Substrate, submount substrate
1) If you are having trouble with heat generation and dissipation on the substrate due to the integration of heating chips, please consult Toyo Seimitsu Kogyo. 2) We will support you from development design to mass production.
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basic information
We provide high heat-resistant and high heat-dissipating sub-mount substrates made of alumina ceramic, aluminum nitride (ALN) ceramic, glass, and metal base for mounting semiconductor devices for LEDs, LDs, and power devices.
Price information
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Delivery Time
Applications/Examples of results
1) Substrate for LED 2) Substrate for LD (semiconductor laser) 3) Substrate for power semiconductor packaging 4) Substrate for heating devices
Company information
Photolithography, essential in the ever-evolving advanced fields, is a service we have provided by combining various photolithography technologies, earning your continued support. Moving forward, we will consistently focus our energy on technological innovation, creating a bright future with you through reliable technology and rich proposal capabilities.
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