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  5. Printed Circuit Board
  6. Printed circuit board aluminum heat sink board

Printed circuit board aluminum heat sink board

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last updated:May 09, 2013

TSS
TSS
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Similar to metal base substrates, layer configurations such as 2-layer and 4-layer can also be produced.

The thickness, height, pitch, and shape of the fins can be ordered freely. Additionally, depending on the specifications of the parts, the type of insulation layer can be selected. 1.8W: 3W: 6.5W: 12W → Please select from four types. (FR-5 is also possible.) Both sides of the circuit section can be multilayered and support high current. (It is also possible to combine with high current boards using our patented method.) We also support mass production and component mounting.

    Printed Circuit Board
TSS株式会社/アルミヒートシンク基板.jpg

Printed circuit board aluminum heat sink board

TSS株式会社/アルミヒートシンク基板.jpg
TSS株式会社/アルミヒートシンク基板.jpg
  • Related Link - http://www.tssg.com/company/index.html

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basic information

【Features】 ○ Improved heat dissipation characteristics ○ No loss in heat transfer ○ Increased freedom in fin design ○ Increased freedom in housing design ○ Possible reduction in assembly costs ○ No need for component procurement ● For more details, please refer to the catalog or contact us.

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【Usage】 ○Home appliances ○Machinery products

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TSS

TSS

Electronic Components and Semiconductors

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TSS Corporation has been pursuing heat management substrate technology for over twenty years, counting from its predecessor company. Furthermore, we have incorporated element technologies such as product development technology, thermal design, and evaluation technology to create a unique business model. We have achieved remarkable results, particularly in the growing fields of LED-related and power electronics-related sectors. TSS aims to be the top brand in heat management substrates through our unique technology, and we aspire to continue growing together with our customers while contributing to the growth of the electronics industry in our country.

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