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substrate×松和産業 - List of Manufacturers, Suppliers, Companies and Products

substrate Product List

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Build-up substrate

Build-up substrate

All processes are handled in our own factory! Just like other circuit boards, we promise ultra-short delivery times and high quality.

We would like to introduce our "Build-Up Circuit Boards." At Matsuwa Industries, we have also introduced equipment such as CO2 gas laser drilling machines, via-fill copper plating lines, and vacuum hole filling machines. We handle all processes in-house at our factory, even for high-density wiring boards like build-up boards and through resin-filled boards. Of course, just like with other boards, we guarantee ultra-short delivery times and high quality. 【Features】 ■ All processes are manufactured in-house ■ Delivery through 24-hour operations ■ Continuous introduction of new equipment ■ Realization of high-spec boards ■ No fluctuations in gold flash delivery times *For more details, please refer to the PDF materials or feel free to contact us.

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High reliability substrate

High reliability substrate

Manufacturing management of the core components of printed circuit boards (through-holes, pattern formation, resist exposure)

We would like to introduce our "High Reliability Boards." Pattern formation and resist exposure utilize the new DI (Direct Imager) method, achieving L/S = 40/40μm and resist position accuracy of 15μm. We have also quickly adopted inkjet for silk printing, successfully achieving a character height of 500μm, a character width of 90μm, and a position accuracy of 20μm. Our company is a manufacturer that thoroughly manages a wide variety of new equipment and chemicals, delivering high reliability boards faster than anyone else. We ensure high reliability and long lifespan, comply with delivery deadlines, and provide rapid analysis in case of troubles. 【Features】 ■ Pattern formation and resist exposure use the new DI method ■ Early adoption of inkjet for silk printing ■ Thorough management of a wide variety of new equipment and chemicals ■ High reliability and long lifespan, compliance with delivery deadlines, and rapid analysis in case of troubles *For more details, please refer to the PDF document or feel free to contact us.

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Through-hole resin embedded substrate

Through-hole resin embedded substrate

The number of layers ranges from 2 to 20, and there is a proven track record of resin filling up to a thickness of 3.2mm!

We would like to introduce the "Through Resin Filled Circuit Board" handled by Matsuwa Sangyo Co., Ltd. This printed circuit board is mainly used for boards that mount narrow pitch BGA components (such as 0.5 to 0.3 mm pitch) and for the purpose of filling through holes (TH). After filling the holes (primary TH) that need to be resin-filled with a permanent hole-filling ink (epoxy resin), through holes (secondary TH) are formed, and it is also possible to create a cover plating on the primary TH section that has been resin-filled. 【Example of Manufacturing Specifications for Through Resin Filled Circuit Board】 ■ 12-layer through resin filled circuit board with 0.4 mm pitch BGA - Board thickness: t1.6 mm - BGA pad diameter: φ0.32 mm - Resist opening: φ0.25 mm - Resin filled TH drill: φ0.2 mm *For more details, please refer to the related links or feel free to contact us.

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IVH substrate

IVH substrate

We can manufacture various products such as BVH and COH by sequentially laminating the conductor layer onto the core material!

We would like to introduce the "IVH substrate" handled by Matsuwa Sangyo Co., Ltd. This is a multilayer printed circuit board that connects only the necessary interlayers (non-through vias) instead of using through vias. Unlike build-up substrates, it does not use laser vias and features the use of NC drills for all interlayer connections. By connecting multiple non-through holes in a multilayer board, it achieves greater freedom in wiring and increased wiring density. 【Example of IVH substrate manufacturing specifications】 ■ 0.4mm pitch BGA mounted 8-layer 6-stage continuous IVH substrate ・ IVH specifications: L1-2/1-3/1-4/1-5/1-6/1-7 IVH + L1-8 through ・ BGA pad diameter: φ0.3mm ・ Hole wall pattern spacing: 0.175mm ・ IVH drill diameter: L1-2/L1-3 = φ0.1mm, L1-4 to L1-7 = φ0.15mm * For more details, please refer to the related links or feel free to contact us.

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Any-layer substrate

Any-layer substrate

Adopted in many products such as communication devices! Printed circuit boards that enable thinner substrates.

We would like to introduce the "Any Layer PCB" handled by Matsuwa Sangyo Co., Ltd. It has a slightly different structure from build-up PCBs, utilizing laser vias even in the inner core section, enabling the thinning of the PCB through full-layer laser vias and filled via plating. The freedom of wiring has further increased, and it is adopted in many products such as IoT devices, wearable products, and communication equipment (5G). 【Any Layer PCB Manufacturing Specifications Example】 ■ 6-layer 2-2-2 build-up PCB with 0.3mm pitch BGA - Board thickness: t0.6mm - BGA pad diameter: φ0.24mm - Resist opening: φ0.17mm - Laser hole diameter: φ0.1mm *For more details, please refer to the related links or feel free to contact us.

