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substrate Product List and Ranking from 22 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Oct 15, 2025～Nov 11, 2025
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Oct 15, 2025～Nov 11, 2025
This ranking is based on the number of page views on our site.

  1. アイン 本社工場 Nagano//Electronic Components and Semiconductors
  2. Wave Technology Hyogo//Service Industry
  3. null/null
  4. 4 鋼鈑工業 Tokyo//Industrial Machinery
  5. 4 大喜産業 Osaka//Machine elements and parts
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substrate Product ranking

Last Updated： Aggregation Period:Oct 15, 2025～Nov 11, 2025
This ranking is based on the number of page views on our site.

  1. Substrate "Copper Base Wiring Board with Posts" アイン 本社工場
  2. Metal base wiring board アイン 本社工場
  3. Substrate "MD" 鋼鈑工業
  4. 4 Ceramic Laminated Substrates You Might Not Know: HTCC Substrates and LTCC Substrates
  5. 5 Substrate "Flexible Printed Circuit (FPC)" / NOK 大喜産業

substrate Product List

1～15 item / All 34 items

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Substrate AOI "SX Series"

Substrate AOI "SX Series"

From high-resolution pattern inspection at L/S = 5/5 µm to laser via inspection, we provide the optimal solution for all your visual inspection needs.

We offer a comprehensive lineup of AOI systems covering a wide range of substrates—from high-end models supporting minimum line/space widths of 5/5 µm to mid-range models. Our systems deliver ultra-high-precision inspection for everything from circuit patterns to laser vias. In addition to standard circuit and laser via inspection, our solutions are also capable of measuring and outputting line/space widths as well as top/bottom diameters of vias. 【Rich Options】 - Verify inspection results directly on a PC using defect images saved by the inspection system—no dedicated verification machine required. - Significantly reduce verification workload with AI-based automatic defect classification. - Analyze defect trends by type and location using panel-level data mapping, enabling effective feedback to upstream processes. - Offline teaching system allows recipe creation without occupying the inspection equipment. - Optional server system available for storing inspection results.

  • Circuit Board Inspection Equipment

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Introduction to Circuit Board Manufacturing

Introduction to Circuit Board Manufacturing

Speedy response from prototype to mass production! Introduction to circuit board manufacturing.

We can handle everything from prototype production of flexible printed circuit boards to mass production. In addition to standard single-sided and double-sided boards, we also combine our know-how in rigid and flexible boards, so you can trust us with the manufacturing of multi-layer flexible boards (up to 8 layers) and rigid-flex boards (up to 8 layers). We primarily focus on the manufacturing of ceramic substrates, commonly referred to as ceramic boards, which have high heat resistance and excellent electrical characteristics, as well as the assembly and mounting of hybrid ICs. For patterning (metalizing) on ceramic substrates, we use a thick-film printing method, and in recent years, we have applied this technique to pattern various materials, including metals like aluminum and stainless steel, as well as resin-based materials like PET. *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing

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Substrate "Alumina substrate"

Substrate "Alumina substrate"

Alumina substrate with excellent thermal conductivity, insulation, heat resistance, strength, acid resistance, and cost-effectiveness!

The "alumina substrate" is a substrate made of alumina ceramics that excel in thermal conductivity, insulation, heat resistance, strength, acid resistance, and cost-effectiveness. The warping of the substrate is extremely small, and it can also be used for thin films. It is a product with excellent lubricity. Additionally, it has high dimensional accuracy and stable slits and through-holes, making it suitable for high breakability applications, including chip network substrates and ultra-small chip substrates. 【Features】 ■ Stable slits and through-holes ■ Extremely small warping of the substrate ■ High dimensional accuracy ■ Excellent lubricity ■ High breakability *For more details, please refer to the catalog or feel free to contact us.

  • Electronic Components

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Substrate "High Current Substrate (Thick Copper Circuit Substrate)"

Substrate "High Current Substrate (Thick Copper Circuit Substrate)"

A high-current board that can minimize current loss compared to the design value!

