substrate×共立エレックス - List of Manufacturers, Suppliers, Companies and Products

Alumina ceramic substrate for chip resistors

High-reliability substrates born from a unique production system.

This is an alumina ceramic substrate made using high-purity alumina raw materials that excel in electrical and thermal properties, and is produced through advanced processing technology to achieve excellent dimensional accuracy and divisibility. We use high-purity alumina raw materials tailored to specific applications, maintaining stable quality and outstanding characteristics while adhering to a strict quality control system during production. 【Features】 ■ Manufacturing with high precision in thickness and dimensions is possible ■ High-precision through-hole forming and divided groove forming are achievable ■ Can be produced at a relatively low cost compared to other ceramic materials ■ Proposal of "high-reflective ceramics" considering cost-effectiveness ■ Suitable for porous applications with a high porosity rate *For more details, please refer to the catalog or feel free to contact us.

Company：共立エレックス
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Printed Circuit Board

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Start of sample provision for high-purity alumina substrates (99.6%).

We have added "high-purity alumina (99.6%) substrates" to our lineup and prepared standard samples (100x100x0.2).

■Alumina Ceramic Substrates Born from Our Unique Production System■ In recent years, the electronics industry, which is accelerating the pace of evolution, has developed tiny chip components that can now fit on the tip of a finger, advancing the information society. Among these, chip resistors are essential basic electronic components for constructing electronic circuits. Our alumina ceramics use high-purity alumina raw materials that excel in electrical and thermal properties, achieving excellent dimensional accuracy and divisibility through advanced processing technology. For other alumina ceramic products as well, we use high-purity alumina raw materials tailored to their applications, maintaining stable quality and excellent characteristics while producing under a strict quality control system.

Company：共立エレックス
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Fine Ceramics

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Zirconia ceramic substrate

A specialized manufacturer of high-performance ceramic substrates produces thin zirconia ceramic substrates with toughness and ionic conductivity.

Flexible Ceramic Substrates Utilizing Toughness" Flexible Zirconia Ultra-thin Zirconia Ceramic Substrates Zirconia possesses strong toughness. By combining this with our thin ceramic substrate manufacturing technology, we have realized "flexible ceramic substrates." The ultra-thin ceramic substrate (thickness: 50μm) is also transparent and has the potential to achieve substrate thinning, positioning it as a "next-generation ceramic substrate.

Company：共立エレックス
Price：Other

Fine Ceramics

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Fine printed circuit board

Printed circuit boards for small electronic devices: Fine circuit printing is a circuit printing technology primarily for ultra-small electronic components.

In recent years, as the miniaturization, lightweight design, and high performance of electronic devices have progressed, the demands for high implementation and high density in circuit board packages have been increasing year by year. To meet these demands, our company is leveraging its thick film printed circuit board (through-hole) technology to develop even more delicate pattern printing techniques.

Company：共立エレックス
Price：Other

Printed Circuit Board
Fine Ceramics

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For high-performance ceramic substrates, please consult our specialized manufacturer.

We offer ceramic substrates and printed circuit boards. Please also take advantage of our contract processing services utilizing our manufacturing technology (green sheet coating and firing).

Product Lineup ■ Ceramic Substrates - Alumina Ceramic Substrates - Zirconia Ceramic Substrates ■ Printed Circuit Ceramic Substrates - Thick Film Printed Circuit Ceramic Substrates - Fine Printed Circuit Ceramic Substrates ■ Ceramic Substrate Application Products - Ceramic Materials for LED Packages - Ceramic Materials for All-Solid-State Batteries - Ceramic Materials for Ceramic Tile Crafts ■ Functional Ceramic Materials - High Reflective Ceramic Materials - Porous Alumina Ceramic Substrates (Setters) - Powder Forming Ceramics

Company：共立エレックス
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Fine Ceramics
Printed Circuit Board

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Kyoritsu Elex, a specialized manufacturer of high-performance ceramics.

For high-performance ceramic substrates, please consult our specialized manufacturer.

1. Molding Technology for Ultra-Thin Ceramic Sheets Our company employs a doctor blade method for the coating process of green sheets. We mix carefully selected ceramic raw materials and resin materials, and by molding sheets using the doctor blade method, we produce green sheets with stable thickness and strength. With high-precision gap management of the blade, we are able to achieve green sheets as thin as 20 micrometers. (We are also developing coating technology for layers as thin as 5 micrometers.)