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Faradoflex compatible board

Faradoflex compatible board

Improvement of inductance, improvement of impedance, and reduction of noise are possible!

We would like to introduce the "Faradflex-compatible substrate" handled by Matsuwa Sangyo Co., Ltd. Unlike capacitor materials that are built into components, this substrate-integrated capacitor material does not require the creation of cavities within the substrate and is characterized by the ability to form patterned capacitor circuits using standard printed circuit board manufacturing processes. By reducing surface-mounted components, it enhances reliability through fewer connections and enables miniaturization of printed circuit boards. 【Features】 ■ Substrate-integrated capacitor material characterized by the formation of patterned capacitor circuits ■ Enhances reliability through fewer connections by reducing surface-mounted components and enables miniaturization of printed circuit boards ■ Mainly used for high-layer, high-performance routers, server equipment, supercomputers, and MEMS microphones and RF filters aimed at miniaturization *For more details, please refer to the related links or feel free to contact us.

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Fluororesin substrate

Fluororesin substrate

We have introduced a processing device that improves the wettability of plating and resist, enabling in-house integrated manufacturing.

We would like to introduce the "fluororesin substrate" handled by Matsuwa Sangyo Co., Ltd. This is a printed circuit board with a fluororesin insulation layer. It has low dielectric constant and low dielectric loss tangent, resulting in minimal loss of high-frequency currents. Leveraging this characteristic, it is used for high-speed communication applications (such as GPS, satellite communication, millimeter-wave radar, and mobile phones). 【Features】 ■ Printed circuit board with a fluororesin insulation layer ■ Minimal loss of high-frequency currents ■ Treatment to improve the wettability of plating and resist (plasma desmear treatment) We have introduced equipment for this, enabling in-house integrated manufacturing of fluororesin substrates. *For more details, please refer to the related links or feel free to contact us.

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Single-sided/Dual-sided flexible circuit board

Single-sided/Dual-sided flexible circuit board

By applying a reinforcement plate, component mounting is also possible! It is often used as a substitute for FFC.

We would like to introduce the "Single-Sided/Dual-Sided Flexible Printed Circuit Boards" handled by Matsuwa Sangyo Co., Ltd. The single-sided (1 layer) type is a common specification for flexible printed circuit boards and is often used as a substitute for FFC. There are types with and without an adhesive layer between the base material and copper foil, and we can accommodate both at our company. The dual-sided (2 layers) type allows for more flexible wiring by incorporating through-holes (TH) into the flexible printed circuit board. Please feel free to consult us about multilayer flexible printed circuit boards with three layers or more. 【Shortest Delivery Record Examples】 ■ 1 layer ⇒ Shortest 2 days (AM data ⇒ shipped the next day) ■ 2 layers ⇒ Shortest 2 days (8 AM data ⇒ shipped the next day) *For more details, please refer to the related links or feel free to contact us.

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Aluminum base substrate

Aluminum base substrate

We have products with thermal conductivity of 3 W/m·K and 10 W/m·K in stock, and we can also respond flexibly to other materials!

We would like to introduce the "Aluminum Base Circuit Board" handled by Matsuwa Sangyo Co., Ltd. This printed circuit board has high thermal conductivity and excellent heat dissipation, making it suitable for components that require high heat dissipation, such as high-brightness LEDs and power devices. In recent years, the demand for high thermal conductivity materials has significantly increased due to the spread of LED lighting, and there has been a growing trend to adopt high-brightness LEDs for automotive headlights. 【Example Manufacturing Specifications for Aluminum Base Circuit Boards (Excerpt)】 ■ Maximum outer dimensions: 210×460mm ■ Copper foil thickness: 35μm ■ Insulation layer thickness: 80μm ■ Aluminum base thickness: 1.0mm, 1.5mm, 2.0mm ■ Thermal conductivity: 3W/m·K, 10W/m·K *For more details, please refer to the related links or feel free to contact us.

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Thick-plated board with through holes (TH)

Thick-plated board with through holes (TH)

Recently, there has been an increasing demand for a certain thickness even outside of automotive applications!

