PAD ON VIA
Proposal for Optimization of Component Mounting Space
- High-Density Implementation It is suitable for devices and products that require high-density implementation because it can achieve many connections in a limited space. - High-Speed Signal Transmission It is intended for applications that require high-speed signal transmission to shorten the transmission distance and suppress impedance variations. - High Reliability Since the signal layer and connection layer are directly connected, the number of conduction paths is reduced, improving reliability. - Low Power Consumption It also contributes to reducing power consumption, resulting in less power loss due to the efficiency of signal transmission.
- Company:シライ電子工業
- Price:Other