Printed circuit board with enhanced heat dissipation and heat resistance.
There are two types of printed circuit boards that enhance heat dissipation and heat resistance: a metal base substrate with circuits formed on a metal plate, and a metal core substrate with a metal plate sandwiched inside the substrate. The metal materials can be selected from aluminum, copper, and others.
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basic information
【Features】 ○ When using a copper core substrate, it is also possible to achieve conductivity between the copper core and through holes. ○ It can be utilized as a three-layer substrate with ground and thermal conduction through holes. ○ Through holes can also be used as thermal transport pathways. ○ By providing slits in the copper core, it can be used for two power supplies and ground. ● For more details, please contact us or download the catalog.
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Company information
TSS Corporation has been pursuing heat management substrate technology for over twenty years, counting from its predecessor company. Furthermore, we have incorporated element technologies such as product development technology, thermal design, and evaluation technology to create a unique business model. We have achieved remarkable results, particularly in the growing fields of LED-related and power electronics-related sectors. TSS aims to be the top brand in heat management substrates through our unique technology, and we aspire to continue growing together with our customers while contributing to the growth of the electronics industry in our country.