The substrate is a high-current board that allows for the selection of circuit formation methods based on conductor thickness. If the conductor thickness is 300μm or more, half-etching can be accommodated. This method can reduce the top and bottom widths of the pattern compared to conventional etching methods, minimizing current loss relative to design values. 【Features】 ■ Selection of circuit formation methods based on conductor thickness ■ Half-etching can be accommodated with a conductor thickness of 300μm or more ■ Ability to reduce the top and bottom widths of the pattern ■ Minimal current loss relative to design values *For more details, please refer to the catalog or feel free to contact us.

  • Printed Circuit Board

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Substrate "MD"

Substrate "MD"

This is a product that utilizes advanced nano-level polishing and plating technologies!

This product is a substrate used in computer storage devices (hard disk drives). Made from aluminum discs, it undergoes processes such as grinding, electroless nickel-phosphorus plating, mirror polishing, and various characteristic inspections. 【Features】 ■ Manufactured using advanced nano-level polishing and plating technologies ■ Dramatically increases storage capacity *For more details, please contact us or download the catalog.

  • Other Machine Parts
  • Other electronic components and modules

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[Contracted Services] Reverse Engineering Plus Case Examples

[Contracted Services] Reverse Engineering Plus Case Examples

Providing the value of "Plus"! We have various achievements, including automatic navigation systems and wireless chargers.

In our contracted service "Reverse Engineering Plus," we provide added value through operation principle clarification, function estimation/principle analysis, and evaluation, in addition to standard disassembly and analysis. For example, in foundation redesign (design contracting), we propose solutions by leveraging the diverse technical expertise cultivated by WTI. We have various case studies available. Please feel free to consult us. [Providing the value of "Plus"] ■ Operation principle clarification ■ Function estimation/principle analysis ■ Evaluation (environment setup/automation) ■ Suggestions for improvement ■ Actual design contracting (modifications/new designs) *For more details, please refer to the PDF materials or feel free to contact us.

  • Contract Analysis
  • Other contract services
  • Circuit board design and manufacturing

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[Data] Shirutoku Report No. 18 # Substrate Structure and Package

[Data] Shirutoku Report No. 18 # Substrate Structure and Package

A suitable structural examination is necessary due to the mounted components and wiring density! An explanation of the structure of the substrate.

★★Shirutoku Report: Useful Information You Should Know★★ This report introduces the "Structure of PCBs." It includes topics such as "Classification by PCB Structure," "Conductor Materials and Solder Resist," and "The Importance of Initial Considerations in PCB Structure." Our company is also capable of PCB design starting from initial considerations, including PCB structure. If you have any concerns, please feel free to reach out to us. 【Contents】 ■ Classification by PCB Structure ■ Conductor Materials and Solder Resist ■ The Importance of Initial Considerations in PCB Structure ■ About Flexible PCBs *For more details, please refer to the PDF document or feel free to contact us.*

  • Printed Circuit Board

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Substrate "Copper Base Wiring Board with Posts"

Substrate "Copper Base Wiring Board with Posts"

Direct heat conduction to the base material!

The "Copper Base Wiring Board with Posts" is a thermally excellent heat dissipation substrate that forms posts on a copper base and connects directly to the surface pattern. It can also be multilayered and is used for high-density mounting substrates for LEDs. 【Features】 ■ High thermal conductivity ■ Short delivery time available ■ Special specifications can be discussed *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board

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Substrate "Flexible Printed Circuit (FPC)" / NOK

Substrate "Flexible Printed Circuit (FPC)" / NOK

Replacement from the harness is also possible! An extremely thin and flexible circuit board that can be bent freely.

