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substrate×ケイツー - List of Manufacturers, Suppliers, Companies and Products

substrate Product List

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Printed circuit board manufacturing - single-sided board

Printed circuit board manufacturing - single-sided board

Standard materials: Galapagos substrate, paper phenol, composite.

We use FR-4 (glass epoxy substrate), FR-1 (paper phenolic), and CEM-3 (composite) as standard materials. We offer a wide range of thicknesses from 0.5mm to 2.0mm to meet our customers' needs. *Other thicknesses can also be accommodated by using double-sided materials. We can ship within the shortest possible working days of 1 day. For more details, please contact us or refer to our catalog.

  • Printed Circuit Board

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Printed circuit board manufacturing double-sided flexible circuit board

Printed circuit board manufacturing double-sided flexible circuit board

The thinnest flexible substrate with a total thickness of 100μ is possible. Halogen-free options are also available.

Like one-sided flex, we have a variety of materials in stock. The thinnest option allows for a total thickness of 100μ for flex PCBs, and of course, we can also accommodate halogen-free requirements. For more details, please contact us or refer to our catalog.

  • Printed Circuit Board

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Printed circuit board manufacturing - build-up boards

Printed circuit board manufacturing - build-up boards

This is a method of forming a build-up layer on top of a core substrate.

The precision of printed circuit boards has advanced, leading to an increased demand for printed wiring boards using the build-up method. The build-up method is a construction technique that forms build-up layers on top of a core substrate. The connection between the core substrate and the build-up layers is made using laser vias. By using this method, it becomes possible to achieve higher density wiring. Currently, we can accommodate up to two-layer builds (two layers of build-up layers above and below). Additionally, we can also handle stack vias and filled vias. We have a track record of manufacturing rigid-flex boards and multilayer flex boards using the build-up method. For more details, please contact us or refer to our catalog.

  • Printed Circuit Board

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Special Printed Circuit Board Manufacturing - Impedance Control Board

Special Printed Circuit Board Manufacturing - Impedance Control Board

Control the pattern width and interlayer thickness to perform impedance control.

Based on our extensive past experience, we control the pattern width and layer thickness to perform impedance control. By using the Polar company's impedance simulation software 'Si8000', we can pre-calculate the impedance values of the completed circuit boards, enabling accurate impedance control. Additionally, we can simulate the layer configuration, line width, and spacing during the pattern design phase, allowing us to propose specifications that facilitate easier impedance control. For measuring the impedance of the completed circuit boards, we use the 'MZPC50' measuring instrument from Microcraft Co., Ltd., and we can provide measurement results (using the TDR method). For more details, please contact us or refer to our catalog.

  • Printed Circuit Board

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Special Printed Circuit Board Manufacturing - Through Hole Resin Filled Board (PAD ON HOLE)

Special Printed Circuit Board Manufacturing - Through Hole Resin Filled Board (PAD ON HOLE)

This is a circuit board with resin embedded in the through holes and pads placed on top.

This is a circuit board designed to secure the mounting space for components by embedding resin in through-holes and providing pads on top. With the trend towards narrower pitches for components such as BGA and CSP, the demand has increased. Resin and metal paste are embedded using vacuum printing. For more details, please contact us or refer to the catalog.

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Printed circuit board manufacturing double-sided through-hole board

Printed circuit board manufacturing double-sided through-hole board

Galaepo substrate and composite are standard. Other special materials such as BT resin are also always in stock.

We standardly use FR-4 (glass epoxy substrate) and CEM-3 (composite), but we also keep special materials such as BT resin in stock. We offer a wide range of thicknesses from 0.06 mm to 3.2 mm. We can ship in as little as 1 business day. For more details, please contact us or refer to our catalog.

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Printed Circuit Board Manufacturing - Multilayer Through-Hole Board

Printed Circuit Board Manufacturing - Multilayer Through-Hole Board

Supports layers from 4 to 24. Also compatible with special substrates such as through-hole resin filling.

We can accommodate from 4 layers to 24 layers. Additionally, we can handle special substrates such as impedance control and through-hole resin filling. We operate three vacuum press machines, allowing for quick turnaround even in mass production. We can ship in as little as 2 working days. For more details, please contact us or refer to our catalog.

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Printed circuit board manufacturing - single-sided flexible board

Printed circuit board manufacturing - single-sided flexible board

By using thin materials, it is possible to create a flexible substrate with a total thickness of 50μ that is the thinnest.

Single-sided flexible printed circuit boards are available in various material thicknesses. By using thin materials, we can achieve flexible printed circuit boards with a total thickness of just 50μ. We can also provide fine pattern substrates using thin copper foil materials, and we can accommodate halogen-free options as well. For more details, please contact us or refer to our catalog.

  • Printed Circuit Board

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Printed circuit board manufacturing - multilayer flexible circuit board

Printed circuit board manufacturing - multilayer flexible circuit board

Manufacturing is possible from 3 layers to 8 layers. Thin materials and thin copper foil are used to ensure bendability.

We can manufacture from 3 layers to 8 layers. Typically, with multilayer flexible circuits, the more layers there are, the thicker the board becomes, which compromises the bendability that is a characteristic of flexible substrates. However, by using thin materials and thin copper foil, we ensure bendability. For more details, please contact us or refer to our catalog.

  • Printed Circuit Board

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Printed Circuit Board Manufacturing - Rigid-Flex Boards

Printed Circuit Board Manufacturing - Rigid-Flex Boards

Production is possible from 2 layers to 8 layers. Prototyping of rigid-flex PCBs is available with short lead times and low prices.

We can produce from 2 to 8 layers. When it comes to rigid-flex PCBs, it often requires creating molds, which can be very expensive even for prototypes, and the production time can be significantly long. At K2 Corporation, we combine our experience as a rigid PCB manufacturer with our experience as a flexible PCB manufacturer to offer quick turnaround and low-cost prototypes of rigid-flex PCBs. We can flexibly accommodate complex shapes and special layer configurations, so please feel free to consult with us. For more details, please contact us or refer to our catalog.

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Special printed circuit board manufacturing IVH boards

Special printed circuit board manufacturing IVH boards

A substrate that connects only the necessary layers without penetrating the holes in a multilayer substrate.

This is a substrate that connects only the necessary layers without penetrating the holes in a multilayer board. As the number of layers in printed circuit boards has increased, the demand for this has also grown. It can be manufactured using either blind via holes that connect the outer layers to the inner layers or inner vias that embed through holes in the inner layers. Additionally, it is compatible not only with standard multilayer boards but also with multilayer flexible boards and rigid-flex boards. For more details, please contact us or refer to the catalog.

  • Printed Circuit Board

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Special printed circuit board manufacturing - thick copper foil substrate (high current substrate)

Special printed circuit board manufacturing - thick copper foil substrate (high current substrate)

By using a special manufacturing method, it is possible to produce substrates with a copper thickness of up to 400μ.

When a standard thickness of 18μ copper foil carries a large current, it can generate high heat and, in some cases, may even break, which is very dangerous. Such substrates can be addressed by increasing the thickness of the copper foil, and K2 Corporation can manufacture substrates with thicknesses ranging from 35μ to 105μ using standard substrate manufacturing methods. Furthermore, by employing special manufacturing techniques, it is possible to produce substrates with a maximum copper foil thickness of 400μ. For more details, please contact us or refer to our catalog.

  • Printed Circuit Board

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