Direct heat conduction to the base material!
The "Copper Base Wiring Board with Posts" is a thermally excellent heat dissipation substrate that forms posts on a copper base and connects directly to the surface pattern. It can also be multilayered and is used for high-density mounting substrates for LEDs. 【Features】 ■ High thermal conductivity ■ Short delivery time available ■ Special specifications can be discussed *For more details, please download the PDF or feel free to contact us.
Inquire About This Product
basic information
<Specifications> (1) Single-layer product ■ Pattern copper foil, foil thickness: 35/70/(105) μm ■ Insulation layer: thickness: 0.08mm Thermal conductivity: 0.3–0.4 W/m·K ■ Base copper 1: thickness: 0.2, 0.3, 0.5mm oxygen-free copper Thermal conductivity: 391 W/m·K ■ Base copper 2: thickness: 1.0, 2.0, 3.0mm tough pitch copper Thermal conductivity: 381 W/m·K * The thickness of the base copper includes the height of the post. (2) Double-layer product ■ Pattern copper foil, foil thickness: 35/70/(105) μm ■ Glass epoxy: thickness: 0.2mm Thermal conductivity: 0.3–0.4 W/m·K ■ Insulation layer: thickness: 0.08mm Thermal conductivity: 0.3–0.4 W/m·K ■ Base copper: thickness: 1.0, 2.0, 3.0mm tough pitch copper Thermal conductivity: 381 W/m·K * The thickness of the base copper includes the height of the post. * For more details, please download the PDF or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please download the PDF or feel free to contact us.
catalog（1）
Download All Catalogs
Company information
Located in Chino City, Nagano Prefecture, we are a printed circuit board manufacturer that offers services from design to implementation on circuit boards, from prototype development products to mass production. We have extensive experience in thermal management boards and can propose the most suitable materials and structures for our customers' applications. Additionally, in recent years, we have also been accommodating thick copper boards for high current applications with various substrates.
