bonding, allowing for the creation of cavities for mounting components by machining only the substrate portion. 【Features (Aluminum Base Through-Hole Substrate)】 ■ Method of bonding substrate material and aluminum - High-frequency bonding film - Eutectic solder (lead-free options available upon consultation) ■ Achieves grounding of the aluminum section ■ Dramatically improves the usability of the aluminum section ■ Automatic mounting with reflow is also possible (in collaboration with partner companies) *For more details, please refer to the PDF document or feel free to contact us.

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  • Printed Circuit Board
  • Circuit board design and manufacturing

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[Concerns about Device Assembly] The circuit board is too thick and is warping.

[Concerns about Device Assembly] The circuit board is too thick and is warping.

Achieve grounding of the aluminum section! This improves the usability and design flexibility of the aluminum part. By pre-installing and securing with screws, labor reduction becomes possible!

When it comes to aluminum base substrates, the mainstream products are those that have an insulating layer pre-attached to aluminum, released by substrate material manufacturers. However, this limits the choice of aluminum thickness and the dielectric constant of the substrate to only what is available in the existing lineup, imposing restrictions on design. Therefore, our company has made it possible to create aluminum base substrates using a unique method that bonds the substrate material to aluminum, allowing for customization according to your specifications. This significantly enhances design flexibility, enabling requests such as increasing the thickness of aluminum or using high-dielectric materials like Teflon or PPE for miniaturization. Additionally, it is possible to process the substrate after bonding, allowing for the creation of cavities for mounting components by machining only the substrate portion. 【Features (Aluminum Base Through-Hole Substrate)】 ■ Method of bonding substrate material and aluminum - High-frequency bonding film - Eutectic solder (lead-free options available upon consultation) ■ Achieves grounding of the aluminum part ■ Dramatically improves the usability of the aluminum part ■ Automatic mounting via reflow is also possible (in cooperation with partner companies) *For more details, please refer to the PDF document or feel free to contact us.

  • img02.jpg
  • img04.jpg
  • img05.jpg
  • Printed Circuit Board
  • Circuit board design and manufacturing

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Introduction of overseas expansion case in West Virginia, USA: Factory expansion and development in Mexico.

Introduction of overseas expansion case in West Virginia, USA: Factory expansion and development in Mexico.

Responding to large new orders! Strengthening the production system for transformer-reactor components and control boards.

We would like to introduce a case where Diamond Electric Holdings (Japan) expanded its business in the automotive and air conditioning markets by establishing a presence in the United States and Mexico. In 2021, the company expanded its subsidiary, Diamond Electric Manufacturing (WV) in the United States, and in 2023, it established a subsidiary in Mexico as a subsidiary of Diamond Electric Manufacturing in the U.S., strengthening the production system from transformer reactor components to control boards. The reason for the expansion is to respond to large new orders from several domestic automobile manufacturers in the U.S. [Case Overview (Partial)] ■ Location: Eleanor, WV ■ Area: 37,000 sqft. ■ Expansion Investment Amount: $3.74 million ■ New Equipment Investment Amount: $18.61 million *For more details, please refer to the PDF document or feel free to contact us.

  • Other Auto Parts

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[Case Study] Request for substrate repair from a major chemical manufacturing plant.

[Case Study] Request for substrate repair from a major chemical manufacturing plant.

Leave all your substrate troubles to us! [On-site support available]

Here is a case study of our response to a circuit board repair request from a major chemical manufacturing plant! 【Situation at the time of request】 The production line was halted due to a malfunctioning circuit board. 【Inquiry details】 The customer had identified the location of the issue and requested a circuit board repair. 【Response】 Since the faulty circuit board was already known, it was sent to us for analysis. We conducted a failure diagnosis, repaired the circuit board, and then mailed it back to the customer for them to confirm its operation. *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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[Case Study] Request for duplication of a circuit board that cannot receive manufacturer support.

[Case Study] Request for duplication of a circuit board that cannot receive manufacturer support.

We also support circuit board repairs for discontinued products (EOS/EOSL products)!

We would like to introduce a case where we handled a request for the duplication of a circuit board that could not receive manufacturer support due to bankruptcy! 【Inquiry Details】 We received a request for a spare circuit board for a production line circuit board from a manufacturer that has already gone bankrupt and can no longer provide support. 【Response】 The circuit board was sent to us, and we used PinPoint in-house to analyze and restore the circuit board. We completed this in approximately one month! If you have any concerns, please feel free to contact us first.

  • Printed Circuit Board

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Impedance control board

Impedance control board

Impedance control board

We will design to match the necessary impedance values and ensure compatibility during the circuit board manufacturing process.

  • others

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IVH substrate

IVH substrate

IVH substrate

In prototype boards, the IVH method may be cheaper and have shorter lead times than build boards. We can provide a proposal in the quotation materials.

  • others

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Thick copper foil substrate

Thick copper foil substrate

Thick copper foil substrate

We have a track record of accommodating copper foil thicknesses from 70μ to 210μ.

  • others

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Electrode growth substrate

Electrode growth substrate

Electrode growth substrate

It is a substrate that allows the terminal area on the substrate to grow thicker and taller than other terminals.

  • others

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Copper inlay substrate

Copper inlay substrate

Copper inlay substrate

By pressing copper directly under the heat-generating component, a significant heat dissipation effect can be achieved.

  • others

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Aluminum substrate

Aluminum substrate

Aluminum substrate

You can achieve a significant heat dissipation effect. We can provide a quote including manufacturing.

  • others

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これ以上ブックマークできません

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