Providing the value of "Plus"! We have various achievements, including automatic navigation systems and wireless chargers.
In our contracted service "Reverse Engineering Plus," we provide added value through operation principle clarification, function estimation/principle analysis, and evaluation, in addition to standard disassembly and analysis. For example, in foundation redesign (design contracting), we propose solutions by leveraging the diverse technical expertise cultivated by WTI. We have various case studies available. Please feel free to consult us. [Providing the value of "Plus"] ■ Operation principle clarification ■ Function estimation/principle analysis ■ Evaluation (environment setup/automation) ■ Suggestions for improvement ■ Actual design contracting (modifications/new designs) *For more details, please refer to the PDF materials or feel free to contact us.
Inquire About This Product
basic information
【Examples of Achievements (Partial)】 ■Autonomous Navigation System ■Wireless Charger ■Wireless Power Transmission Module ■Water Server Circuit Board ■Multilayer Build Circuit Board ■HV ESC Circuit Board ■Card Reader ■Water Purifier ■Microinverter for PV ■Battery Control Circuit Board *For more details, please refer to the PDF materials or feel free to contact us.
Price range
Delivery Time
※Please feel free to contact us.
Applications/Examples of results
Please feel free to contact us.
catalog（3）
Download All Catalogs![Reverse Engineering Plus [Brochure]](https://image.mono.ipros.com/public/catalog/image/01/1a1/491387/IPROS26516835171666750928.jpeg?w=120&h=170)
![Reverse Engineering Plus [Flyer]](https://image.mono.ipros.com/public/catalog/image/01/66f/442133/IPROS50888694602034225548.jpeg?w=120&h=170)
![Decomposition Investigation Report Sales <USB Charger, Electronic Cigarette> [Flyer]](https://image.mono.ipros.com/public/catalog/image/01/d6d/637747/IPROS31108964540755195385.jpeg?w=120&h=170)
Company information
As a development and design company, we promote the development, design, and evaluation of semiconductor peripheral circuits and application products through simulation technology.
![[Data] Shirutoku Report No. 10 #Metal Enclosure](https://image.mono.ipros.com/public/product/image/98c/2000680739/IPROS68866456469949770610.jpeg?w=280&h=280)
![[Data] Shirutoku Report No. 13 # Characteristic Impedance](https://image.mono.ipros.com/public/product/image/d70/2000684348/IPROS83889589797061925643.jpeg?w=280&h=280)
![[Data] Shirutoku Report No. 18 # Substrate Structure and Package](https://image.mono.ipros.com/public/product/image/8bd/2000686744/IPROS58686476474672545015.jpeg?w=280&h=280)
![[Data] Shirutoku Report No. 24 # Evaluation and Analysis Methods of BGA Packages](https://image.mono.ipros.com/public/product/image/ee2/2000688143/IPROS31247950267528825035.jpeg?w=280&h=280)
