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Technical Data: Circuit Board

Technical Data: Circuit Board

A patterning manufacturer that provides solutions tailored to customers by utilizing abundant resources.

This document introduces the circuit boards of Toyo Seimitsu Kogyo. We propose suitable processing by combining a wide range of resources such as sputtering, plating, etching, screen printing, sandblasting, and laser processing. By utilizing our extensive in-house processes, we achieve short delivery times and can accommodate various reliability tests. We provide a stable supply of high-quality, highly reliable products. 【Contents (partial)】 ■ Thin film circuit process image ■ Standard design rules ■ Inspection support ■ Reliability testing support ■ Thick film circuit process image *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing

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[Examples of Circuit Board Manufacturing] Metal Base Circuit Board

[Examples of Circuit Board Manufacturing] Metal Base Circuit Board

Meeting the needs for heat resistance! Can be applied as a heat dissipation substrate for power semiconductors and as a base substrate for LED mounting.

This is a manufacturing example of metal-based circuit boards that meet the increasing demands for heat dissipation and heat resistance in applications such as high-power LEDs, automotive, and power supply uses. Metal-based circuit boards can be applied as heat dissipation substrates for power semiconductors and as base substrates for LED mounting. Please feel free to consult us when needed. 【Case Overview】 ■ Base materials: Aluminum, copper, etc. ■ High heat dissipation insulating layer: Thermal conductivity 4.4 W/mk, insulation withstand voltage: 4 kV or more ■ Conductor layer: Ag, Ag/Ni/Au, etc. ■ High reflectivity insulating layer (for LEDs): Reflectivity over 90% *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts
  • Circuit board design and manufacturing

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[Circuit Board Manufacturing Example] Thin Film Circuit Board

[Circuit Board Manufacturing Example] Thin Film Circuit Board

We can accommodate a wide range of processing variations! We can also handle processing on supplied materials or only specific processes.

This is a manufacturing example of thin film circuit substrates that combines vacuum film formation through sputtering and deposition with photolithography. We can accommodate a wide range of processing variations, including hole drilling and contour cutting using lasers and dicing, as well as thin film resistor formation, providing high-quality thin film circuit substrates with a high degree of design flexibility. We can also process supplied materials or handle only specific processes. 【Case Overview】 ■Materials: Alumina, Aluminum Nitride, Quartz Glass, etc. ■Thickness: 0.1 to 1.0 mm ■Conductor Films: Ti/Pd/Au, Ti/Pd/Cu/Ni/Au, Ti/Pt/Au, etc. *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts
  • Circuit board design and manufacturing

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Electronic circuit board

Electronic circuit board

Thin film and thick film circuit substrates. Formation of conductors, dielectrics, resistors, and phosphor circuits.

For non-printed circuit boards, please leave it to Toyo Seimitsu Kogyo. We will propose the optimal board according to your specified requirements.

  • Printed Circuit Board
  • Organic Natural Materials
  • Ceramics

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Substrate, submount substrate

Substrate, submount substrate

Substrate, submount substrate

1) If you are having trouble with heat generation and dissipation on the substrate due to the integration of heating chips, please consult Toyo Seimitsu Kogyo. 2) We will support you from development design to mass production.

  • Other semiconductors
  • Printed Circuit Board
  • Ceramics

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[Circuit Board Manufacturing Example] Small Submount Board for High-Density Mounting

[Circuit Board Manufacturing Example] Small Submount Board for High-Density Mounting

This is an introduction to a case where side patterning technology for substrates has been established.

We will introduce examples of manufacturing substrates for implementing semiconductor devices such as optical modules for optical devices (DVD/CD recorders, optical communication), semiconductor laser diodes, and semiconductor photodiodes. With the trend towards miniaturization and thinness of devices, the demand for implementing multiple elements in a low area and high density is increasing. Therefore, we have established side patterning technology for substrates. It is possible to form circuits on one to four sides of high heat dissipation ceramic substrates such as alumina and aluminum nitride. 【Case Overview】 ■ Base Material: Alumina, Aluminum Nitride, etc. ■ Conductor Film Composition (Au-based wiring, Cu-based wiring *Pt barrier film compatible) ■ Resistance Film Composition (TaN, NiCr), Solder Flow Prevention Film (Cr, Solder Resist) ■ Implementation Support: Wire/Ribbon Bond, Bump, Various Soldering Specifications Available ■ Testing/Reliability: Compatible with MIL specifications and other customer-specified specifications *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts
  • Circuit board design and manufacturing

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【Circuit Board Manufacturing Example】Side Metallization Process

【Circuit Board Manufacturing Example】Side Metallization Process

Alumina and aluminum nitride, etc.! Circuit formation is possible on one to four surfaces of high thermal conductivity ceramic substrates.

This is an introduction to a manufacturing case that involves patterning processing on the sides of substrates to enable high-density implementation. It is possible to form circuits on one to four sides of high thermal conductivity ceramic substrates such as alumina and aluminum nitride. Please feel free to consult us when needed. 【Case Overview】 ■ Material: Alumina, Aluminum Nitride ■ Conductor Film: Ti/Pt/Au ■ Chip Size: 1.72mm × 1.1mm × 0.5mm *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts
  • Circuit board design and manufacturing

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