Company：共立エレックス
Price：Other

Printed Circuit Board

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Ceramic thin plate chip break (segmentation) chocolate break

For high-performance ceramic substrates, please consult our specialized manufacturer.

"Providing split slits for individualization through mold forming" "1. Removal of the frame part", "2. Barb break (strip shape)", "3. Chip break (individualization)" makes individualization easy.

Company：共立エレックス
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Printed Circuit Board
Fine Ceramics

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Attention fuel cell manufacturers! A specialized manufacturer of high-performance ceramic substrates.

We will manufacture zirconia ceramic substrates with toughness and ionic conductivity in a thin form.

Utilizing the toughness of "bendable ceramic substrates," we offer them as "next-generation ceramic substrates," enhancing their value as components. Bendable zirconia Ultra-thin zirconia ceramic substrate Zirconia possesses strong toughness (characteristics). By combining it with the manufacturing technology of ultra-thin ceramic substrates from a specialized high-performance ceramic substrate manufacturer, we can achieve bendability while maintaining its ceramic nature. The ultra-thin ceramic substrate (thickness: 50μm) also has transparency, offering possibilities such as achieving thinner substrate layers.

Company：共立エレックス
Price：Other

Fine Ceramics

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Ceramic substrate for firing setters (development product)

We assist in the firing of ferrite substrates and metal injection molding (MIM) products using optimized "ceramic substrates for setters" in the firing process.

Improving production efficiency in the "batch-type vacuum sintering furnace" used in the sintering process is a significant challenge. One proposal is to enhance production efficiency through "multi-layer stacking." By replacing the conventional ceramic support plate (7mm thick) with "our ceramic substrate for sintering setters (1mm thick)," it becomes possible to increase the number of shelf layers from 16 to 18, resulting in a 12% improvement in sintering loading efficiency. Additionally, it allows for "thicker workpieces" to be sintered with the same number of workpieces, enabling broader utilization of the sintering furnace. The second proposal is "micro-convex porous ceramic processing." Among the process conditions that affect sintering quality, "debinding performance and characteristics" are crucial, and various porous ceramic materials are being utilized creatively. In addition to these porous ceramic substrate technologies, using ceramic support plates for setters that have undergone "micro-convex porous ceramic processing" allows for space to be secured at the bottom of the sintering workpieces, thereby improving debinding efficiency and performance.

Company：共立エレックス
Price：Other

Ceramics

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Improving thermal conductivity of alumina substrates with printed circuit technology [For mounting power devices!]

Leveraging the strengths of a "ceramics substrate specialized manufacturer," we have achieved "high thermal conductivity of alumina substrates" through via formation technology and printed circuit technology!

In the implementation of power devices, where applications are expanding in areas such as home appliances and EV vehicles, expectations for "thermal conductivity performance of the substrate" are rising significantly. Through the mass production achievements of our flagship high-power LED packages, we have developed technologies to improve heat dissipation performance associated with higher power output. In particular, we have received many inquiries regarding "improving thermal conductivity using general-purpose alumina ceramic substrates compared to aluminum nitride substrates, which excel in thermal conductivity" for ceramic circuit boards. We have achieved improvements in thermal conductivity by applying through-hole processing technology (via formation) and printed circuit technology, filling the via sections of alumina ceramic substrates with "metallic materials," while using general-purpose alumina ceramic substrates. For high-power LED package substrates, we have achieved a thermal conductivity of "369 W/mk" with alumina ceramic substrates. If you are facing challenges with "thermal measures" for ceramic substrate implementation of high-power power devices, please consult with us.

Company：共立エレックス
Price：Other

Fine Ceramics
Circuit board design and manufacturing
Other electronic parts

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Ceramic substrate for LED packages

In recent years, with the miniaturization, lightweight design, and high performance of electronic devices, the importance of heat dissipation measures due to high-density mounting of electronic components has been increasing.

In particular, with high-brightness LEDs, it has become difficult to implement heat resistance measures with resin package specifications, making alumina ceramics materials indispensable for heat dissipation and heat resistance. Additionally, due to the recent increase in demand for ultraviolet LEDs, interest in ceramic packages has been rising. Our company offers ceramic package substrates with excellent heat resistance characteristics based on our unique technology. Our unique technology for "improving heat dissipation performance" has become increasingly important alongside the high brightness (high output) of LED elements, leading to a significant rise in the demand for heat resistance in packaging materials and heat dissipation characteristics. We have received many inquiries regarding "improving heat dissipation using a general-purpose alumina ceramics substrate compared to a heat-dissipating aluminum nitride substrate." By applying our unique printed circuit technology, we process through-holes in the alumina ceramics substrate and fill the through-hole sections with "special silver-based materials," achieving a higher heat dissipation effect than typical alumina ceramics substrates.