"Flexible Printed Circuit (FPC)" is a circuit board with excellent bending durability, formed on a thin and sturdy film. It can replace harnesses (wires), and it is also capable of shielding processing, waterproofing, and component mounting. Leveraging its features of being "thin," "light," "flexible," and "high-density mounting," it is an indispensable product for miniaturization and weight reduction of portable electronic devices, as well as for space-saving and wiring simplification in various industrial equipment, devices, and automobiles. 【Features】 ■ Extremely thin and can be bent freely ■ Can replace harnesses (wires) ■ Much thinner and lighter compared to rigid boards and harnesses ■ Capable of shielding processing, waterproofing, and component mounting *For more details, please refer to the PDF materials or feel free to contact us.

  • Printed Circuit Board

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[Specification] Arduino_DAC_SHIELD Board

[Specification] Arduino_DAC_SHIELD Board

Introducing the specifications of a shield board that performs 8-channel DAC output controlled by SPI for Arduino Uno!

This document is the specification sheet for the "Arduino_DAC_SHIELD board" handled by Tosa Electronics, which engages in the processing, assembly, and inspection of electronic components and electronic circuit boards. It includes product descriptions, usage instructions, and sample programs. The "Arduino_DAC_SHIELD board" is a shield board for Arduino Uno that provides 8-channel DAC output controlled via SPI. [Contents] ■ Product Description ■ Usage Instructions ■ Sample Programs ■ Circuit Diagram *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts

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Board "RasPi_HAT (Raspberry Pi HAT)"

Board "RasPi_HAT (Raspberry Pi HAT)"

You can freely solder and use the free through holes! Introducing the expansion HAT board.

The "RasPi_HAT" is an expansion HAT board that can connect three HAT boards to a Raspberry Pi. You can mount a Raspberry Pi 3 or Raspberry Pi ZERO (WH) on the lower left part of the board, and attach other HAT boards elsewhere. There are free through-holes on the lower right part of the board, allowing you to solder as you wish, similar to a universal board. 【Features】 ■ All GPIO pins are connected to the array ■ Pins for UART and I2C are provided for external connections (JST EH connector) ■ Power can be supplied to the Raspberry Pi mounted on the lower left via USB, from a DC jack on the board, or from the EH connector *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts

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GaN substrate (square)

GaN substrate (square)

Gallium nitride (GaN) is a very hard and mechanically stable wide-bandgap semiconductor.

Gallium nitride (GaN) is a very hard and mechanically stable wide-bandgap semiconductor. Due to its higher breakdown voltage, faster switching speed, higher thermal conductivity, and lower on-resistance, GaN-based power devices are significantly superior to silicon-based devices.

  • Other metal materials

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Circuit board "Arm Frogs BLUE"

Circuit board "Arm Frogs BLUE"

Space-saving, high reliability, high precision! A board that is also optimal for industrial applications and evaluation boards.

Gofeltec's "Arm Frogs BLUE" is a space-saving, highly reliable, and high-precision circuit board that combines a CPU and FPGA into a single chip. It supports ECC, making it ideal for industrial applications. It can also be used as a PCIe card and is perfect as an evaluation board. The SoC part is on a separate board, allowing for direct mass production of the SoC after evaluation. 【Features】 ■ CPU and FPGA in one chip ■ Supports ECC, making it ideal for industrial applications ■ Can be used as a PCIe card, perfect for evaluation boards ■ SoC part on a separate board ■ Space-saving, highly reliable, and high-precision circuit board *For more details, please refer to the PDF materials or feel free to contact us.

  • Evaluation Board
  • Printed Circuit Board
  • Memory

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Substrate "Flat Copper PWB"

Substrate "Flat Copper PWB"

Directly mount LEDs onto a copper-based surface!! If you seek heat dissipation, choose 'Flat Copper PWB'.

"Flat Copper PWB" achieves high heat dissipation effectiveness by directly mounting the LED heat dissipation section onto a copper base surface. 【Features】 ■ Direct mounting of the LED heat dissipation section onto the copper base surface ■ High heat dissipation effectiveness (thermal conductivity: 398W/m·k)

  • Printed Circuit Board
  • Other electronic parts
  • LED Module

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