We would like to introduce the "Through-Hole (TH) Thick Plated Board" handled by Matsuwa Sangyo Co., Ltd. The typical copper plating thickness required for Through-Holes (TH) is generally around 15 to 20 μm. However, to enhance reliability, there has been an increasing demand for a certain thickness (TH plating ≧ 25 μm) even for applications outside of automotive use. Please feel free to contact us when you need assistance. 【Manufacturing Specifications Example for Through-Hole (TH) Thick Plated Board】 ■ TH plating thickness: Capable of supporting TH thickness ≧ 25 μm *For more details, please refer to the related links or feel free to contact us.

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End face through-hole substrate

End face through-hole substrate

The hole diameter is ≥Φ0.5mm, the land diameter is ≥0.8mm, and the hole pitch is ≥1.0mm!

We would like to introduce the "End Face Through Hole Circuit Board" handled by Matsuwa Sangyo Co., Ltd. This product accommodates hole diameters of ≧Φ0.5mm, land diameters of ≧0.8mm, and hole pitches of ≧1.0mm. The slit through hole circuit board can accommodate a slit width of 1.0mm and a maximum slit length of 30mm (with connections added every 30mm). 【End Face Through Hole Circuit Board Manufacturing Specifications Example】 ■TH Diameter: φ0.5mm ■Land Diameter: φ0.8mm ■Hole Pitch: 1.0mm *For more details, please refer to the related links or feel free to contact us.

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Flash conductor substrate

Flash conductor substrate

It is possible to embed resist or insulating resin between patterns (between conductors) to smooth the surface of the substrate!

We would like to introduce the "Flash Conductor Substrate" handled by Matsuwa Sangyo Co., Ltd. By embedding resist or insulating resin between the patterns (conductors), the surface of the substrate can be smoothed. Please feel free to contact us when you need assistance. 【Structure of Flash Conductor (Resist Specification)】 ■ Copper foil ■ Copper plating ■ Resist ■ Base material *For more details, please refer to the related links or feel free to contact us.

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Single-sided board / Double-sided board

Single-sided board / Double-sided board

Used in a wide range of fields as a general-purpose substrate! The interlayer connection of the double-sided board is formed by TH.

We would like to introduce the "single-sided and double-sided PCBs" handled by Matsuwa Sangyo Co., Ltd. These printed circuit boards have conductor patterns formed on one or both sides of an insulating board. They are widely used in various fields as general-purpose substrates, and the interlayer connections of double-sided boards are formed by TH (through-hole) technology. We offer materials such as FR-4, CEM-3, FR-1, halogen-free materials, high heat-resistant materials, aluminum materials, and low dielectric constant materials, with board thicknesses ranging from t0.1mm to t3.2mm. We also accommodate various copper foil thicknesses from 9μm to 175μm. 【Fastest Delivery Record】 ■ 1 layer ⇒ 1 day (data by 8 AM ⇒ same-day shipment) ■ 2 layers ⇒ 1.05 days (data by 8 PM ⇒ shipment the next day) *For more details, please refer to the related links or feel free to contact us.

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Multilayer substrate

Multilayer substrate

We have a manufacturing record of up to 22 layers, and we can accommodate various specifications for board thickness and copper foil thickness!

We would like to introduce the "multilayer circuit boards" handled by Matsuwa Sangyo Co., Ltd. These are formed by stacking multiple layers of insulation and conductor layers, resulting in printed circuit boards with three or more conductor patterns. The interlayer connections are formed by through-holes (TH) just like in double-sided boards, and we offer a variety of substrates including FR-4, halogen-free materials, high heat-resistant materials, and low dielectric materials. 【Shortest Delivery Record】 ■ 4 to 10 layers ⇒ Shipped on the 1.05th day (data by 8 PM ⇒ shipped the next day) ■ 12 to 14 layers ⇒ Shipped on the 1.1th working day (data by 4 PM ⇒ shipped the next day) ■ 16 to 18 layers ⇒ Shipped on the 2.1th working day (data by 4 PM ⇒ shipped the day after next) *For more details, please refer to the related links or feel free to contact us.

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Build-up substrate

Build-up substrate

Multi-stage builds, stackable vias, filled vias plating, all handled with in-house integrated manufacturing!

We would like to introduce the "Build-Up Substrate" handled by Matsuwa Sangyo Co., Ltd. After forming the core layer (2-layer through to multi-layer through), we sequentially laminate insulation layers and conductor layers one by one from the core layer to the surface layer, and perform interlayer connections using lasers to create a multilayer printed circuit board. By using laser vias (non-through vias) for interlayer connections, flexible wiring design is possible, and in recent years, the demand and applications for this have been increasingly expanding. 【Shortest Delivery Record】 ■ 4 layers (1-2-1) ⇒ Shipped on the 3rd day ■ 6 layers (2-2-2) ⇒ Shipped on the 4th day *For more details, please refer to the related links or feel free to contact us.

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