Company：共立エレックス
Price：Other

Printed Circuit Board
Fine Ceramics

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High reflectivity ceramic substrate

We can provide high-reflectivity ceramic substrates made from alumina ceramics as the base material.

Ceramic substrate with high reflectivity characteristics We can provide high reflectivity ceramic substrates made from alumina ceramics as the base material. Since no special additives or coatings are used in the manufacturing process, there is no concern about contamination in subsequent processes. It is possible to accommodate mass production equivalent to existing products, as equipment for conventional alumina substrates can be shared. Additionally, because it is composed of existing raw material groups, it does not contain any substances regulated by environmental regulations.

Company：共立エレックス
Price：Other

Printed Circuit Board
Fine Ceramics

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Porous ceramic substrate

Promotion of binder removal and improvement of sintering efficiency through multi-layer stacking in the sintering process of ferrite and metal powder injection molding (MIM) products.

Porous ceramics are ceramics that have countless pores (porosity) inside. The presence of porosity reduces thermal conductivity and makes the material lightweight. Due to their extremely high permeability, they are used as setters in the firing process, resulting in excellent firing quality. Our porous ceramic substrates have a proven track record in processes such as "binder removal promotion" and "improvement of firing efficiency through multi-layer stacking" in the firing of ceramic products like ferrite substrates and metal injection molding (MIM) products.

Company：共立エレックス
Price：Other

Printed Circuit Board
Fine Ceramics

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Proposal to increase the number of shelf levels for firing setter ceramic substrates and firing jigs.

Setter ceramic substrates optimized for the firing process, diverse ceramic technologies, and technology development that meets customer applications.

■Background We have developed a ceramic substrate optimized for "firing setters" by leveraging the characteristics of porous ceramics and utilizing our in-house integrated processes, such as printing on fired ceramic substrates, to meet the increasingly diverse needs of customers utilizing firing processes. Recommended for those who want to "fire more at once!" ■Usage Improving production efficiency in "batch vacuum furnaces" used in firing processes is a significant challenge. We often hear requests to "fit as many works as possible into a single firing process." By utilizing the "manufacturing technology for thin ceramic substrates" that we have cultivated, it is possible to increase the number of setter layers. This allows for an increase in the number of works that can be fired in a single process. In cases where there are space constraints in a firing furnace as illustrated, replacing conventional ceramic plates (7mm thick) with "our ceramic substrates for firing setters (1mm thick)" enables an increase in the number of shelf layers from 16 to 18, resulting in a 12% improvement in firing loading efficiency. Additionally, even with the same number of works, "thicker works" can be fired, allowing for a wider range of applications for the firing furnace.

Company：共立エレックス
Price：Other

Ceramics

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Formation of fine electronic circuits on ceramic thin plates 500mm x 500mm (MAX)

From business card size to A4 size, forming thick film circuits in desired sizes and materials. From forming electronic circuits with ceramic materials to applications for firing setters.

Notice from Kyoritsu Elex - - - - - - - - - - - - - - - - - - - - - - - - - JPCA Show 2025 (Printed Circuit Board Technology Exhibition) Location: (Tokyo Big Sight) June 4 (Wednesday) to June 6 (Friday), 2025, for 3 days - - - - - - - - - - - - - - - - - - - - - - - - - We look forward to seeing you. Our company offers circuit formation for electronic component applications using the technology of printed circuit formation on ceramics substrates manufactured in-house, all through a consistent in-house process. By utilizing screen printing methods, we can provide custom solutions with shorter lead times compared to etching methods. Additionally, since the printed materials undergo high-temperature baking (850°C), they achieve stable performance and high reliability. The printed materials are not limited to wiring materials (metal paste) but also include insulating glass materials and ceramics, which can also be printed. Furthermore, we have achieved not only circuit formation but also "through-hole via formation" and "multilayer circuit structures." We are advancing technology development to meet various application possibilities, so we look forward to your inquiries.